DE69029561T2 - Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren - Google Patents

Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren

Info

Publication number
DE69029561T2
DE69029561T2 DE69029561T DE69029561T DE69029561T2 DE 69029561 T2 DE69029561 T2 DE 69029561T2 DE 69029561 T DE69029561 T DE 69029561T DE 69029561 T DE69029561 T DE 69029561T DE 69029561 T2 DE69029561 T2 DE 69029561T2
Authority
DE
Germany
Prior art keywords
high speed
inspection device
optical inspection
speed optical
automatic high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69029561T
Other languages
English (en)
Other versions
DE69029561D1 (de
Inventor
Curt H Chadwick
Robert H Sholes
John D Greene
Francis D Tucker
Michael E Fein
P C Jann
David J Harvey
William Bell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Instruments Corp filed Critical KLA Instruments Corp
Application granted granted Critical
Publication of DE69029561D1 publication Critical patent/DE69029561D1/de
Publication of DE69029561T2 publication Critical patent/DE69029561T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06126—Large diffuse sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/08—Optical fibres; light guides
    • G01N2201/0826—Fibre array at source, distributing
DE69029561T 1989-10-31 1990-10-31 Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren Expired - Fee Related DE69029561T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/429,963 US5085517A (en) 1989-10-31 1989-10-31 Automatic high speed optical inspection system

Publications (2)

Publication Number Publication Date
DE69029561D1 DE69029561D1 (de) 1997-02-13
DE69029561T2 true DE69029561T2 (de) 1997-05-28

Family

ID=23705478

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69029561T Expired - Fee Related DE69029561T2 (de) 1989-10-31 1990-10-31 Automatische mit hoher Geschwindigkeit arbeitende optische Prüfungsvorrichtung und Verfahren

Country Status (5)

Country Link
US (1) US5085517A (de)
EP (1) EP0426182B1 (de)
JP (2) JP3249509B2 (de)
DE (1) DE69029561T2 (de)
IL (1) IL96011A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015101252A1 (de) * 2015-01-28 2016-07-28 Chromasens Gmbh Beleuchtungsvorrichtung, optisches Analysesystem sowie Verfahren zum Abtasten einer Oberfläche

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US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
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AT402861B (de) * 1994-03-28 1997-09-25 Oesterr Forsch Seibersdorf Verfahren und anordnung zum erkennen bzw. zur kontrolle von flächenstrukturen bzw. der oberflächenbeschaffenheit
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5774222A (en) * 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
US6172363B1 (en) 1996-03-05 2001-01-09 Hitachi, Ltd. Method and apparatus for inspecting integrated circuit pattern
DE19612939C2 (de) * 1996-04-01 1998-10-29 Jenoptik Jena Gmbh Verfahren und Einrichtung zur Auswahl von Meßgebieten bei der Vermessung von Strukturbreiten und Überdeckungsgenauigkeiten in Herstellungsprozessen für integrierte Schaltkreise
AU3376597A (en) * 1996-06-04 1998-01-05 Tencor Instruments Optical scanning system for surface inspection
DE19707225A1 (de) * 1997-02-24 1998-08-27 Bodenseewerk Perkin Elmer Co Lichtabtastvorrichtung
US6381365B2 (en) * 1997-08-22 2002-04-30 Minolta Co., Ltd. Image data processing apparatus and image data processing method
JP3152203B2 (ja) * 1998-05-27 2001-04-03 株式会社東京精密 外観検査装置
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
CN1188693C (zh) * 1998-08-18 2005-02-09 奥宝科技有限公司 利用颜色检查印刷电路板
US6476913B1 (en) 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US6304826B1 (en) * 1999-02-05 2001-10-16 Syscan, Inc. Self-calibration method and circuit architecture of image sensor
JP2000314710A (ja) 1999-04-28 2000-11-14 Hitachi Ltd 回路パターンの検査方法及び検査装置
IL131284A (en) 1999-08-05 2003-05-29 Orbotech Ltd Illumination for inspecting surfaces of articles
JP4312910B2 (ja) * 1999-12-02 2009-08-12 株式会社日立製作所 レビューｓｅｍ
US6603542B1 (en) 2000-06-14 2003-08-05 Qc Optics, Inc. High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
US6864498B2 (en) * 2001-05-11 2005-03-08 Orbotech Ltd. Optical inspection system employing a staring array scanner
WO2003021242A1 (en) * 2001-09-03 2003-03-13 Millennium Venture Holdings Ltd. Method and apparatus for inspecting the surface of workpieces
US6834855B2 (en) * 2001-10-09 2004-12-28 Edward J. Mancuso Dice scanner
JP4805534B2 (ja) * 2003-12-24 2011-11-02 ダックエンジニアリング株式会社 ワーク検査装置
JPWO2005119227A1 (ja) * 2004-06-04 2008-04-03 株式会社東京精密 半導体外観検査装置及び照明方法
JP2006053405A (ja) * 2004-08-13 2006-02-23 Sharp Corp アレイ基板の製造方法及びそれを用いた液晶表示装置の製造方法
US7394070B2 (en) 2004-12-27 2008-07-01 Hitachi High-Technologies Corporation Method and apparatus for inspecting patterns
US20060171593A1 (en) 2005-02-01 2006-08-03 Hitachi High-Technologies Corporation Inspection apparatus for inspecting patterns of a substrate
WO2007030731A2 (en) * 2005-09-07 2007-03-15 Nr Laboratories, Llc Positional sensing system and method
JP4685599B2 (ja) * 2005-11-11 2011-05-18 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
DE102006054088A1 (de) * 2006-11-16 2008-05-21 Siemens Ag Messvorrichtung und Messverfahren zum Inspizieren einer Oberfläche eines Substrates
US8106355B1 (en) * 2008-06-27 2012-01-31 Kla-Tencor Corporation Automated inspection using cell-cell subtraction perpendicular to stage motion direction
JP5297930B2 (ja) * 2009-07-29 2013-09-25 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
KR101642897B1 (ko) * 2011-07-13 2016-07-26 주식회사 고영테크놀러지 검사방법
US9262443B2 (en) * 2013-05-15 2016-02-16 Canon Kabushiki Kaisha Classifying materials using texture
TWI491871B (zh) * 2013-07-05 2015-07-11 Machvision Inc 用於光學檢測的照明系統及使用其之檢測系統、檢測方法
JP6215009B2 (ja) 2013-11-15 2017-10-18 株式会社東芝 撮像装置及び撮像方法
WO2015161388A1 (en) * 2014-04-24 2015-10-29 Orell Füssli Sicherheitsdruck Ag Security device for security document
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
KR101736060B1 (ko) * 2016-06-30 2017-05-16 주식회사 고영테크놀러지 검사방법
CN110779486B (zh) * 2019-11-05 2022-01-07 中铁十一局集团电务工程有限公司 一种用于电缆导体检测的误差修正方法及系统

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015101252A1 (de) * 2015-01-28 2016-07-28 Chromasens Gmbh Beleuchtungsvorrichtung, optisches Analysesystem sowie Verfahren zum Abtasten einer Oberfläche
DE102015101252B4 (de) 2015-01-28 2023-10-19 Chromasens Gmbh Beleuchtungsvorrichtung, optisches Analysesystem sowie Verfahren zum Abtasten einer Oberfläche

Also Published As

Publication number Publication date
JP2002174514A (ja) 2002-06-21
EP0426182A3 (en) 1992-01-08
US5085517A (en) 1992-02-04
JPH03167456A (ja) 1991-07-19
IL96011A0 (en) 1991-07-18
EP0426182A2 (de) 1991-05-08
IL96011A (en) 1993-07-08
EP0426182B1 (de) 1997-01-02
JP3249509B2 (ja) 2002-01-21
DE69029561D1 (de) 1997-02-13

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee