DE69001349D1 - Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. - Google Patents

Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.

Info

Publication number
DE69001349D1
DE69001349D1 DE9090202734T DE69001349T DE69001349D1 DE 69001349 D1 DE69001349 D1 DE 69001349D1 DE 9090202734 T DE9090202734 T DE 9090202734T DE 69001349 T DE69001349 T DE 69001349T DE 69001349 D1 DE69001349 D1 DE 69001349D1
Authority
DE
Germany
Prior art keywords
copper
baths
chemical polishing
alloy surfaces
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9090202734T
Other languages
English (en)
Inventor
Daniel Tytgat
Stefaan Magnus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solvay SA
Original Assignee
Solvay SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solvay SA filed Critical Solvay SA
Application granted granted Critical
Publication of DE69001349D1 publication Critical patent/DE69001349D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Paper (AREA)
  • Jib Cranes (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
DE9090202734T 1989-10-24 1990-10-15 Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. Expired - Lifetime DE69001349D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE8901150A BE1003761A3 (fr) 1989-10-24 1989-10-24 Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre.

Publications (1)

Publication Number Publication Date
DE69001349D1 true DE69001349D1 (de) 1993-05-19

Family

ID=3884370

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9090202734T Expired - Lifetime DE69001349D1 (de) 1989-10-24 1990-10-15 Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.

Country Status (10)

Country Link
US (1) US5098517A (de)
EP (1) EP0425012B1 (de)
JP (1) JPH03193886A (de)
KR (1) KR910008167A (de)
AT (1) ATE88223T1 (de)
BE (1) BE1003761A3 (de)
CA (1) CA2028195A1 (de)
DE (1) DE69001349D1 (de)
FI (1) FI905229A0 (de)
NO (1) NO904579L (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242542A (en) * 1992-08-17 1993-09-07 Alain Masse Solution and method for removing zinc from the surface of a galvanized metal
US5279707A (en) * 1992-10-23 1994-01-18 Time Savers Die discoloration remover solution and method
NZ258702A (en) * 1993-01-11 1996-12-20 Macdermid Inc Phosphating compositions, method for providing phosphate conversion coating on metal substrate, and use in the fabrication of printed circuits utilising organic resins
US5630950A (en) * 1993-07-09 1997-05-20 Enthone-Omi, Inc. Copper brightening process and bath
DE4402788A1 (de) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Verfahren zum Abtragen von Metallen
US5916453A (en) * 1996-09-20 1999-06-29 Fujitsu Limited Methods of planarizing structures on wafers and substrates by polishing
US6858097B2 (en) * 1999-12-30 2005-02-22 Henkel Kommanditgesellschaft Auf Aktien (Henkel Kgaa) Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen
US6368969B1 (en) 2000-06-30 2002-04-09 International Business Machines Corporation Chemical-mechanical polishing methods
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
JP6043148B2 (ja) * 2012-10-25 2016-12-14 ユニチカ株式会社 銅エッチング液
CN103849876B (zh) * 2012-12-03 2016-04-06 浙江伟星实业发展股份有限公司 一种化学抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE284558C (de) * 1900-01-01
BE652530A (de) * 1963-09-02
JPS512975A (ja) * 1974-06-28 1976-01-12 Hitachi Ltd Etsuchingueki
GB1449525A (en) * 1974-08-21 1976-09-15 Tokai Electro Chemical Co Method of stabilizing acid aqueous solutions of hydrogen peroxide
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame
SU1211338A1 (ru) * 1984-07-18 1986-02-15 Ордена Трудового Красного Знамени Институт Органической И Физической Химии Им.А.Е.Арбузова Раствор дл химического полировани меди и ее сплавов
FR2621052A1 (fr) * 1987-09-25 1989-03-31 Solvay Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre

Also Published As

Publication number Publication date
NO904579L (no) 1991-04-25
ATE88223T1 (de) 1993-04-15
CA2028195A1 (fr) 1991-04-25
NO904579D0 (no) 1990-10-23
EP0425012B1 (de) 1993-04-14
KR910008167A (ko) 1991-05-30
BE1003761A3 (fr) 1992-06-09
JPH03193886A (ja) 1991-08-23
EP0425012A1 (de) 1991-05-02
US5098517A (en) 1992-03-24
FI905229A0 (fi) 1990-10-24

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