DE68922061D1 - Vorrichtung zum Regeln der Temperatur. - Google Patents

Vorrichtung zum Regeln der Temperatur.

Info

Publication number
DE68922061D1
DE68922061D1 DE68922061T DE68922061T DE68922061D1 DE 68922061 D1 DE68922061 D1 DE 68922061D1 DE 68922061 T DE68922061 T DE 68922061T DE 68922061 T DE68922061 T DE 68922061T DE 68922061 D1 DE68922061 D1 DE 68922061D1
Authority
DE
Germany
Prior art keywords
regulating
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922061T
Other languages
English (en)
Other versions
DE68922061T2 (de
Inventor
Ryuichi Ebinuma
Takao Kariya
Nobutoshi Mizusawa
Koji Uda
Eiji Sakamoto
Shunichi Uzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63247493A external-priority patent/JPH0296812A/ja
Priority claimed from JP1196952A external-priority patent/JP2691454B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE68922061D1 publication Critical patent/DE68922061D1/de
Publication of DE68922061T2 publication Critical patent/DE68922061T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Thermal Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Temperature (AREA)
DE68922061T 1988-10-03 1989-09-29 Vorrichtung zum Regeln der Temperatur. Expired - Fee Related DE68922061T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63247493A JPH0296812A (ja) 1988-10-03 1988-10-03 温度制御装置
JP1196952A JP2691454B2 (ja) 1989-07-31 1989-07-31 温度制御装置

Publications (2)

Publication Number Publication Date
DE68922061D1 true DE68922061D1 (de) 1995-05-11
DE68922061T2 DE68922061T2 (de) 1995-08-31

Family

ID=26510077

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922061T Expired - Fee Related DE68922061T2 (de) 1988-10-03 1989-09-29 Vorrichtung zum Regeln der Temperatur.

Country Status (3)

Country Link
US (1) US5577552A (de)
EP (1) EP0363098B1 (de)
DE (1) DE68922061T2 (de)

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IT1269051B (it) * 1994-04-15 1997-03-18 Frigel Firenze Srl Impianto di condizionamento termico per uno stabilimento con piu' macchine operatrici aventi singole esigenze di condizionamento e/o raffreddamento
US5828070A (en) * 1996-02-16 1998-10-27 Eaton Corporation System and method for cooling workpieces processed by an ion implantation system
JP3324686B2 (ja) * 1997-07-14 2002-09-17 エスエムシー株式会社 恒温液循環装置
AU8749798A (en) * 1997-08-29 1999-03-22 Nikon Corporation Temperature adjusting method and aligner to which this method is applied
US5971368A (en) 1997-10-29 1999-10-26 Fsi International, Inc. System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in the liquid until utilized
US6866094B2 (en) * 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6046457A (en) * 1998-01-09 2000-04-04 International Business Machines Corporation Charged particle beam apparatus having anticontamination means
JPH11204411A (ja) * 1998-01-19 1999-07-30 Nikon Corp 塗布現像露光装置
JPH11307430A (ja) * 1998-04-23 1999-11-05 Canon Inc 露光装置およびデバイス製造方法ならびに駆動装置
DE19818131A1 (de) * 1998-04-23 1999-10-28 Gwk Ges Waerme Kaeltetechnik M Mehrkreistemperiersystem
US6445439B1 (en) * 1999-12-27 2002-09-03 Svg Lithography Systems, Inc. EUV reticle thermal management
TWI238292B (en) * 2000-02-10 2005-08-21 Asml Netherlands Bv Lithographic projection apparatus having a temperature controlled heat shield
JP3870002B2 (ja) * 2000-04-07 2007-01-17 キヤノン株式会社 露光装置
US6412551B1 (en) * 2000-05-19 2002-07-02 Unisys Corporation System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chips
US6362944B1 (en) * 2000-05-19 2002-03-26 Unisys Corporation System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
DE60232568D1 (de) * 2001-07-09 2009-07-23 Canon Kk Belichtungsapparat
US20050088634A1 (en) * 2002-03-15 2005-04-28 Nikon Corporation Exposure system and device production process
US6986654B2 (en) * 2002-07-03 2006-01-17 Therics, Inc. Apparatus, systems and methods for use in three-dimensional printing
US7132206B2 (en) * 2002-09-17 2006-11-07 International Business Machines Corporation Process and apparatus for minimizing thermal gradients across an advanced lithographic mask
JP4186644B2 (ja) * 2003-02-17 2008-11-26 株式会社Ｉｈｉ 真空処理装置の冷却装置
SG109000A1 (en) 2003-07-16 2005-02-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1524558A1 (de) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
JP2007512715A (ja) * 2003-11-26 2007-05-17 テンプトロニック コーポレイション 熱制御式チャックにおける電気的ノイズを低減する装置および方法
KR101945638B1 (ko) 2004-02-04 2019-02-07 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7458222B2 (en) * 2004-07-12 2008-12-02 Purity Solutions Llc Heat exchanger apparatus for a recirculation loop and related methods and systems
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102004046790B3 (de) * 2004-09-27 2006-06-14 Kermi Gmbh Fluid-Kühleinrichtung zur Kühlung wenigstens einer Verlustwärme erzeugender Komponente
US20070252499A1 (en) * 2004-10-18 2007-11-01 Leica Microsystems Cms Gmbh Scanning microscope
US7196768B2 (en) * 2004-10-26 2007-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7423721B2 (en) * 2004-12-15 2008-09-09 Asml Netherlands B.V. Lithographic apparatus
JP4693034B2 (ja) * 2005-01-28 2011-06-01 株式会社Ｋｅｌｋ プロセスチャンバ判別装置
JP4689308B2 (ja) * 2005-03-18 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
US20100163221A1 (en) * 2005-11-30 2010-07-01 Koninklijke Philips Electronics, N.V. Local control of heat flow to more accurately regulate machine temperatures
US7746447B2 (en) * 2005-12-22 2010-06-29 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and method of calibrating a lithographic apparatus
EP1843206B1 (de) * 2006-04-06 2012-09-05 ASML Netherlands B.V. Lithografisches Gerät und Verfahren zur Herstellung einer Vorrichtung
US8002025B2 (en) * 2006-04-28 2011-08-23 International Business Machines Corporation Containment of a wafer-chuck thermal interface fluid
US7916267B2 (en) * 2006-08-29 2011-03-29 Asml Netherlands B.V. Lithographic apparatus, and motor cooling device
US8068208B2 (en) * 2006-12-01 2011-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving immersion scanner overlay performance
JP4435201B2 (ja) * 2007-04-20 2010-03-17 キヤノン株式会社 温調システムの調整方法
US8767174B2 (en) * 2010-02-18 2014-07-01 Nikon Corporation Temperature-controlled holding devices for planar articles
KR20130031945A (ko) * 2011-09-22 2013-04-01 삼성전자주식회사 로딩용 척의 온도 제어 설비 및 온도 제어 방법
CN103072039A (zh) * 2011-10-25 2013-05-01 朱宏斌 机械类冷却循环系统
JP6328126B2 (ja) 2012-10-31 2018-05-23 エーエスエムエル ホールディング エヌ．ブイ． パターニングデバイス支持体、リソグラフィ装置及びパターニングデバイスの温度制御方法
CN106773153B (zh) * 2016-11-10 2019-10-25 武汉华星光电技术有限公司 一种蚀刻液的保温装置
DE102020211359A1 (de) 2020-09-10 2022-03-10 Carl Zeiss Smt Gmbh Baugruppe eines optischen Systems für die Mikrolithographie

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US1621620A (en) * 1924-03-01 1927-03-22 Charles Tagliabue Mfg Co Controlling apparatus
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US1997003A (en) * 1933-10-21 1935-04-09 Richard J Marquard Heater for closed vehicles
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US3360032A (en) * 1965-09-20 1967-12-26 Globe Union Inc Temperature controlling system
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US3586101A (en) * 1969-12-22 1971-06-22 Ibm Cooling system for data processing equipment
US3871444A (en) * 1971-08-02 1975-03-18 Beckman Instruments Inc Water quality analysis system with multicircuit single shell heat exchanger
DE2638702C3 (de) * 1976-08-27 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kühlvorrichtung
DE2820802C2 (de) * 1978-05-12 1982-02-25 Metzeler Schaum Gmbh, 8940 Memmingen Formschaumanlage
DE2912594A1 (de) * 1979-03-28 1980-10-09 Liedelt D F Velta Prod Regelsystem fuer ein fussbodenheizung
DE3683284D1 (de) * 1985-09-23 1992-02-13 Sharetree Systems Ltd Ofen zum einbrennen integrierter schaltungen.
JPS63119233A (ja) * 1986-11-07 1988-05-23 Hitachi Ltd Ｘ線転写装置
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
AT393334B (de) * 1988-01-22 1991-09-25 Ims Ionen Mikrofab Syst Anordnung zur stabilisierung einer bestrahlten maske
EP0357423B1 (de) * 1988-09-02 1995-03-15 Canon Kabushiki Kaisha Belichtungseinrichtung

Also Published As

Publication number Publication date
DE68922061T2 (de) 1995-08-31
EP0363098A3 (en) 1990-11-14
EP0363098B1 (de) 1995-04-05
US5577552A (en) 1996-11-26
EP0363098A2 (de) 1990-04-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee