DE69018220D1 - Verbindungswerkzeug. - Google Patents

Verbindungswerkzeug.

Info

Publication number
DE69018220D1
DE69018220D1 DE69018220T DE69018220T DE69018220D1 DE 69018220 D1 DE69018220 D1 DE 69018220D1 DE 69018220 T DE69018220 T DE 69018220T DE 69018220 T DE69018220 T DE 69018220T DE 69018220 D1 DE69018220 D1 DE 69018220D1
Authority
DE
Germany
Prior art keywords
connecting tool
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69018220T
Other languages
English (en)
Other versions
DE69018220T2 (de
Inventor
Tsutomu Nakamura
Katsuyuki Tanaka
Tetsuo Nakai
Takahiro Imai
Akihiko Ikegaya
Naoji Fujimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1332328A external-priority patent/JP2523195B2/ja
Priority claimed from JP2129924A external-priority patent/JP2520971B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69018220D1 publication Critical patent/DE69018220D1/de
Publication of DE69018220T2 publication Critical patent/DE69018220T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5001—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with carbon or carbonisable materials
    • C04B41/5002—Diamond
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Ceramic Products (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
DE69018220T 1989-12-20 1990-08-23 Verbindungswerkzeug. Expired - Fee Related DE69018220T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1332328A JP2523195B2 (ja) 1989-12-20 1989-12-20 ボンディングツ―ル
JP2129924A JP2520971B2 (ja) 1990-05-18 1990-05-18 ボンディングツ―ル

Publications (2)

Publication Number Publication Date
DE69018220D1 true DE69018220D1 (de) 1995-05-04
DE69018220T2 DE69018220T2 (de) 1995-07-27

Family

ID=26465182

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69018220T Expired - Fee Related DE69018220T2 (de) 1989-12-20 1990-08-23 Verbindungswerkzeug.

Country Status (5)

Country Link
US (1) US5197651A (de)
EP (1) EP0435423B1 (de)
KR (1) KR100210900B1 (de)
CA (1) CA2023933C (de)
DE (1) DE69018220T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication
US5359170A (en) * 1992-02-18 1994-10-25 At&T Global Information Solutions Company Apparatus for bonding external leads of an integrated circuit
US5370299A (en) * 1992-04-23 1994-12-06 Sumitomo Electric Industries, Ltd. Bonding tool having diamond head and method of manufacturing the same
US5425491A (en) * 1992-07-01 1995-06-20 Sumitomo Electric Industries, Ltd. Bonding tool, production and handling thereof
US5373731A (en) * 1992-07-01 1994-12-20 Sumitomo Electric Industries, Ltd. Bonding tool, production and handling thereof
JPH06267846A (ja) * 1993-03-10 1994-09-22 Canon Inc ダイヤモンド電子装置およびその製造法
JPH06263595A (ja) * 1993-03-10 1994-09-20 Canon Inc ダイヤモンド被覆部材及びその製造方法
GB2287897B (en) * 1994-03-31 1996-10-09 Sumitomo Electric Industries A high strength bonding tool and a process for the production of the same
US7465219B2 (en) * 1994-08-12 2008-12-16 Diamicron, Inc. Brut polishing of superhard materials
WO1997045867A1 (fr) * 1996-05-27 1997-12-04 Sumitomo Electric Industries, Ltd. Puce utilisee comme un outil, organe de fixation pourvu d'une telle puce et procede de commande de cet organe
JP3099942B2 (ja) * 1996-08-08 2000-10-16 株式会社アルテクス 超音波振動接合用共振器
FR2755129B1 (fr) * 1996-10-31 1998-11-27 Alsthom Cge Alcatel Procede de liaison d'un substrat de diamant a au moins un substrat metallique
US7032802B2 (en) 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7124927B2 (en) 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
WO2003040420A1 (en) * 2001-11-09 2003-05-15 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
US7185420B2 (en) * 2002-06-07 2007-03-06 Intel Corporation Apparatus for thermally coupling a heat dissipation device to a microelectronic device
US6840424B2 (en) * 2002-10-08 2005-01-11 Chien-Min Sung Compression bonding tools and associated bonding methods
US20050249978A1 (en) 2004-04-02 2005-11-10 Xian Yao Gradient polycrystalline cubic boron nitride materials and tools incorporating such materials
DE102004044942A1 (de) * 2004-09-16 2006-03-30 Esk Ceramics Gmbh & Co. Kg Verfahren zum verformungsarmen Diffusionsschweißen von keramischen Komponenten
JP5704994B2 (ja) * 2011-03-31 2015-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体接合装置
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element
SG2014013072A (en) * 2012-03-19 2014-06-27 Ev Group E Thallner Gmbh Pressure transfer disk for transfer of a bonding pressure
KR102211524B1 (ko) * 2014-08-11 2021-02-02 삼성에스디아이 주식회사 초음파 용접 장치, 이를 이용한 이차 전지 제조 방법 및 그 이차 전지
CN111570964A (zh) * 2020-06-11 2020-08-25 东莞市卡萨帝电子科技有限公司 自动焊锡送锡系统
KR20220137536A (ko) 2021-04-02 2022-10-12 일진다이아몬드(주) 초경 몸체에 일체화 된 다결정 다이아몬드 팁을 구비하는 고평탄 본딩 공구

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1426873A (en) * 1972-05-03 1976-03-03 Mullard Ltd Methods of pressure bonding a ceramic member to another member
US3940050A (en) * 1973-02-16 1976-02-24 E. I. Du Pont De Nemours And Company Method of joining diamond to metal
US3911246A (en) * 1974-01-17 1975-10-07 Jr John H Drinkard Electrode assembly for a resistance soldering unit
SE7508730L (sv) * 1974-08-02 1976-02-03 Inst Materialovedenia Akademii Forfarande for sammanlodning av metaller med extremt harda material, foretredesvis syntetiska material, samt lodemedel for genomforande av forfarandet
US3943323A (en) * 1974-08-23 1976-03-09 The Bendix Corporation Bonding apparatus
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
US4689276A (en) * 1983-03-15 1987-08-25 Varian Associates Diamond bonded electronic circuit
US4560853A (en) * 1984-01-12 1985-12-24 Rca Corporation Positioning and bonding a diamond to a stylus shank
US4605343A (en) * 1984-09-20 1986-08-12 General Electric Company Sintered polycrystalline diamond compact construction with integral heat sink
DE3538261A1 (de) * 1985-10-28 1987-04-30 Battelle Institut E V Gegeneinander abdichtende ventilelemente fuer mischarmaturen
US4767050A (en) * 1986-03-24 1988-08-30 General Electric Company Pocketed stud for polycrystalline diamond cutting blanks and method of making same
US4900628A (en) * 1986-07-23 1990-02-13 Sumitomo Electric Industries, Ltd. Gaseous phase synthesized diamond and method for synthesizing same
JPH02504487A (ja) * 1987-08-17 1990-12-20 シーメンス、アクチエンゲゼルシヤフト 超音波溶接用工具装置
JPH01153228A (ja) * 1987-12-10 1989-06-15 Asahi Daiyamondo Kogyo Kk 気相合成ダイヤモンド工具の製造法
IE62784B1 (en) * 1988-08-04 1995-02-22 De Beers Ind Diamond Thermally stable diamond abrasive compact body
JPH02106210A (ja) * 1988-10-14 1990-04-18 Sumitomo Electric Ind Ltd ねじれ刃多結晶ダイヤモンド工具及びその製造方法
JPH0349834A (ja) * 1989-07-14 1991-03-04 Sumitomo Electric Ind Ltd 金を接合材とする工具及びその製造方法

Also Published As

Publication number Publication date
CA2023933A1 (en) 1991-06-21
DE69018220T2 (de) 1995-07-27
CA2023933C (en) 1993-11-09
KR100210900B1 (ko) 1999-07-15
EP0435423A3 (en) 1992-09-02
KR910013497A (ko) 1991-08-08
EP0435423B1 (de) 1995-03-29
EP0435423A2 (de) 1991-07-03
US5197651A (en) 1993-03-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee