DE69104859D1 - Epoxidharzzusammensetzungen, enthaltend hochtransparente Kieselsäure-Titandioxid-Glaskugeln. - Google Patents

Epoxidharzzusammensetzungen, enthaltend hochtransparente Kieselsäure-Titandioxid-Glaskugeln.

Info

Publication number
DE69104859D1
DE69104859D1 DE69104859T DE69104859T DE69104859D1 DE 69104859 D1 DE69104859 D1 DE 69104859D1 DE 69104859 T DE69104859 T DE 69104859T DE 69104859 T DE69104859 T DE 69104859T DE 69104859 D1 DE69104859 D1 DE 69104859D1
Authority
DE
Germany
Prior art keywords
epoxy resin
titanium dioxide
compositions containing
resin compositions
highly transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69104859T
Other languages
English (en)
Other versions
DE69104859T2 (de
Inventor
Eiichi Asano
Takaaki Shimizu
Masatoshi Takita
Toshio Shiobara
Koji Futatsumori
Kazuhiro Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2028077A external-priority patent/JPH0692262B2/ja
Priority claimed from JP2807890A external-priority patent/JPH03232730A/ja
Priority claimed from JP2060669A external-priority patent/JPH06104768B2/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69104859D1 publication Critical patent/DE69104859D1/de
Application granted granted Critical
Publication of DE69104859T2 publication Critical patent/DE69104859T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
    • C03C1/006—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels to produce glass through wet route
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Glass Compositions (AREA)
DE69104859T 1990-02-07 1991-02-06 Epoxidharzzusammensetzungen, enthaltend hochtransparente Kieselsäure-Titandioxid-Glaskugeln. Expired - Fee Related DE69104859T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2028077A JPH0692262B2 (ja) 1990-02-07 1990-02-07 高透明性シリカーチタニアガラス粒子及びその製造方法
JP2807890A JPH03232730A (ja) 1990-02-07 1990-02-07 高透明性シリカーチタニアガラス粒子の製造方法
JP2060669A JPH06104768B2 (ja) 1990-03-12 1990-03-12 光透過性エポキシ樹脂組成物及び光半導体装置

Publications (2)

Publication Number Publication Date
DE69104859D1 true DE69104859D1 (de) 1994-12-08
DE69104859T2 DE69104859T2 (de) 1995-04-27

Family

ID=27286068

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104859T Expired - Fee Related DE69104859T2 (de) 1990-02-07 1991-02-06 Epoxidharzzusammensetzungen, enthaltend hochtransparente Kieselsäure-Titandioxid-Glaskugeln.

Country Status (3)

Country Link
US (1) US5175199A (de)
EP (1) EP0441622B1 (de)
DE (1) DE69104859T2 (de)

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KR100643442B1 (ko) * 1996-06-26 2006-11-10 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 발광 변환 소자를 포함하는 발광 반도체 소자
US5747873A (en) * 1996-09-27 1998-05-05 Northrop Grumman Corporation Technique for fabricating hybrid high-temperature superconductor-semiconductor circuits
US6246123B1 (en) * 1998-05-04 2001-06-12 Motorola, Inc. Transparent compound and applications for its use
KR100301707B1 (ko) * 1998-11-26 2001-10-29 오길록 평면형광회로소자접속용고분자광섬유어레이및패키지구조
US6794058B2 (en) * 2000-09-12 2004-09-21 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
JP3835518B2 (ja) 2000-09-13 2006-10-18 信越化学工業株式会社 光透過性エポキシ樹脂組成物及び半導体装置
US6560038B1 (en) * 2001-12-10 2003-05-06 Teledyne Lighting And Display Products, Inc. Light extraction from LEDs with light pipes
US6783740B2 (en) * 2002-09-30 2004-08-31 Northrop Grumman Corporation Sintered glass bead filter with active microbial destruction
US6841888B2 (en) * 2003-06-04 2005-01-11 Yazaki Corporation Encapsulant for opto-electronic devices and method for making it
JP2005089660A (ja) * 2003-09-18 2005-04-07 Nitto Denko Corp 半導体封止用樹脂組成物
US7381359B2 (en) * 2004-10-14 2008-06-03 Yazaki Corporation Method for making filled epoxy resin compositions
US7311972B2 (en) * 2004-10-14 2007-12-25 Yazaki Corporation Filled epoxy resin compositions
TWI432381B (zh) * 2005-12-12 2014-04-01 Grace W R & Co 氧化鋁粒子
JP2009520077A (ja) * 2005-12-15 2009-05-21 キャボット コーポレイション 透明ポリマー複合材料
US7470974B2 (en) * 2006-07-14 2008-12-30 Cabot Corporation Substantially transparent material for use with light-emitting device
US20090007313A1 (en) 2007-06-06 2009-01-08 Higher Dimension Materials, Inc. Cut, abrasion and/or puncture resistant knitted gloves
JP4510066B2 (ja) * 2007-11-06 2010-07-21 日東電工株式会社 配線回路基板の製造方法および検査方法
JP5549568B2 (ja) * 2009-12-15 2014-07-16 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置
EP2629780A4 (de) 2010-10-20 2014-10-01 206 Ortho Inc Implantierbares polymer für knochen- und gefässläsionen
US11058796B2 (en) 2010-10-20 2021-07-13 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants, and novel composite structures which may be used for medical and non-medical applications
US11484627B2 (en) 2010-10-20 2022-11-01 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants, and novel composite structures which may be used for medical and non-medical applications
US10525169B2 (en) 2010-10-20 2020-01-07 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants, and novel composite structures which may be used for medical and non-medical applications
US9320601B2 (en) 2011-10-20 2016-04-26 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants
US11291483B2 (en) 2010-10-20 2022-04-05 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants
US11207109B2 (en) 2010-10-20 2021-12-28 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants, and novel composite structures which may be used for medical and non-medical applications
WO2015095745A1 (en) 2010-10-20 2015-06-25 206 Ortho, Inc. Method and apparatus for treating bone fractures, and/or for fortifying and/or augmenting bone, including the provision and use of composite implants, and novel composite structures which may be used for medical and non-medical applications
US8873919B2 (en) * 2010-12-17 2014-10-28 International Business Machines Corporation Particle filled polymer waveguide
US9048396B2 (en) 2012-06-11 2015-06-02 Cree, Inc. LED package with encapsulant having planar surfaces
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
US10468565B2 (en) 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US8987155B2 (en) 2012-08-30 2015-03-24 Corning Incorporated Niobium doped silica titania glass and method of preparation
EP2999747B1 (de) 2013-05-23 2020-08-12 206 ORTHO, Inc. Vorrichtung zur behandlung von knochenbrüchen und/oder zur stärkung und/oder vermehrung von knochen
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
CN103554910B (zh) * 2013-10-28 2016-08-17 航天特种材料及工艺技术研究所 一种人工介质材料及其制备方法
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
EP3224213B1 (de) 2014-11-26 2022-03-23 Corning Incorporated Glas aus dotiertem kieselsäure-titandioxid mit geringer ausdehnung und verfahren zur herstellung davon
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
EP3281920A1 (de) * 2016-08-12 2018-02-14 D. Swarovski KG Kontinuierliches sol-gel-verfahren zur herstellung von silicathaltigen gläsern oder glaskeramiken
EP3538166B1 (de) * 2016-11-10 2024-06-12 206 Ortho, Inc. Implantate zur behandlung von knochenbrüchen und zur stärkung von knochen
CN110283561B (zh) * 2019-05-30 2021-09-10 天津德高化成科技有限公司 一种led显示屏贴片式分立器件用封装树脂组合物及其用途

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US3171827A (en) * 1960-10-31 1965-03-02 Prismo Safety Corp Reflective granules
JPS6374911A (ja) * 1986-09-19 1988-04-05 Shin Etsu Chem Co Ltd 微細球状シリカの製造法
US4789389A (en) * 1987-05-20 1988-12-06 Corning Glass Works Method for producing ultra-high purity, optical quality, glass articles
FR2617179B1 (fr) * 1987-06-26 1989-11-03 Bitumastic Ste Fse Revetement decoratif colore et resistant a l'usure, a base de resine epoxydique, pour sols et panneaux, et son procede de realisation
US4985751A (en) * 1988-09-13 1991-01-15 Shin-Etsu Chemical Co., Ltd. Resin-encapsulated semiconductor devices
IT1230708B (it) * 1989-02-10 1991-10-29 Enichem Spa Monoliti vetrosi costituiti da ossido di silicio e ossido di titanio e procedimento per la loro preparazione.

Also Published As

Publication number Publication date
US5175199A (en) 1992-12-29
EP0441622A1 (de) 1991-08-14
DE69104859T2 (de) 1995-04-27
EP0441622B1 (de) 1994-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee