DE68926258D1 - Verfahren zum Herstellen eines uniaxial elektrisch leitenden Artikels - Google Patents

Verfahren zum Herstellen eines uniaxial elektrisch leitenden Artikels

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Publication number
DE68926258D1
DE68926258D1 DE68926258T DE68926258T DE68926258D1 DE 68926258 D1 DE68926258 D1 DE 68926258D1 DE 68926258 T DE68926258 T DE 68926258T DE 68926258 T DE68926258 T DE 68926258T DE 68926258 D1 DE68926258 D1 DE 68926258D1
Authority
DE
Germany
Prior art keywords
making
electrically conductive
uniax
conductive
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926258T
Other languages
English (en)
Other versions
DE68926258T2 (de
Inventor
Michael Joseph Ludden
Nicholas J G Smith
Paul James Gibney
Peter Nyholm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Ltd
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB888802567A external-priority patent/GB8802567D0/en
Priority claimed from GB888802565A external-priority patent/GB8802565D0/en
Priority claimed from GB888815447A external-priority patent/GB8815447D0/en
Priority claimed from GB888823053A external-priority patent/GB8823053D0/en
Priority claimed from GB888828245A external-priority patent/GB8828245D0/en
Application filed by Raychem Ltd filed Critical Raychem Ltd
Application granted granted Critical
Publication of DE68926258D1 publication Critical patent/DE68926258D1/de
Publication of DE68926258T2 publication Critical patent/DE68926258T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
DE68926258T 1988-02-05 1989-02-03 Verfahren zum Herstellen eines uniaxial elektrisch leitenden Artikels Expired - Fee Related DE68926258T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB888802567A GB8802567D0 (en) 1988-02-05 1988-02-05 Uniaxially electrically conductive article
GB888802565A GB8802565D0 (en) 1988-02-05 1988-02-05 Uses of uniaxially electrically conductive articles
GB888815447A GB8815447D0 (en) 1988-06-29 1988-06-29 Anisotropically electrically conductive article
GB888823053A GB8823053D0 (en) 1988-09-30 1988-09-30 Uses of uniaxially electrically conductive articles
GB888828245A GB8828245D0 (en) 1988-12-02 1988-12-02 Anisotropically electrically conductive articles

Publications (2)

Publication Number Publication Date
DE68926258D1 true DE68926258D1 (de) 1996-05-23
DE68926258T2 DE68926258T2 (de) 1996-10-02

Family

ID=27516790

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68926258T Expired - Fee Related DE68926258T2 (de) 1988-02-05 1989-02-03 Verfahren zum Herstellen eines uniaxial elektrisch leitenden Artikels

Country Status (6)

Country Link
EP (2) EP0327399B1 (de)
JP (1) JP2664090B2 (de)
KR (1) KR900701043A (de)
AT (1) ATE137064T1 (de)
DE (1) DE68926258T2 (de)
WO (1) WO1989007338A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2017743C (en) * 1989-06-30 1996-02-06 William C. Hu Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
EP0504614B1 (de) 1991-02-22 2003-10-15 Canon Kabushiki Kaisha Elektrischer Verbindungskörper und Herstellungsverfahren dafür
DE69232606T2 (de) * 1991-02-25 2004-08-05 Canon K.K. Elektrischer Verbindungskörper und Herstellungsverfahren dafür
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5665989A (en) * 1995-01-03 1997-09-09 Lsi Logic Programmable microsystems in silicon
US6384344B1 (en) 1995-06-19 2002-05-07 Ibiden Co., Ltd Circuit board for mounting electronic parts
WO1998011605A1 (fr) 1995-06-19 1998-03-19 Ibiden Co., Ltd. Carte de circuit permettant le montage de pieces electroniques
EP1814153A3 (de) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Leiterplatte zum Montieren von Elektronikteilen
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
US6469394B1 (en) 2000-01-31 2002-10-22 Fujitsu Limited Conductive interconnect structures and methods for forming conductive interconnect structures
DE10356981B3 (de) * 2003-12-05 2005-09-01 Seoul National University Industry Foundation Verfahren zur Montage eines Halbleiterchips auf ein Substrat, insbesondere auf eine Leiterplatte
US7291380B2 (en) 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598839A (en) * 1979-01-23 1980-07-28 Nec Corp Semiconductor device
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
CA1238959A (en) * 1984-08-09 1988-07-05 Robert R. Rohloff Area-bonding tape
DE3440109A1 (de) * 1984-11-02 1986-05-07 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zur herstellung verformbarer vielfach-verbindungen fuer den elektrischen anschluss mikroelektronischer bauelemente und nach diesem verfahren hergestellte vielfachverbindungen
EP0183598A3 (de) * 1984-11-13 1987-01-28 Augat Inc. Packung mit Schirm für integrierte Schaltung
JPS61194745A (ja) * 1985-02-25 1986-08-29 Hitachi Ltd レ−ザ処理装置
JPS61265827A (ja) * 1985-05-20 1986-11-25 Katsusato Fujiyoshi 半導体回路
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
EP0260490A1 (de) * 1986-08-27 1988-03-23 Kabushiki Kaisha Toshiba Verbindungsschicht für ein elektronisches Bauelement und Verfahren zum Verbinden eines elektronischen Bauelementes mit einer solchen Schicht

Also Published As

Publication number Publication date
EP0391979A1 (de) 1990-10-17
DE68926258T2 (de) 1996-10-02
JPH03502388A (ja) 1991-05-30
JP2664090B2 (ja) 1997-10-15
WO1989007338A1 (en) 1989-08-10
KR900701043A (ko) 1990-08-17
EP0327399A1 (de) 1989-08-09
EP0327399B1 (de) 1996-04-17
ATE137064T1 (de) 1996-05-15

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