DE68914006D1 - Reflowartiger Lötapparat. - Google Patents

Reflowartiger Lötapparat.

Info

Publication number
DE68914006D1
DE68914006D1 DE89300492T DE68914006T DE68914006D1 DE 68914006 D1 DE68914006 D1 DE 68914006D1 DE 89300492 T DE89300492 T DE 89300492T DE 68914006 T DE68914006 T DE 68914006T DE 68914006 D1 DE68914006 D1 DE 68914006D1
Authority
DE
Germany
Prior art keywords
reflow
soldering device
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89300492T
Other languages
English (en)
Other versions
DE68914006T2 (de
Inventor
Kenshi Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Den Netsu Keiki Co Ltd
Original Assignee
Nihon Den Netsu Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP743288A external-priority patent/JPH064186B2/ja
Priority claimed from JP63105478A external-priority patent/JPH0783177B2/ja
Priority claimed from JP13556688A external-priority patent/JPH0614589B2/ja
Application filed by Nihon Den Netsu Keiki Co Ltd filed Critical Nihon Den Netsu Keiki Co Ltd
Publication of DE68914006D1 publication Critical patent/DE68914006D1/de
Application granted granted Critical
Publication of DE68914006T2 publication Critical patent/DE68914006T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
DE68914006T 1988-01-19 1989-01-19 Reflowartiger Lötapparat. Expired - Fee Related DE68914006T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP743288A JPH064186B2 (ja) 1988-01-19 1988-01-19 リフローはんだ付け装置
JP63105478A JPH0783177B2 (ja) 1988-04-30 1988-04-30 リフローはんだ付け装置
JP13556688A JPH0614589B2 (ja) 1988-06-03 1988-06-03 リフローはんだ付け方法およびその装置

Publications (2)

Publication Number Publication Date
DE68914006D1 true DE68914006D1 (de) 1994-04-28
DE68914006T2 DE68914006T2 (de) 1994-09-08

Family

ID=27277606

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68925040T Expired - Fee Related DE68925040T2 (de) 1988-01-19 1989-01-19 Reflowartiger Lötapparat.
DE68914006T Expired - Fee Related DE68914006T2 (de) 1988-01-19 1989-01-19 Reflowartiger Lötapparat.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE68925040T Expired - Fee Related DE68925040T2 (de) 1988-01-19 1989-01-19 Reflowartiger Lötapparat.

Country Status (4)

Country Link
US (1) US4938410A (de)
EP (2) EP0325451B1 (de)
KR (1) KR910005959B1 (de)
DE (2) DE68925040T2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064187B2 (ja) * 1988-10-04 1994-01-19 権士 近藤 リフローはんだ付け装置
JPH0763839B2 (ja) * 1989-10-06 1995-07-12 日立テクノエンジニアリング株式会社 リフローはんだ付け装置
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5069380A (en) * 1990-06-13 1991-12-03 Carlos Deambrosio Inerted IR soldering system
US5180096A (en) * 1990-07-25 1993-01-19 Nihon Den-Netsu Keiki Co., Ltd. Method and apparatus for reflow-soldering of printed circuit boards
US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
JPH0739483Y2 (ja) * 1990-11-15 1995-09-13 千住金属工業株式会社 リフロー炉
US5195674A (en) * 1991-02-14 1993-03-23 Matsushita Electric Industrial Co., Ltd. Reflow system
US5232145A (en) * 1991-03-29 1993-08-03 Watkins-Johnson Company Method of soldering in a controlled-convection surface-mount reflow furnace
DE4234855B4 (de) * 1991-10-18 2005-02-24 Denso Corp., Kariya Aluminiumhartlötverfahren und Ofen dafür
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5433368A (en) * 1992-11-10 1995-07-18 Spigarelli; Donald J. Soldering system
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
US5547373A (en) * 1993-09-30 1996-08-20 Apv Baker, Inc. Baking oven with integral emissions control apparatus
DE4401790C1 (de) * 1994-01-21 1995-04-06 Smt Maschinengesellschaft Mbh Vorrichtung zur Erzeugung einer Gasströmung in einer Lötanlage
US5524810A (en) * 1994-04-14 1996-06-11 Sikama International, Inc. Solder reflow processor
US5562795A (en) * 1995-02-21 1996-10-08 Kliklok Corporation High speed carton feeding/heat sealing system
US5641341A (en) * 1996-02-14 1997-06-24 Heller Industries Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus
US5797539A (en) * 1996-08-22 1998-08-25 Eastman Kodak Company Circuit board reflow ovens
DE19723894A1 (de) * 1997-06-06 1998-12-10 Seho Systemtechnik Gmbh Prozeßkammer zur thermischen Behandlung von Oberflächen mit einem Prozeßgas
GB9722305D0 (en) * 1997-10-23 1997-12-17 Alphr Technology Limited Method and apparatus
US6672500B2 (en) 1998-06-25 2004-01-06 International Business Machines Corporation Method for producing a reliable solder joint interconnection
US6138893A (en) * 1998-06-25 2000-10-31 International Business Machines Corporation Method for producing a reliable BGA solder joint interconnection
US6050814A (en) * 1998-12-09 2000-04-18 Glasstech, Inc. Forced convection furnace for heating glass sheets
US6728653B1 (en) * 2000-03-21 2004-04-27 Unisys Corporation Method for testing multi-chip packages
US6533577B2 (en) 2001-02-02 2003-03-18 Cvd Equipment Corporation Compartmentalized oven
KR20030059704A (ko) * 2002-01-04 2003-07-10 엘지전자 주식회사 무연 솔더의 리플로우 장치
US8328551B2 (en) * 2002-09-26 2012-12-11 Btu International, Inc. Convection furnace thermal profile enhancement
DE10301102B3 (de) * 2003-01-08 2004-03-25 Siemens Ag Verfahren zum Reinigen von Prozessgas eines Lötofens, sowie Lötofen und Reinigungssystem zur Durchführung des Verfahrens
TW200524500A (en) * 2004-01-07 2005-07-16 Senju Metal Industry Co Reflow furnace and hot-air blowing-type heater
US6991967B2 (en) * 2004-02-23 2006-01-31 Asm Assembly Automation Ltd. Apparatus and method for die attachment
US20060266793A1 (en) * 2005-05-24 2006-11-30 Caterpillar Inc. Purging system having workpiece movement device
DE102005041817A1 (de) * 2005-09-02 2007-03-08 Behr Gmbh & Co. Kg Anlage zum Herstellen von gelöteten Bauteilen
CN100425510C (zh) * 2006-02-22 2008-10-15 广州达意隆包装机械股份有限公司 薄膜热收缩用加热炉
JP4721352B2 (ja) * 2006-06-09 2011-07-13 株式会社タムラ製作所 リフロー炉
EP1927421A3 (de) * 2006-12-01 2010-05-26 Behr GmbH & Co. KG Anlage und Verfahren zum Herstellen von gelöteten Bauteilen
DE102009003495C5 (de) * 2009-02-17 2015-11-19 Hanwha Q.CELLS GmbH Lötverfahren und Lötvorrichtung
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
EP3045253A1 (de) * 2015-01-19 2016-07-20 PVA Industrial Vacuum Systems GmbH Vorrichtung und Verfahren zum Entbindern von Lotpasten im Vakuum-Lötofen
EP3053691A1 (de) * 2015-02-04 2016-08-10 Illinois Tool Works Inc. Reflow Lötofen mit verbessertem Gasreinigungssystem
CN110871299A (zh) * 2018-08-29 2020-03-10 伊利诺斯工具制品有限公司 回流焊炉的降温系统
CN112935450A (zh) * 2019-12-10 2021-06-11 伊利诺斯工具制品有限公司 回流焊炉

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1949716A (en) * 1932-03-10 1934-03-06 Leeds & Northrup Co Method of and apparatus for heattreating
US3752642A (en) * 1969-03-10 1973-08-14 Garrett Corp Apparatus for brazing
FR2149260B1 (de) * 1971-08-09 1974-03-29 Chausson Usines Sa
DE2928156A1 (de) * 1979-07-12 1981-04-16 Verwaltungsgesellschaft Heinrich Neitz GmbH & Co KG, 4930 Detmold Loetofen, insbesondere fuer grossvolumige waermetauscher
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
US4725716A (en) * 1986-02-10 1988-02-16 Northern Telecom Limited Infrared apparatus for infrared soldering components on circuit boards
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
US4757800A (en) * 1987-01-14 1988-07-19 Lincoln Foodservice Products, Inc. Air flow system for a low profile impingement oven
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus

Also Published As

Publication number Publication date
EP0325451A1 (de) 1989-07-26
EP0547047B1 (de) 1995-12-06
EP0547047A2 (de) 1993-06-16
DE68914006T2 (de) 1994-09-08
EP0325451B1 (de) 1994-03-23
KR910005959B1 (ko) 1991-08-09
DE68925040T2 (de) 1996-08-01
KR890012523A (ko) 1989-08-26
EP0547047A3 (en) 1993-11-24
DE68925040D1 (de) 1996-01-18
US4938410A (en) 1990-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee