DE68911419T2 - Hermetisch versiegeltes Gehäuse. - Google Patents
Hermetisch versiegeltes Gehäuse.Info
- Publication number
- DE68911419T2 DE68911419T2 DE89308243T DE68911419T DE68911419T2 DE 68911419 T2 DE68911419 T2 DE 68911419T2 DE 89308243 T DE89308243 T DE 89308243T DE 68911419 T DE68911419 T DE 68911419T DE 68911419 T2 DE68911419 T2 DE 68911419T2
- Authority
- DE
- Germany
- Prior art keywords
- hermetically sealed
- sealed housing
- housing
- hermetically
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S220/00—Receptacles
- Y10S220/29—Welded seam
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connection Of Plates (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
- Arc Welding In General (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/232,197 US4901135A (en) | 1988-08-15 | 1988-08-15 | Hermetically sealed housing with welding seal |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68911419D1 DE68911419D1 (de) | 1994-01-27 |
DE68911419T2 true DE68911419T2 (de) | 1994-05-11 |
Family
ID=22872221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89308243T Expired - Fee Related DE68911419T2 (de) | 1988-08-15 | 1989-08-14 | Hermetisch versiegeltes Gehäuse. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4901135A (de) |
EP (1) | EP0355060B1 (de) |
JP (1) | JPH02142164A (de) |
DE (1) | DE68911419T2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5079387A (en) * | 1990-01-31 | 1992-01-07 | Emerson Electric Co. | Electrical component with enclosure and method of manufacture thereof |
JPH05315734A (ja) * | 1992-05-01 | 1993-11-26 | Mitsubishi Electric Corp | 電子部品の実装基板と実装方法 |
JP2707946B2 (ja) * | 1993-06-07 | 1998-02-04 | 日本電気株式会社 | 気密封止キャップ |
US6075289A (en) * | 1996-10-24 | 2000-06-13 | Tessera, Inc. | Thermally enhanced packaged semiconductor assemblies |
US6089617A (en) * | 1997-07-31 | 2000-07-18 | Hewlett-Packard Company | System for attaching a tubular device to a planar device |
US5988703A (en) * | 1997-07-31 | 1999-11-23 | Hewlett-Packard Company | Fluid connector system for a planar manifold assembly |
US6803520B1 (en) * | 2002-05-03 | 2004-10-12 | Bookham Technology Plc | High speed to-package external interface |
US7053330B2 (en) * | 2004-02-13 | 2006-05-30 | General Motors Corporation | Projection weld-bonding system and method |
US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
US20080053700A1 (en) * | 2006-09-06 | 2008-03-06 | O'connor Kurt F | Sealed electronic component |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2086985A (en) * | 1935-11-21 | 1937-07-13 | Rca Corp | Weld-splash shield |
US2184939A (en) * | 1938-11-23 | 1939-12-26 | Rca Corp | Weld splash shield |
US2796563A (en) * | 1955-06-10 | 1957-06-18 | Bell Telephone Labor Inc | Semiconductive devices |
US2975928A (en) * | 1956-11-23 | 1961-03-21 | Philips Corp | Method of joining two metal parts in a vacuum-tight manner and object manufactured by the use of such method |
US3435871A (en) * | 1967-07-12 | 1969-04-01 | Screw & Bolt Corp Of America | Weld element |
US3740920A (en) * | 1971-05-26 | 1973-06-26 | Us Air Force | Method for packaging hybrid circuits |
US3962662A (en) * | 1975-04-28 | 1976-06-08 | General Electric Company | Metal welding gasket |
JPS52100977A (en) * | 1976-02-20 | 1977-08-24 | Fuji Electric Co Ltd | Hermetic seal type semiconductor device |
JPS5818945A (ja) * | 1981-07-27 | 1983-02-03 | Nec Home Electronics Ltd | 半導体装置のキヤツプ封止方法 |
JPS60103648A (ja) * | 1983-11-10 | 1985-06-07 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
JPS6169152A (ja) * | 1984-09-12 | 1986-04-09 | Nec Corp | 半導体装置 |
-
1988
- 1988-08-15 US US07/232,197 patent/US4901135A/en not_active Expired - Fee Related
-
1989
- 1989-08-08 JP JP1204014A patent/JPH02142164A/ja active Pending
- 1989-08-14 EP EP89308243A patent/EP0355060B1/de not_active Expired - Lifetime
- 1989-08-14 DE DE89308243T patent/DE68911419T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4901135A (en) | 1990-02-13 |
EP0355060A3 (en) | 1990-10-17 |
EP0355060B1 (de) | 1993-12-15 |
DE68911419D1 (de) | 1994-01-27 |
EP0355060A2 (de) | 1990-02-21 |
JPH02142164A (ja) | 1990-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |