DE69017874T2 - EPROM-Anordnung mit metallenen Source-Anschlüssen und ihre Herstellung. - Google Patents

EPROM-Anordnung mit metallenen Source-Anschlüssen und ihre Herstellung.

Info

Publication number
DE69017874T2
DE69017874T2 DE69017874T DE69017874T DE69017874T2 DE 69017874 T2 DE69017874 T2 DE 69017874T2 DE 69017874 T DE69017874 T DE 69017874T DE 69017874 T DE69017874 T DE 69017874T DE 69017874 T2 DE69017874 T2 DE 69017874T2
Authority
DE
Germany
Prior art keywords
manufacture
metal source
source connections
eprom
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69017874T
Other languages
English (en)
Other versions
DE69017874D1 (de
Inventor
Pier Luigi Crotti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Thomson Microelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SRL filed Critical SGS Thomson Microelectronics SRL
Application granted granted Critical
Publication of DE69017874D1 publication Critical patent/DE69017874D1/de
Publication of DE69017874T2 publication Critical patent/DE69017874T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
DE69017874T 1989-12-22 1990-12-14 EPROM-Anordnung mit metallenen Source-Anschlüssen und ihre Herstellung. Expired - Fee Related DE69017874T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT08365189A IT1236601B (it) 1989-12-22 1989-12-22 Dispositivo a semiconduttore integrato di tipo eprom con connessioni metalliche di source e procedimento per la sua fabbricazione.

Publications (2)

Publication Number Publication Date
DE69017874D1 DE69017874D1 (de) 1995-04-20
DE69017874T2 true DE69017874T2 (de) 1995-07-06

Family

ID=11323646

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69017874T Expired - Fee Related DE69017874T2 (de) 1989-12-22 1990-12-14 EPROM-Anordnung mit metallenen Source-Anschlüssen und ihre Herstellung.

Country Status (5)

Country Link
US (2) US5210046A (de)
EP (1) EP0436475B1 (de)
JP (1) JP3072130B2 (de)
DE (1) DE69017874T2 (de)
IT (1) IT1236601B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1243303B (it) * 1990-07-24 1994-05-26 Sgs Thomson Microelectronics Schieramento di celle di memoria con linee metalliche di connessione di source e di drain formate sul substrato ed ortogonalmente sovrastate da linee di connessione di gate e procedimento per la sua fabbricazione
US5488006A (en) * 1990-09-20 1996-01-30 Mitsubishi Denki Kabushiki Kaisha One-chip microcomputer manufacturing method
DE4031397C2 (de) * 1990-10-04 2000-11-23 Mitsubishi Electric Corp Herstellungsverfahren für einen Einchipmikrocomputer
IT1247654B (it) * 1990-11-16 1994-12-28 Sgs Thomson Microelectronics Memoria flash eprom cancellabile per gruppi di celle mediante doppia mmetal
US5289423A (en) * 1990-11-16 1994-02-22 Sgs-Thomson Microelectronics S.R.L. Bank erasable, flash-EPROM memory
US5286672A (en) * 1991-06-28 1994-02-15 Sgs-Thomson Microelectronics, Inc. Method for forming field oxide regions
EP0528690B1 (de) * 1991-08-21 1998-07-15 STMicroelectronics, Inc. Kontaktausrichtung für Festwertspeicher
EP0573728B1 (de) * 1992-06-01 1996-01-03 STMicroelectronics S.r.l. Verfahren zur Herstellung hochintegrierter kontaktloser EPROM's
KR100277267B1 (ko) * 1992-11-25 2001-02-01 사와무라 시코 반도체 불휘발성 메모리 및 그 제조방법
TW299475B (de) * 1993-03-30 1997-03-01 Siemens Ag
US5635415A (en) * 1994-11-30 1997-06-03 United Microelectronics Corporation Method of manufacturing buried bit line flash EEPROM memory cell
TW326553B (en) * 1996-01-22 1998-02-11 Handotai Energy Kenkyusho Kk Semiconductor device and method of fabricating same
US6306727B1 (en) * 1997-08-18 2001-10-23 Micron Technology, Inc. Advanced isolation process for large memory arrays
US6373095B1 (en) 1998-02-25 2002-04-16 International Business Machines Corporation NVRAM cell having increased coupling ratio between a control gate and floating gate without an increase in cell area
US6215145B1 (en) * 1998-04-06 2001-04-10 Micron Technology, Inc. Dense SOI flash memory array structure
US6381166B1 (en) * 1998-09-28 2002-04-30 Texas Instruments Incorporated Semiconductor memory device having variable pitch array
KR100346598B1 (ko) * 1999-10-07 2002-07-26 동부전자 주식회사 반도체 디바이스의 메모리 셀 제조 방법
US7518182B2 (en) 2004-07-20 2009-04-14 Micron Technology, Inc. DRAM layout with vertical FETs and method of formation
US7247570B2 (en) 2004-08-19 2007-07-24 Micron Technology, Inc. Silicon pillars for vertical transistors
US7285812B2 (en) 2004-09-02 2007-10-23 Micron Technology, Inc. Vertical transistors
US7199419B2 (en) * 2004-12-13 2007-04-03 Micron Technology, Inc. Memory structure for reduced floating body effect
US7229895B2 (en) * 2005-01-14 2007-06-12 Micron Technology, Inc Memory array buried digit line
US7371627B1 (en) 2005-05-13 2008-05-13 Micron Technology, Inc. Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
US7120046B1 (en) 2005-05-13 2006-10-10 Micron Technology, Inc. Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines
US7888721B2 (en) 2005-07-06 2011-02-15 Micron Technology, Inc. Surround gate access transistors with grown ultra-thin bodies
US7768051B2 (en) 2005-07-25 2010-08-03 Micron Technology, Inc. DRAM including a vertical surround gate transistor
US7696567B2 (en) 2005-08-31 2010-04-13 Micron Technology, Inc Semiconductor memory device
US7859026B2 (en) * 2006-03-16 2010-12-28 Spansion Llc Vertical semiconductor device
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
US9401363B2 (en) 2011-08-23 2016-07-26 Micron Technology, Inc. Vertical transistor devices, memory arrays, and methods of forming vertical transistor devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4373248A (en) * 1978-07-12 1983-02-15 Texas Instruments Incorporated Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like
US4377818A (en) * 1978-11-02 1983-03-22 Texas Instruments Incorporated High density electrically programmable ROM
JPS6130063A (ja) * 1984-07-23 1986-02-12 Nec Corp 不揮発性半導体記憶装置
IT1213241B (it) * 1984-11-07 1989-12-14 Ates Componenti Elettron Matrice di memoria eprom con celle elementari simmetriche mos e suo metodo di scrittura.
US4698787A (en) * 1984-11-21 1987-10-06 Exel Microelectronics, Inc. Single transistor electrically programmable memory device and method
US4783766A (en) * 1986-05-30 1988-11-08 Seeq Technology, Inc. Block electrically erasable EEPROM
FR2603128B1 (fr) * 1986-08-21 1988-11-10 Commissariat Energie Atomique Cellule de memoire eprom et son procede de fabrication
IT1227989B (it) * 1988-12-05 1991-05-20 Sgs Thomson Microelectronics Matrice di celle di memoria eprom con struttura a tovaglia con migliorato rapporto capacitivo e processo per la sua fabbricazione
IT1235690B (it) * 1989-04-07 1992-09-21 Sgs Thomson Microelectronics Procedimento di fabbricazione per una matrice di celle eprom organizzate a tovaglia.
US5112761A (en) * 1990-01-10 1992-05-12 Microunity Systems Engineering Bicmos process utilizing planarization technique

Also Published As

Publication number Publication date
JPH04218973A (ja) 1992-08-10
IT8983651A1 (it) 1991-06-22
EP0436475B1 (de) 1995-03-15
JP3072130B2 (ja) 2000-07-31
EP0436475A2 (de) 1991-07-10
IT1236601B (it) 1993-03-18
US5210046A (en) 1993-05-11
DE69017874D1 (de) 1995-04-20
US5345417A (en) 1994-09-06
IT8983651A0 (it) 1989-12-22
EP0436475A3 (en) 1992-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee