DE68923779D1 - Montier- und Kühlsystem für Leistungshalbleiteranordnungen. - Google Patents
Montier- und Kühlsystem für Leistungshalbleiteranordnungen.Info
- Publication number
- DE68923779D1 DE68923779D1 DE68923779T DE68923779T DE68923779D1 DE 68923779 D1 DE68923779 D1 DE 68923779D1 DE 68923779 T DE68923779 T DE 68923779T DE 68923779 T DE68923779 T DE 68923779T DE 68923779 D1 DE68923779 D1 DE 68923779D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- cooling system
- power semiconductor
- semiconductor arrangements
- arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/291,780 US4965658A (en) | 1988-12-29 | 1988-12-29 | System for mounting and cooling power semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68923779D1 true DE68923779D1 (de) | 1995-09-14 |
DE68923779T2 DE68923779T2 (de) | 1996-02-22 |
Family
ID=23121800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68923779T Expired - Fee Related DE68923779T2 (de) | 1988-12-29 | 1989-11-27 | Montier- und Kühlsystem für Leistungshalbleiteranordnungen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4965658A (de) |
EP (1) | EP0376478B1 (de) |
JP (1) | JP2828294B2 (de) |
KR (1) | KR970006207B1 (de) |
AU (1) | AU614888B2 (de) |
DE (1) | DE68923779T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5119175A (en) * | 1990-08-17 | 1992-06-02 | Westinghouse Electric Corp. | High power density solid-state, insulating coolant module |
US5825089A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance spring biased RF semiconductor package mounting structure |
US5825088A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance semiconductor package and mounting structure |
US5168425A (en) * | 1991-10-16 | 1992-12-01 | General Electric Company | Mounting arrangements for high voltage/high power semiconductors |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US5917703A (en) * | 1998-04-17 | 1999-06-29 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
JP2001244391A (ja) * | 1999-12-21 | 2001-09-07 | Toyota Central Res & Dev Lab Inc | マルチチップモジュールの冷却構造 |
DE10022341B4 (de) * | 2000-05-08 | 2005-03-31 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Elektronisches Leistungsmodul |
DE10062108B4 (de) | 2000-12-13 | 2010-04-15 | Infineon Technologies Ag | Leistungsmodul mit verbessertem transienten Wärmewiderstand |
US7353662B2 (en) * | 2004-12-22 | 2008-04-08 | York International Corporation | Medium voltage starter for a chiller unit |
US8590329B2 (en) | 2004-12-22 | 2013-11-26 | Johnson Controls Technology Company | Medium voltage power controller |
US20080041081A1 (en) * | 2006-08-15 | 2008-02-21 | Bristol Compressors, Inc. | System and method for compressor capacity modulation in a heat pump |
US7628028B2 (en) * | 2005-08-03 | 2009-12-08 | Bristol Compressors International, Inc. | System and method for compressor capacity modulation |
US7393236B2 (en) * | 2005-09-02 | 2008-07-01 | Gm Global Technology Operations, Inc. | Integrated thermal and electrical connection system for power devices |
US20090103342A1 (en) * | 2007-10-17 | 2009-04-23 | Saul Lin | Silicon-controlled rectifier with a heat-dissipating structure |
BRMU8701723U2 (pt) * | 2007-11-01 | 2009-06-23 | Weg Automacao S A | disposição construtiva em chave de partida estática |
US8790089B2 (en) * | 2008-06-29 | 2014-07-29 | Bristol Compressors International, Inc. | Compressor speed control system for bearing reliability |
US8601828B2 (en) | 2009-04-29 | 2013-12-10 | Bristol Compressors International, Inc. | Capacity control systems and methods for a compressor |
US9134137B2 (en) | 2010-12-17 | 2015-09-15 | Microsoft Technology Licensing, Llc | Mobile search based on predicted location |
DE102011004541B4 (de) * | 2011-02-22 | 2014-07-17 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls |
DE102015213916B4 (de) * | 2015-07-23 | 2021-07-08 | Siemens Aktiengesellschaft | Leistungshalbleitermodulanordnung |
JP7352830B2 (ja) * | 2019-12-04 | 2023-09-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652903A (en) * | 1971-02-01 | 1972-03-28 | Gen Electric | Fluid cooled pressure assembly |
FR2224875B1 (de) * | 1973-04-03 | 1978-10-27 | Thomson Csf | |
DE2364728A1 (de) * | 1973-12-27 | 1975-07-03 | Licentia Gmbh | Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung |
JPS53143174A (en) * | 1977-05-20 | 1978-12-13 | Hitachi Ltd | Mounting structure of disc form thyristor |
JPS5455171A (en) * | 1977-10-11 | 1979-05-02 | Mitsubishi Electric Corp | Semiconductor device |
DE2804348C2 (de) * | 1978-02-02 | 1991-05-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | Rotierende Gleichrichteranordnung für die Erregung einer Synchronmaschine |
DE2813529A1 (de) * | 1978-03-29 | 1979-10-04 | Siemens Ag | Anordnung zur beidseitigen kuehlung von halbleiterbauelementen |
US4224663A (en) * | 1979-02-01 | 1980-09-23 | Power Control Corporation | Mounting assembly for semiconductive controlled rectifiers |
DE3005313C2 (de) * | 1980-02-13 | 1986-05-28 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
JPS5799757A (en) * | 1980-12-12 | 1982-06-21 | Toshiba Corp | Flat type semiconductor element |
DE3143336A1 (de) * | 1981-10-31 | 1983-05-19 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitergleichrichterbaueinheit |
JPS6292348A (ja) * | 1985-10-17 | 1987-04-27 | Mitsubishi Electric Corp | 半導体スタツク装置 |
-
1988
- 1988-12-29 US US07/291,780 patent/US4965658A/en not_active Expired - Lifetime
-
1989
- 1989-11-27 DE DE68923779T patent/DE68923779T2/de not_active Expired - Fee Related
- 1989-11-27 AU AU45533/89A patent/AU614888B2/en not_active Ceased
- 1989-11-27 EP EP89312261A patent/EP0376478B1/de not_active Expired - Lifetime
- 1989-12-15 KR KR1019890018635A patent/KR970006207B1/ko not_active IP Right Cessation
- 1989-12-28 JP JP1345023A patent/JP2828294B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR910013467A (ko) | 1991-08-08 |
AU614888B2 (en) | 1991-09-12 |
JP2828294B2 (ja) | 1998-11-25 |
JPH031565A (ja) | 1991-01-08 |
EP0376478A3 (de) | 1991-01-30 |
EP0376478B1 (de) | 1995-08-09 |
US4965658A (en) | 1990-10-23 |
DE68923779T2 (de) | 1996-02-22 |
AU4553389A (en) | 1990-07-05 |
EP0376478A2 (de) | 1990-07-04 |
KR970006207B1 (ko) | 1997-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |