ATE88223T1 - Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. - Google Patents
Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen.Info
- Publication number
- ATE88223T1 ATE88223T1 AT90202734T AT90202734T ATE88223T1 AT E88223 T1 ATE88223 T1 AT E88223T1 AT 90202734 T AT90202734 T AT 90202734T AT 90202734 T AT90202734 T AT 90202734T AT E88223 T1 ATE88223 T1 AT E88223T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- baths
- chemical polishing
- processes
- alloy surfaces
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- -1 tetraborate ions Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Paper (AREA)
- Jib Cranes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE8901150A BE1003761A3 (fr) | 1989-10-24 | 1989-10-24 | Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre. |
| EP90202734A EP0425012B1 (de) | 1989-10-24 | 1990-10-15 | Bäder und Verfahren zum chemischen Polieren von Kupfer- oder Kupferlegierung-Oberflächen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE88223T1 true ATE88223T1 (de) | 1993-04-15 |
Family
ID=3884370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT90202734T ATE88223T1 (de) | 1989-10-24 | 1990-10-15 | Baeder und verfahren zum chemischen polieren von kupfer- oder kupferlegierung-oberflaechen. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US5098517A (de) |
| EP (1) | EP0425012B1 (de) |
| JP (1) | JPH03193886A (de) |
| KR (1) | KR910008167A (de) |
| AT (1) | ATE88223T1 (de) |
| BE (1) | BE1003761A3 (de) |
| CA (1) | CA2028195A1 (de) |
| DE (1) | DE69001349D1 (de) |
| FI (1) | FI905229A7 (de) |
| NO (1) | NO904579L (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5242542A (en) * | 1992-08-17 | 1993-09-07 | Alain Masse | Solution and method for removing zinc from the surface of a galvanized metal |
| US5279707A (en) * | 1992-10-23 | 1994-01-18 | Time Savers | Die discoloration remover solution and method |
| SK88295A3 (en) * | 1993-01-11 | 1996-03-06 | Macdermid Inc | Phosphating compositions and processes, particulary for use in fabrication of printed circuit utilizating organic resists |
| US5630950A (en) * | 1993-07-09 | 1997-05-20 | Enthone-Omi, Inc. | Copper brightening process and bath |
| DE4402788A1 (de) * | 1994-01-31 | 1995-08-10 | Emil Krechen Industrievertretu | Verfahren zum Abtragen von Metallen |
| US5916453A (en) | 1996-09-20 | 1999-06-29 | Fujitsu Limited | Methods of planarizing structures on wafers and substrates by polishing |
| US6858097B2 (en) * | 1999-12-30 | 2005-02-22 | Henkel Kommanditgesellschaft Auf Aktien (Henkel Kgaa) | Brightening/passivating metal surfaces without hazard from emissions of oxides of nitrogen |
| US6368969B1 (en) | 2000-06-30 | 2002-04-09 | International Business Machines Corporation | Chemical-mechanical polishing methods |
| US20100062693A1 (en) * | 2008-09-05 | 2010-03-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Two step method and apparatus for polishing metal and other films in semiconductor manufacturing |
| JP6043148B2 (ja) * | 2012-10-25 | 2016-12-14 | ユニチカ株式会社 | 銅エッチング液 |
| CN103849876B (zh) * | 2012-12-03 | 2016-04-06 | 浙江伟星实业发展股份有限公司 | 一种化学抛光方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE284558C (de) * | 1900-01-01 | |||
| BE652530A (de) * | 1963-09-02 | |||
| JPS512975A (ja) * | 1974-06-28 | 1976-01-12 | Hitachi Ltd | Etsuchingueki |
| GB1449525A (en) * | 1974-08-21 | 1976-09-15 | Tokai Electro Chemical Co | Method of stabilizing acid aqueous solutions of hydrogen peroxide |
| IT1083401B (it) * | 1977-05-27 | 1985-05-21 | Alfachimici Spa | Soluzione acida per l'attacco selettivo del rame |
| SU1211338A1 (ru) * | 1984-07-18 | 1986-02-15 | Ордена Трудового Красного Знамени Институт Органической И Физической Химии Им.А.Е.Арбузова | Раствор дл химического полировани меди и ее сплавов |
| FR2621052A1 (fr) * | 1987-09-25 | 1989-03-31 | Solvay | Bains et procede pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre |
-
1989
- 1989-10-24 BE BE8901150A patent/BE1003761A3/fr not_active IP Right Cessation
-
1990
- 1990-10-15 DE DE9090202734T patent/DE69001349D1/de not_active Expired - Lifetime
- 1990-10-15 EP EP90202734A patent/EP0425012B1/de not_active Expired - Lifetime
- 1990-10-15 AT AT90202734T patent/ATE88223T1/de not_active IP Right Cessation
- 1990-10-22 KR KR1019900016848A patent/KR910008167A/ko not_active Withdrawn
- 1990-10-22 CA CA002028195A patent/CA2028195A1/fr not_active Abandoned
- 1990-10-23 NO NO90904579A patent/NO904579L/no unknown
- 1990-10-24 US US07/602,617 patent/US5098517A/en not_active Expired - Fee Related
- 1990-10-24 FI FI905229A patent/FI905229A7/fi not_active Application Discontinuation
- 1990-10-24 JP JP2284533A patent/JPH03193886A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2028195A1 (fr) | 1991-04-25 |
| EP0425012A1 (de) | 1991-05-02 |
| DE69001349D1 (de) | 1993-05-19 |
| FI905229A7 (fi) | 1991-04-25 |
| NO904579L (no) | 1991-04-25 |
| NO904579D0 (no) | 1990-10-23 |
| JPH03193886A (ja) | 1991-08-23 |
| KR910008167A (ko) | 1991-05-30 |
| US5098517A (en) | 1992-03-24 |
| FI905229A0 (fi) | 1990-10-24 |
| EP0425012B1 (de) | 1993-04-14 |
| BE1003761A3 (fr) | 1992-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |