DE69108190T2 - Verfahren zur Orientierung mindestens eines auf einer Leiterplatte aufgesetzten elektronischen Bauelementes. - Google Patents

Verfahren zur Orientierung mindestens eines auf einer Leiterplatte aufgesetzten elektronischen Bauelementes.

Info

Publication number
DE69108190T2
DE69108190T2 DE69108190T DE69108190T DE69108190T2 DE 69108190 T2 DE69108190 T2 DE 69108190T2 DE 69108190 T DE69108190 T DE 69108190T DE 69108190 T DE69108190 T DE 69108190T DE 69108190 T2 DE69108190 T2 DE 69108190T2
Authority
DE
Germany
Prior art keywords
circuit board
printed
electronic component
orienting
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69108190T
Other languages
English (en)
Other versions
DE69108190D1 (de
Inventor
Bernard Boin
Philippe Benard Michel Lebedel
Denis Christian Henri Bellier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moulinex SA
Original Assignee
Moulinex SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moulinex SA filed Critical Moulinex SA
Publication of DE69108190D1 publication Critical patent/DE69108190D1/de
Application granted granted Critical
Publication of DE69108190T2 publication Critical patent/DE69108190T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K10/00—Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE69108190T 1990-12-06 1991-12-02 Verfahren zur Orientierung mindestens eines auf einer Leiterplatte aufgesetzten elektronischen Bauelementes. Expired - Fee Related DE69108190T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9015313A FR2670352B1 (fr) 1990-12-06 1990-12-06 Procede d'orientation d'au moins un composant electronique place sur une carte de circuit imprime.

Publications (2)

Publication Number Publication Date
DE69108190D1 DE69108190D1 (de) 1995-04-20
DE69108190T2 true DE69108190T2 (de) 1995-08-03

Family

ID=9402979

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69108190T Expired - Fee Related DE69108190T2 (de) 1990-12-06 1991-12-02 Verfahren zur Orientierung mindestens eines auf einer Leiterplatte aufgesetzten elektronischen Bauelementes.

Country Status (7)

Country Link
EP (1) EP0489384B1 (de)
KR (1) KR920014386A (de)
AT (1) ATE120069T1 (de)
DE (1) DE69108190T2 (de)
ES (1) ES2071894T3 (de)
FR (1) FR2670352B1 (de)
PT (1) PT99692B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723500B1 (fr) * 1994-08-03 1996-09-20 Sagem Carte electronique de circuit imprime.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061623A (en) * 1979-10-23 1981-05-13 Tektronix Inc Interconnecting conductive paths between a main circuit board and adjacent circuit boards
GB2160366B (en) * 1984-06-15 1987-09-09 Kenton Lab Limited A printed circuit board
FR2626999B1 (fr) * 1988-02-05 1993-08-27 Jaeger Dispositif comprenant un element d'affichage passif transmissif notamment pour montre electronique de vehicule automobile

Also Published As

Publication number Publication date
FR2670352B1 (fr) 1994-04-01
PT99692B (pt) 1999-02-26
DE69108190D1 (de) 1995-04-20
ATE120069T1 (de) 1995-04-15
EP0489384B1 (de) 1995-03-15
PT99692A (pt) 1994-01-31
KR920014386A (ko) 1992-07-30
FR2670352A1 (fr) 1992-06-12
ES2071894T3 (es) 1995-07-01
EP0489384A2 (de) 1992-06-10
EP0489384A3 (en) 1993-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MOULINEX S.A., PARIS, FR

8339 Ceased/non-payment of the annual fee