DE68919311D1 - Selbstinduzierte Reparatur von Leiterzügen. - Google Patents

Selbstinduzierte Reparatur von Leiterzügen.

Info

Publication number
DE68919311D1
DE68919311D1 DE68919311T DE68919311T DE68919311D1 DE 68919311 D1 DE68919311 D1 DE 68919311D1 DE 68919311 T DE68919311 T DE 68919311T DE 68919311 T DE68919311 T DE 68919311T DE 68919311 D1 DE68919311 D1 DE 68919311D1
Authority
DE
Germany
Prior art keywords
self
conductor tracks
induced repair
repair
induced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68919311T
Other languages
English (en)
Other versions
DE68919311T2 (de
Inventor
Chengjun J Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68919311D1 publication Critical patent/DE68919311D1/de
Application granted granted Critical
Publication of DE68919311T2 publication Critical patent/DE68919311T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
DE68919311T 1988-09-23 1989-07-14 Selbstinduzierte Reparatur von Leiterzügen. Expired - Fee Related DE68919311T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/248,889 US4919971A (en) 1988-09-23 1988-09-23 Self-induced repairing of conductor lines

Publications (2)

Publication Number Publication Date
DE68919311D1 true DE68919311D1 (de) 1994-12-15
DE68919311T2 DE68919311T2 (de) 1995-05-24

Family

ID=22941124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68919311T Expired - Fee Related DE68919311T2 (de) 1988-09-23 1989-07-14 Selbstinduzierte Reparatur von Leiterzügen.

Country Status (4)

Country Link
US (1) US4919971A (de)
EP (1) EP0359930B1 (de)
JP (1) JPH0734502B2 (de)
DE (1) DE68919311T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024725A (en) * 1990-02-06 1991-06-18 International Business Machines Corp. Method for self-inducted repair of circuit shorts and near-shorts
US4994154A (en) * 1990-02-06 1991-02-19 International Business Machines Corporation High frequency electrochemical repair of open circuits
US5022955A (en) * 1990-02-06 1991-06-11 International Business Machines Corporation Apparatus and method for self-induced repair of circuit shorts and near-shorts
US5141602A (en) * 1991-06-18 1992-08-25 International Business Machines Corporation High-productivity method and apparatus for making customized interconnections
US5384953A (en) * 1993-07-21 1995-01-31 International Business Machines Corporation Structure and a method for repairing electrical lines
US5446961A (en) * 1993-10-15 1995-09-05 International Business Machines Corporation Method for repairing semiconductor substrates
US5686207A (en) * 1994-08-08 1997-11-11 Seiko Instruments Inc. Method of forming and repairing a mask for photolithography
US6120669A (en) * 1997-04-16 2000-09-19 Drexel University Bipolar electrochemical connection of materials
US6350363B1 (en) 1997-04-16 2002-02-26 Drexel University Electric field directed construction of diodes using free-standing three-dimensional components
US5972723A (en) * 1997-10-21 1999-10-26 International Business Machines Corporation Enhanced thin film wiring net repair process
US5937269A (en) * 1997-10-29 1999-08-10 International Business Machines Corporation Graphics assisted manufacturing process for thin-film devices
US6048741A (en) * 1997-10-31 2000-04-11 International Business Machines Corporation Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
US6455331B2 (en) 1997-10-31 2002-09-24 International Business Machines Corporation Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
US6248599B1 (en) 1999-10-13 2001-06-19 International Business Machines Corporation Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
US6395164B1 (en) 1999-10-07 2002-05-28 International Business Machines Corporation Copper seed layer repair technique using electroless touch-up
US20030048619A1 (en) * 2001-06-15 2003-03-13 Kaler Eric W. Dielectrophoretic assembling of electrically functional microwires
KR102149014B1 (ko) * 2012-04-05 2020-08-28 엘지전자 주식회사 무선 통신 시스템에서 ｍｂｍｓ 기반 셀 재선택 방법 및 이를 지원하는 장치
JP6507148B2 (ja) * 2014-02-21 2019-04-24 学校法人早稲田大学 自己修復型配線及び伸縮デバイス
CN115038245B (zh) * 2022-06-07 2023-08-11 嘉兴学院 一种基于电迁移现象辅助的柔性电子金属电路的修复方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955959A (en) * 1958-09-22 1960-10-11 Rose Arthur H Du Chemical nickel plating
US3506545A (en) * 1967-02-14 1970-04-14 Ibm Method for plating conductive patterns with high resolution
US3645855A (en) * 1970-08-14 1972-02-29 Ibm Ultrasonic repair plating of microscopic interconnections
US3833375A (en) * 1972-03-09 1974-09-03 Rca Corp Method of repairing an imperfect pattern of metalized portions on a substrate
US4103043A (en) * 1976-02-06 1978-07-25 Ing. C. Olivetti & C., S.P.A. Thermographic printing method
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
US4239789A (en) * 1979-05-08 1980-12-16 International Business Machines Corporation Maskless method for electroless plating patterns
US4259367A (en) * 1979-07-30 1981-03-31 International Business Machines Corporation Fine line repair technique
GB2067845B (en) * 1980-01-23 1984-04-26 Int Computers Ltd Manufacture of printed circuit boards
US4340617A (en) * 1980-05-19 1982-07-20 Massachusetts Institute Of Technology Method and apparatus for depositing a material on a surface
DE3025875A1 (de) * 1980-07-08 1982-02-04 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur reparatur von leiterbahnunterbrechungen
US4349583A (en) * 1981-07-28 1982-09-14 International Business Machines Corporation Laser enhanced maskless method for plating and simultaneous plating and etching of patterns
US4383016A (en) * 1981-09-25 1983-05-10 Ppg Industries, Inc. Method for repairing glass photomasks
US4496900A (en) * 1982-04-30 1985-01-29 International Business Machines Corporation Nonlinearity detection using fault-generated second harmonic
US4615904A (en) * 1982-06-01 1986-10-07 Massachusetts Institute Of Technology Maskless growth of patterned films
US4608117A (en) * 1982-06-01 1986-08-26 Massachusetts Institute Of Technology Maskless growth of patterned films
US4611744A (en) * 1982-06-23 1986-09-16 Refurbished Turbine Components Ltd. Turbine blade repair
EP0130398B1 (de) * 1983-06-29 1991-01-23 Siemens Aktiengesellschaft Verfahren zur Herstellung einer elektrisch leitfähigen Verbindung und Vorrichtung zur Durchführung eines solchen Verfahrens
US4630355A (en) * 1985-03-08 1986-12-23 Energy Conversion Devices, Inc. Electric circuits having repairable circuit lines and method of making the same
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate

Also Published As

Publication number Publication date
EP0359930A2 (de) 1990-03-28
DE68919311T2 (de) 1995-05-24
JPH0734502B2 (ja) 1995-04-12
US4919971A (en) 1990-04-24
EP0359930A3 (de) 1991-04-17
EP0359930B1 (de) 1994-11-09
JPH02116194A (ja) 1990-04-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee