DE69000387D1 - Oberflaechenmontiertes led-gehaeuse. - Google Patents

Oberflaechenmontiertes led-gehaeuse.

Info

Publication number
DE69000387D1
DE69000387D1 DE9090401286T DE69000387T DE69000387D1 DE 69000387 D1 DE69000387 D1 DE 69000387D1 DE 9090401286 T DE9090401286 T DE 9090401286T DE 69000387 T DE69000387 T DE 69000387T DE 69000387 D1 DE69000387 D1 DE 69000387D1
Authority
DE
Germany
Prior art keywords
surface mounted
mounted led
led housing
housing
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9090401286T
Other languages
English (en)
Other versions
DE69000387T2 (de
Inventor
John Critelli
Klaus Oesterheld
Carleton Debaun
Bart Dowstra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dialight Corp
Original Assignee
Dialight Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dialight Corp filed Critical Dialight Corp
Application granted granted Critical
Publication of DE69000387D1 publication Critical patent/DE69000387D1/de
Publication of DE69000387T2 publication Critical patent/DE69000387T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE9090401286T 1989-12-21 1990-05-15 Oberflaechenmontiertes led-gehaeuse. Expired - Fee Related DE69000387T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/454,468 US4959761A (en) 1989-12-21 1989-12-21 Surface mounted led package

Publications (2)

Publication Number Publication Date
DE69000387D1 true DE69000387D1 (de) 1992-11-19
DE69000387T2 DE69000387T2 (de) 1993-04-15

Family

ID=23804721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9090401286T Expired - Fee Related DE69000387T2 (de) 1989-12-21 1990-05-15 Oberflaechenmontiertes led-gehaeuse.

Country Status (4)

Country Link
US (1) US4959761A (de)
EP (1) EP0434471B1 (de)
JP (1) JPH0654816B2 (de)
DE (1) DE69000387T2 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089861A (en) * 1990-05-09 1992-02-18 Rohm Co., Ltd. Semiconductor laser device with mounting block
DE4017131C1 (de) * 1990-05-28 1991-11-07 Albrecht, Paul, 8600 Bamberg, De
US5126929A (en) * 1991-01-09 1992-06-30 R & D Molded Products, Inc. LED holder with lens
US5264998A (en) * 1991-07-08 1993-11-23 U.S. Philips Corporation Electric lamp having a cap of synthetic resin
US5161882A (en) * 1991-08-15 1992-11-10 Garrett Joe L Christmas lighting organizer apparatus
JP3007199B2 (ja) * 1991-09-30 2000-02-07 ローム株式会社 Ｌｅｄヘッド
FR2682458B1 (fr) * 1991-10-10 1996-08-09 Socop Sa Montage de diodes electroluminescentes sur un circuit imprime, en particulier pour l'indutrie automobile.
US5617441A (en) * 1991-10-21 1997-04-01 Rohm Co. Ltd. Light source unit and its manufacturing method, adjusting method and adjusting apparatus
EP0579775B1 (de) * 1991-12-11 1995-08-23 L.A.Gear, Inc. Sportschuh mit einsteckbarem modul
FR2697485B1 (fr) * 1992-11-02 1995-01-20 Valeo Vision Feu de signalisation à éléments lumineux modulaires, pour véhicule automobile.
FR2697484B1 (fr) * 1992-11-02 1995-01-20 Valeo Vision Elément modulaire pour la réalisation de feux de signalisation de véhicules automobiles.
US5382874A (en) * 1992-11-03 1995-01-17 Illumination Technology, Inc. Self-aligning light directing surface mountable miniature incandescent lamp
DE4420698C2 (de) * 1994-06-14 1998-08-20 Schadow Rudolf Gmbh Adapter zur elektrischen Verbindung von optoelektronischen Bauelementen mit einer Leiterplatte
JPH08115610A (ja) * 1994-10-13 1996-05-07 Alpine Electron Inc 照光装置
JP2677216B2 (ja) * 1994-12-16 1997-11-17 株式会社押野電気製作所 パネル・プリント基板用小形ランプソケット装置
US5680718A (en) 1994-12-20 1997-10-28 First Choice Trading Limited Illuminable hat
DE19535777A1 (de) * 1995-09-26 1997-03-27 Siemens Ag Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung
US6012822A (en) 1996-11-26 2000-01-11 Robinson; William J. Motion activated apparel flasher
JPH10229285A (ja) * 1997-02-13 1998-08-25 Uniden Corp 電子部品ホルダー
DE19705738C2 (de) * 1997-02-14 1999-02-18 Trw Fahrzeugelektrik Fassung für ein Leuchtelement zum Einbau in einer Leiterplatte, insbesondere zur Beleuchtung von Funktionssymbolen oder zur Signalisierung von Funktionen in Kraftfahrzeugen
USD428820S (en) * 1997-06-17 2000-08-01 Lumex, Inc. Housing for emitters for infrared detectors
USD425809S (en) * 1997-06-17 2000-05-30 Lumex, Inc. Housing for emitters for infrared detectors
USD426167S (en) * 1997-06-17 2000-06-06 Lumex, Inc. Housing for emitters for infrared detectors
USD422928S (en) * 1997-07-17 2000-04-18 Lumex, Inc. Housing for a plurality of emitters for detectors
CA2219837A1 (en) * 1997-10-31 1999-04-30 Tai-Fu Chang Decorative light string with led bulbs
US5941628A (en) * 1997-12-23 1999-08-24 Chang; Chih-Chen Lamp-holder for decorative network type light
US6525386B1 (en) * 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens
US6252350B1 (en) 1998-07-31 2001-06-26 Andres Alvarez Surface mounted LED lamp
DE69936704T2 (de) * 1998-11-17 2007-12-06 Ichikoh Industries Ltd. Montagestruktur für Leuchtdioden
US6961190B1 (en) * 1999-07-26 2005-11-01 Labosphere Institute Bulk lens, light emitting body, lighting device and optical information system
GB0000511D0 (en) * 2000-01-12 2000-03-01 Oxley Dev Co Ltd Led package
US6517218B2 (en) 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6582100B1 (en) 2000-08-09 2003-06-24 Relume Corporation LED mounting system
JP4194828B2 (ja) * 2002-11-29 2008-12-10 豊田合成株式会社 Ｌｅｄランプ
JP2005322380A (ja) * 2004-04-09 2005-11-17 Toshiba Corp 半導体記憶装置
US7044620B2 (en) * 2004-04-30 2006-05-16 Guide Corporation LED assembly with reverse circuit board
JP4789433B2 (ja) * 2004-06-30 2011-10-12 三洋電機株式会社 Ｌｅｄ表示器用筺体及びｌｅｄ表示器
JP4654639B2 (ja) * 2004-09-09 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
US20060082315A1 (en) * 2004-10-20 2006-04-20 Timothy Chan Method and system for attachment of light emmiting diodes to circuitry for use in lighting
US7677763B2 (en) * 2004-10-20 2010-03-16 Timothy Chan Method and system for attachment of light emitting diodes to circuitry for use in lighting
EP1846692B1 (de) 2005-02-02 2018-09-26 Lumileds Holding B.V. Lichtquellenmodul und halter dafür
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
JP4786266B2 (ja) * 2005-09-13 2011-10-05 ローム株式会社 光源装置およびこの光源装置を用いた画像読取装置
JP4816482B2 (ja) 2007-02-07 2011-11-16 船井電機株式会社 テレビジョン受像器およびｌｅｄ表示機構
EP1959505B1 (de) * 2007-02-14 2015-09-09 Tridonic Jennersdorf GmbH LED-Modul mit Linse und Herstellungsverfahren dafür
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
CN100546058C (zh) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
TWI360239B (en) 2008-03-19 2012-03-11 E Pin Optical Industry Co Ltd Package structure for light emitting diode
CN102017205B (zh) * 2008-05-05 2014-09-10 迪亚光公司 表面安装电路板指示器
US8308320B2 (en) * 2009-11-12 2012-11-13 Cooper Technologies Company Light emitting diode modules with male/female features for end-to-end coupling
US8764220B2 (en) 2010-04-28 2014-07-01 Cooper Technologies Company Linear LED light module
EP2990718B1 (de) 2010-04-27 2019-06-05 Cooper Technologies Company Vernetzbares lineares leuchtdiodensystem
US9222645B2 (en) 2010-11-29 2015-12-29 RTC Industries, Incorporated LED lighting assembly and method of lighting for a merchandise display
US11274808B2 (en) 2010-06-17 2022-03-15 Rtc Industries, Inc. LED lighting assembly and method of lighting for a merchandise display
DE102012103633B4 (de) * 2012-04-25 2020-08-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung
JP6051926B2 (ja) * 2013-02-22 2016-12-27 富士ゼロックス株式会社 発光装置および画像形成装置
US9520742B2 (en) 2014-07-03 2016-12-13 Hubbell Incorporated Monitoring system and method
US9750139B2 (en) * 2015-06-19 2017-08-29 Circor Aerospace, Inc. Miniature SMT housing for electronics package
US10041657B2 (en) * 2016-06-13 2018-08-07 Rebo Lighting & Electronics, Llc Clip unit and edge mounted light emitting diode (LED) assembly comprising a clip unit
US9997503B2 (en) * 2016-08-03 2018-06-12 Nichia Corporation Composite substrate and light emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491900A (en) * 1982-09-27 1985-01-01 Savage John Jun Lens and mount for use with electromagnetic wave source
US4555749A (en) * 1984-05-07 1985-11-26 General Instrument Corporation LED Circuit board indicator housing and tie-bar assembly
CH663695A5 (fr) * 1985-09-13 1987-12-31 Universo Sa Porte-lampe miniature.
FR2593930B1 (fr) * 1986-01-24 1989-11-24 Radiotechnique Compelec Dispositif opto-electronique pour montage en surface
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's

Also Published As

Publication number Publication date
US4959761A (en) 1990-09-25
EP0434471A1 (de) 1991-06-26
DE69000387T2 (de) 1993-04-15
JPH03191580A (ja) 1991-08-21
EP0434471B1 (de) 1992-10-14
JPH0654816B2 (ja) 1994-07-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee