IL96011A - Automatic high speed optical inspection system - Google Patents

Automatic high speed optical inspection system

Info

Publication number
IL96011A
IL96011A IL96011A IL9601190A IL96011A IL 96011 A IL96011 A IL 96011A IL 96011 A IL96011 A IL 96011A IL 9601190 A IL9601190 A IL 9601190A IL 96011 A IL96011 A IL 96011A
Authority
IL
Israel
Prior art keywords
high speed
inspection system
optical inspection
speed optical
automatic high
Prior art date
Application number
IL96011A
Other languages
English (en)
Other versions
IL96011A0 (en
Original Assignee
Kla Instr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Instr Corp filed Critical Kla Instr Corp
Publication of IL96011A0 publication Critical patent/IL96011A0/xx
Publication of IL96011A publication Critical patent/IL96011A/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06126—Large diffuse sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/08—Optical fibres; light guides
    • G01N2201/0826—Fibre array at source, distributing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
IL96011A 1989-10-31 1990-10-15 Automatic high speed optical inspection system IL96011A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/429,963 US5085517A (en) 1989-10-31 1989-10-31 Automatic high speed optical inspection system

Publications (2)

Publication Number Publication Date
IL96011A0 IL96011A0 (en) 1991-07-18
IL96011A true IL96011A (en) 1993-07-08

Family

ID=23705478

Family Applications (1)

Application Number Title Priority Date Filing Date
IL96011A IL96011A (en) 1989-10-31 1990-10-15 Automatic high speed optical inspection system

Country Status (5)

Country Link
US (1) US5085517A (de)
EP (1) EP0426182B1 (de)
JP (2) JP3249509B2 (de)
DE (1) DE69029561T2 (de)
IL (1) IL96011A (de)

Families Citing this family (47)

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US5600734A (en) * 1991-10-04 1997-02-04 Fujitsu Limited Electron beam tester
EP0519255A3 (en) * 1991-05-31 1993-07-21 Fuji Photo Film Co., Ltd. Defect inspection system and inspection process
US5825945A (en) * 1992-05-15 1998-10-20 Unisys Corp Document imaging with illumination from lambertian surfaces
US5459577A (en) * 1992-06-01 1995-10-17 Nikon Corporation Method of and apparatus for measuring pattern positions
EP0767361B1 (de) * 1993-07-22 2000-02-23 Applied Spectral Imaging Ltd. Verfahren und Vorrichtung zur Spektralen Bilderfassung
US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
DE4410603C1 (de) * 1994-03-26 1995-06-14 Jenoptik Technologie Gmbh Verfahren zur Erkennung von Fehlern bei der Inspektion von strukturierten Oberflächen
AT402861B (de) * 1994-03-28 1997-09-25 Oesterr Forsch Seibersdorf Verfahren und anordnung zum erkennen bzw. zur kontrolle von flächenstrukturen bzw. der oberflächenbeschaffenheit
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
KR960015001A (ko) * 1994-10-07 1996-05-22 가나이 쓰토무 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
US6172363B1 (en) 1996-03-05 2001-01-09 Hitachi, Ltd. Method and apparatus for inspecting integrated circuit pattern
DE19612939C2 (de) * 1996-04-01 1998-10-29 Jenoptik Jena Gmbh Verfahren und Einrichtung zur Auswahl von Meßgebieten bei der Vermessung von Strukturbreiten und Überdeckungsgenauigkeiten in Herstellungsprozessen für integrierte Schaltkreise
JP4306800B2 (ja) * 1996-06-04 2009-08-05 ケーエルエー−テンカー テクノロジィース コーポレイション 表面検査用光学走査システム
DE19707225A1 (de) * 1997-02-24 1998-08-27 Bodenseewerk Perkin Elmer Co Lichtabtastvorrichtung
US6381365B2 (en) * 1997-08-22 2002-04-30 Minolta Co., Ltd. Image data processing apparatus and image data processing method
JP3152203B2 (ja) * 1998-05-27 2001-04-03 株式会社東京精密 外観検査装置
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
WO2000011454A1 (en) * 1998-08-18 2000-03-02 Orbotech Ltd. Inspection of printed circuit boards using color
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US6304826B1 (en) * 1999-02-05 2001-10-16 Syscan, Inc. Self-calibration method and circuit architecture of image sensor
JP2000314710A (ja) 1999-04-28 2000-11-14 Hitachi Ltd 回路パターンの検査方法及び検査装置
IL131284A (en) 1999-08-05 2003-05-29 Orbotech Ltd Illumination for inspecting surfaces of articles
JP4312910B2 (ja) * 1999-12-02 2009-08-12 株式会社日立製作所 レビューｓｅｍ
US6603542B1 (en) 2000-06-14 2003-08-05 Qc Optics, Inc. High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
US6864498B2 (en) * 2001-05-11 2005-03-08 Orbotech Ltd. Optical inspection system employing a staring array scanner
GB2384852A (en) * 2001-09-03 2003-08-06 Millennium Venture Holdings Lt Workpiece inspection apparatus
US6834855B2 (en) * 2001-10-09 2004-12-28 Edward J. Mancuso Dice scanner
JP4805534B2 (ja) * 2003-12-24 2011-11-02 ダックエンジニアリング株式会社 ワーク検査装置
US20080024794A1 (en) * 2004-06-04 2008-01-31 Yoko Miyazaki Semiconductor Surface Inspection Apparatus and Method of Illumination
JP2006053405A (ja) * 2004-08-13 2006-02-23 Sharp Corp アレイ基板の製造方法及びそれを用いた液晶表示装置の製造方法
US7394070B2 (en) 2004-12-27 2008-07-01 Hitachi High-Technologies Corporation Method and apparatus for inspecting patterns
US20060171593A1 (en) 2005-02-01 2006-08-03 Hitachi High-Technologies Corporation Inspection apparatus for inspecting patterns of a substrate
WO2007030731A2 (en) * 2005-09-07 2007-03-15 Nr Laboratories, Llc Positional sensing system and method
JP4685599B2 (ja) * 2005-11-11 2011-05-18 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
DE102006054088A1 (de) * 2006-11-16 2008-05-21 Siemens Ag Messvorrichtung und Messverfahren zum Inspizieren einer Oberfläche eines Substrates
US8106355B1 (en) * 2008-06-27 2012-01-31 Kla-Tencor Corporation Automated inspection using cell-cell subtraction perpendicular to stage motion direction
JP5297930B2 (ja) * 2009-07-29 2013-09-25 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
KR101642897B1 (ko) 2011-07-13 2016-07-26 주식회사 고영테크놀러지 검사방법
US9262443B2 (en) * 2013-05-15 2016-02-16 Canon Kabushiki Kaisha Classifying materials using texture
TWI491871B (zh) * 2013-07-05 2015-07-11 Machvision Inc 用於光學檢測的照明系統及使用其之檢測系統、檢測方法
JP6215009B2 (ja) * 2013-11-15 2017-10-18 株式会社東芝 撮像装置及び撮像方法
US9870669B2 (en) * 2014-04-24 2018-01-16 Orell Füssli Sicherheitsdruck Ag Security device for security document
DE102015101252B4 (de) * 2015-01-28 2023-10-19 Chromasens Gmbh Beleuchtungsvorrichtung, optisches Analysesystem sowie Verfahren zum Abtasten einer Oberfläche
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
KR101736060B1 (ko) * 2016-06-30 2017-05-16 주식회사 고영테크놀러지 검사방법
CN110779486B (zh) * 2019-11-05 2022-01-07 中铁十一局集团电务工程有限公司 一种用于电缆导体检测的误差修正方法及系统

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US3963354A (en) * 1975-05-05 1976-06-15 Bell Telephone Laboratories, Incorporated Inspection of masks and wafers by image dissection
JPS6017044B2 (ja) * 1979-07-23 1985-04-30 株式会社日立製作所 印刷配線板のパタ−ン検査装置
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DE3422395A1 (de) * 1983-06-16 1985-01-17 Hitachi, Ltd., Tokio/Tokyo Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern
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JPS60263807A (ja) * 1984-06-12 1985-12-27 Dainippon Screen Mfg Co Ltd プリント配線板のパタ−ン欠陥検査装置
JPS61213612A (ja) * 1985-03-19 1986-09-22 Hitachi Ltd プリント基板のパタ−ン検査装置
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Also Published As

Publication number Publication date
JP2002174514A (ja) 2002-06-21
JPH03167456A (ja) 1991-07-19
EP0426182A2 (de) 1991-05-08
US5085517A (en) 1992-02-04
IL96011A0 (en) 1991-07-18
DE69029561T2 (de) 1997-05-28
JP3249509B2 (ja) 2002-01-21
EP0426182B1 (de) 1997-01-02
EP0426182A3 (en) 1992-01-08
DE69029561D1 (de) 1997-02-13

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