DE69016785D1 - Auswechselbare Höchstintegrationspackung. - Google Patents
Auswechselbare Höchstintegrationspackung.Info
- Publication number
- DE69016785D1 DE69016785D1 DE69016785T DE69016785T DE69016785D1 DE 69016785 D1 DE69016785 D1 DE 69016785D1 DE 69016785 T DE69016785 T DE 69016785T DE 69016785 T DE69016785 T DE 69016785T DE 69016785 D1 DE69016785 D1 DE 69016785D1
- Authority
- DE
- Germany
- Prior art keywords
- interchangeable
- maximum integration
- pack
- integration pack
- maximum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10575—Insulating foil under component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP90120994A EP0483408B1 (de) | 1990-11-02 | 1990-11-02 | Auswechselbare Höchstintegrationspackung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69016785D1 true DE69016785D1 (de) | 1995-03-23 |
DE69016785T2 DE69016785T2 (de) | 1995-08-17 |
Family
ID=8204676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69016785T Expired - Fee Related DE69016785T2 (de) | 1990-11-02 | 1990-11-02 | Auswechselbare Höchstintegrationspackung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5164818A (de) |
EP (1) | EP0483408B1 (de) |
JP (1) | JPH053052A (de) |
DE (1) | DE69016785T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5768109A (en) * | 1991-06-26 | 1998-06-16 | Hughes Electronics | Multi-layer circuit board and semiconductor flip chip connection |
JPH0888063A (ja) * | 1994-09-16 | 1996-04-02 | Yamaichi Electron Co Ltd | Icソケットの接触構造 |
JPH08279670A (ja) * | 1995-04-07 | 1996-10-22 | Hitachi Ltd | 電子部品の表面実装構造 |
US5796590A (en) * | 1996-11-05 | 1998-08-18 | Micron Electronics, Inc. | Assembly aid for mounting packaged integrated circuit devices to printed circuit boards |
KR100268460B1 (ko) * | 1996-12-07 | 2000-10-16 | 윤종용 | 표면실장용 반도체ic의 위치결정장치 |
US6048744A (en) | 1997-09-15 | 2000-04-11 | Micron Technology, Inc. | Integrated circuit package alignment feature |
DE19907168C1 (de) * | 1999-02-19 | 2000-08-10 | Micronas Intermetall Gmbh | Schichtanordnung sowie Verfahren zu deren Herstellung |
JP4305693B2 (ja) | 1999-04-26 | 2009-07-29 | 株式会社ニフコ | 紐留め用バックル |
US6469394B1 (en) | 2000-01-31 | 2002-10-22 | Fujitsu Limited | Conductive interconnect structures and methods for forming conductive interconnect structures |
US6543674B2 (en) | 2001-02-06 | 2003-04-08 | Fujitsu Limited | Multilayer interconnection and method |
US6991960B2 (en) | 2001-08-30 | 2006-01-31 | Micron Technology, Inc. | Method of semiconductor device package alignment and method of testing |
US7361044B1 (en) | 2006-12-14 | 2008-04-22 | Intel Corporation | Socket that engages a pin grid array |
JP6554358B2 (ja) * | 2015-08-20 | 2019-07-31 | イリソ電子工業株式会社 | コネクタ |
FR3057103B1 (fr) * | 2016-09-30 | 2022-11-11 | Safran Electronics & Defense | Dispositif electronique comprenant un module raccorde a un pcb et unite electronique comportant un tel dispositif |
JP2018064063A (ja) * | 2016-10-14 | 2018-04-19 | イリソ電子工業株式会社 | 回路基板及び回路装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2958064A (en) * | 1957-11-26 | 1960-10-25 | Amp Inc | Circuit board and socket construction |
DE2148376A1 (de) * | 1971-09-28 | 1973-04-05 | Siemens Ag | Schaltungstraeger mit einem schichtkoerper aus mehreren, leiterbahnen aufweisenden isolierschichten |
JPS5894779A (ja) * | 1981-11-30 | 1983-06-06 | 日本電信電話株式会社 | 超伝導素子実装用マイクロコネクタ |
JPS61239576A (ja) * | 1985-04-16 | 1986-10-24 | シチズン時計株式会社 | コネクタ−の製造方法 |
US4885126A (en) * | 1986-10-17 | 1989-12-05 | Polonio John D | Interconnection mechanisms for electronic components |
JPS6430188A (en) * | 1987-07-24 | 1989-02-01 | Showa Electric Wire & Cable Co | Fixing method for terminal pin |
JPS6458836A (en) * | 1987-08-31 | 1989-03-06 | Nissan Motor | Gear shifter for automatic transmission |
US5036163A (en) * | 1989-10-13 | 1991-07-30 | Honeywell Inc. | Universal semiconductor chip package |
-
1990
- 1990-11-02 EP EP90120994A patent/EP0483408B1/de not_active Expired - Lifetime
- 1990-11-02 DE DE69016785T patent/DE69016785T2/de not_active Expired - Fee Related
-
1991
- 1991-09-24 US US07/765,072 patent/US5164818A/en not_active Expired - Fee Related
- 1991-10-31 JP JP3311344A patent/JPH053052A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0483408B1 (de) | 1995-02-08 |
US5164818A (en) | 1992-11-17 |
EP0483408A1 (de) | 1992-05-06 |
JPH053052A (ja) | 1993-01-08 |
DE69016785T2 (de) | 1995-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |