DE69026131D1 - Isolierte metallische Substrate und Verfahren zur Herstellung dieser Substrate - Google Patents

Isolierte metallische Substrate und Verfahren zur Herstellung dieser Substrate

Info

Publication number
DE69026131D1
DE69026131D1 DE69026131T DE69026131T DE69026131D1 DE 69026131 D1 DE69026131 D1 DE 69026131D1 DE 69026131 T DE69026131 T DE 69026131T DE 69026131 T DE69026131 T DE 69026131T DE 69026131 D1 DE69026131 D1 DE 69026131D1
Authority
DE
Germany
Prior art keywords
substrates
making
methods
insulated metallic
metallic substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69026131T
Other languages
English (en)
Other versions
DE69026131T2 (de
Inventor
Jacques Rabiet
Philippe Gimenez
Remi Guillou
Claude Drapier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Traitement des Metaux et Alliages (Satma)
Original Assignee
Traitement des Metaux et Alliages (Satma)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Traitement des Metaux et Alliages (Satma) filed Critical Traitement des Metaux et Alliages (Satma)
Publication of DE69026131D1 publication Critical patent/DE69026131D1/de
Application granted granted Critical
Publication of DE69026131T2 publication Critical patent/DE69026131T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/12—Anodising more than once, e.g. in different baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69026131T 1989-04-24 1990-04-23 Isolierte metallische Substrate und Verfahren zur Herstellung dieser Substrate Expired - Fee Related DE69026131T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8906136A FR2646311B1 (fr) 1989-04-24 1989-04-24 Substrats metalliques isoles et procede de fabrication desdits substrats

Publications (2)

Publication Number Publication Date
DE69026131D1 true DE69026131D1 (de) 1996-05-02
DE69026131T2 DE69026131T2 (de) 1996-08-14

Family

ID=9381542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026131T Expired - Fee Related DE69026131T2 (de) 1989-04-24 1990-04-23 Isolierte metallische Substrate und Verfahren zur Herstellung dieser Substrate

Country Status (6)

Country Link
US (1) US5112668A (de)
EP (1) EP0395544B1 (de)
JP (1) JPH0318088A (de)
CA (1) CA2015118A1 (de)
DE (1) DE69026131T2 (de)
FR (1) FR2646311B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL120866A0 (en) * 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
IL127256A (en) 1998-11-25 2002-09-12 Micro Components Ltd A device for packaging electronic components, a process for its manufacture and a pin device used in the process
US6322712B1 (en) 1999-09-01 2001-11-27 Micron Technology, Inc. Buffer layer in flat panel display
JP4808374B2 (ja) * 2003-11-13 2011-11-02 富士通株式会社 金属成形品の表面処理方法
WO2006046221A2 (en) * 2004-10-29 2006-05-04 Peter O'brien An illuminator and manufacturing method
US20100307800A1 (en) * 2006-02-10 2010-12-09 Opulent Electronics International Pte Ltd Anodised Aluminum, Dielectric, and Method
US20080166482A1 (en) * 2007-01-08 2008-07-10 Frye Robert D Decorated Aluminum Surfaces and Methods of Producing Decorated Aluminum Surfaces
DE102007017532A1 (de) * 2007-04-13 2008-10-23 Continental Automotive Gmbh Verfahren zur Herstellung einer Leiterbahnstruktur auf einer metallischen Bodenplatte
ATE516692T1 (de) 2008-03-14 2011-07-15 Asetronics Ag Isoliertes metallsubstrat mit einem metallenen implantat
WO2012085849A2 (en) * 2010-12-23 2012-06-28 Aluart Ip Pty Limited Process and apparatus for manufacturing of an etched metal substrate
CN116113139B (zh) * 2022-11-25 2024-07-16 东莞市皓龙激光科技有限公司 一种高导热铝基线路板及其制备工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2578400A (en) * 1947-03-29 1951-12-11 Charles C Cohn Method for providing oxide coating on aluminum and its alloys
NL293033A (de) * 1962-05-21
NL6412706A (de) * 1964-11-02 1966-05-03
JPS58202590A (ja) * 1982-05-21 1983-11-25 イビデン株式会社 プリント配線用基板の製造方法
DE3626232A1 (de) * 1986-08-02 1988-03-10 Akyuerek Susanne Verfahren zur herstellung einer leiterplatte
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels

Also Published As

Publication number Publication date
FR2646311A1 (fr) 1990-10-26
EP0395544B1 (de) 1996-03-27
EP0395544A1 (de) 1990-10-31
JPH0318088A (ja) 1991-01-25
CA2015118A1 (fr) 1990-10-24
US5112668A (en) 1992-05-12
DE69026131T2 (de) 1996-08-14
FR2646311B1 (fr) 1994-04-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee