DE68925274D1 - Chipkarte - Google Patents

Chipkarte

Info

Publication number
DE68925274D1
DE68925274D1 DE68925274T DE68925274T DE68925274D1 DE 68925274 D1 DE68925274 D1 DE 68925274D1 DE 68925274 T DE68925274 T DE 68925274T DE 68925274 T DE68925274 T DE 68925274T DE 68925274 D1 DE68925274 D1 DE 68925274D1
Authority
DE
Germany
Prior art keywords
smart card
smart
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925274T
Other languages
English (en)
Other versions
DE68925274T2 (de
Inventor
Syojiro C O Kitaitami Se Kodai
Katsunori C O Kitaitami S Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE68925274D1 publication Critical patent/DE68925274D1/de
Application granted granted Critical
Publication of DE68925274T2 publication Critical patent/DE68925274T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
DE68925274T 1989-01-12 1989-08-11 Chipkarte Expired - Fee Related DE68925274T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1005708A JP2559834B2 (ja) 1989-01-12 1989-01-12 Ｉｃカード

Publications (2)

Publication Number Publication Date
DE68925274D1 true DE68925274D1 (de) 1996-02-08
DE68925274T2 DE68925274T2 (de) 1996-09-12

Family

ID=11618617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925274T Expired - Fee Related DE68925274T2 (de) 1989-01-12 1989-08-11 Chipkarte

Country Status (4)

Country Link
US (1) US4974120A (de)
EP (1) EP0377937B1 (de)
JP (1) JP2559834B2 (de)
DE (1) DE68925274T2 (de)

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
JP2559849B2 (ja) * 1989-05-23 1996-12-04 三菱電機株式会社 Ｉｃカード
JP2659440B2 (ja) * 1989-09-25 1997-09-30 日立マクセル株式会社 情報カードの封止方法
JP2874279B2 (ja) * 1990-05-10 1999-03-24 三菱電機株式会社 薄型半導体装置の製造方法
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
FI913357A (fi) * 1991-07-10 1993-01-11 Valtion Teknillinen Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul
DE4142408A1 (de) * 1991-12-20 1993-06-24 Gao Ges Automation Org Ausweiskarte sowie verfahren und vorrichtung zur herstellung derselben
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
GB2267682B (en) * 1992-06-09 1996-04-10 Gec Avery Ltd An integrated circuit card
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
FR2721733B1 (fr) * 1994-06-22 1996-08-23 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
US5526235A (en) * 1994-06-23 1996-06-11 Garmin Communication And Navigation Electronic storage device and receptacle
JP2667369B2 (ja) * 1994-08-05 1997-10-27 インターナショナル・ビジネス・マシーンズ・コーポレイション Ｉｃカードの製造方法及びｉｃカード
US6282097B1 (en) 1998-10-28 2001-08-28 Garmin Corporation Data card having a retractable handle
US6215671B1 (en) 1998-12-10 2001-04-10 Garmin Corporation Method and apparatus for connecting circuit boards
US6250553B1 (en) 1998-12-30 2001-06-26 Garmin Corporation Data card having a retractable handle
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
US6930257B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laminated laser-embedded circuit layers
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7399661B2 (en) 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US7416132B2 (en) 2003-07-17 2008-08-26 Sandisk Corporation Memory card with and without enclosure
KR101199600B1 (ko) 2003-07-17 2012-11-12 샌디스크 테크놀로지스, 인코포레이티드 융기 부분을 구비한 메모리 카드
US20050013106A1 (en) 2003-07-17 2005-01-20 Takiar Hem P. Peripheral card with hidden test pins
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7908080B2 (en) 2004-12-31 2011-03-15 Google Inc. Transportation routing
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
KR100776210B1 (ko) * 2006-10-10 2007-11-16 주식회사 비에스이 마이크로폰 조립체의 제조장치 및 그 제조방법
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
US7752752B1 (en) 2007-01-09 2010-07-13 Amkor Technology, Inc. Method of fabricating an embedded circuit pattern
US9367712B1 (en) 2007-03-01 2016-06-14 Amkor Technology, Inc. High density memory card using folded flex
US8323771B1 (en) 2007-08-15 2012-12-04 Amkor Technology, Inc. Straight conductor blind via capture pad structure and fabrication method
US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
JP5077275B2 (ja) * 2009-03-25 2012-11-21 株式会社デンソー 電子装置の製造方法及び電子装置
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
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US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
KR101366461B1 (ko) 2012-11-20 2014-02-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US9799592B2 (en) 2013-11-19 2017-10-24 Amkor Technology, Inc. Semicondutor device with through-silicon via-less deep wells
KR101488590B1 (ko) 2013-03-29 2015-01-30 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
KR101607981B1 (ko) 2013-11-04 2016-03-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
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Also Published As

Publication number Publication date
EP0377937A2 (de) 1990-07-18
JPH02185494A (ja) 1990-07-19
EP0377937B1 (de) 1995-12-27
DE68925274T2 (de) 1996-09-12
JP2559834B2 (ja) 1996-12-04
US4974120A (en) 1990-11-27
EP0377937A3 (de) 1991-07-03

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