DE68909198D1 - Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement. - Google Patents
Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement.Info
- Publication number
- DE68909198D1 DE68909198D1 DE89203140T DE68909198T DE68909198D1 DE 68909198 D1 DE68909198 D1 DE 68909198D1 DE 89203140 T DE89203140 T DE 89203140T DE 68909198 T DE68909198 T DE 68909198T DE 68909198 D1 DE68909198 D1 DE 68909198D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic component
- potting
- resin composition
- casting resin
- potted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8803066A NL8803066A (nl) | 1988-12-15 | 1988-12-15 | Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE68909198D1 true DE68909198D1 (de) | 1993-10-21 |
| DE68909198T2 DE68909198T2 (de) | 1994-03-17 |
Family
ID=19853378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1989609198 Expired - Fee Related DE68909198T2 (de) | 1988-12-15 | 1989-12-11 | Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0376370B1 (de) |
| JP (1) | JPH02212560A (de) |
| DE (1) | DE68909198T2 (de) |
| NL (1) | NL8803066A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2129447T3 (es) * | 1991-05-02 | 1999-06-16 | Univ Kent State Ohio | Dispositivo y material cristalinos de modulacion de luz. |
| WO2018235424A1 (ja) | 2017-06-21 | 2018-12-27 | Dic株式会社 | 活性エステル化合物並びにこれを用いた組成物および硬化物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2930331A1 (de) * | 1978-08-04 | 1980-02-21 | Elkem Spigerverket As | Verfahren zur herstellung von verstaerktem duroplast, mitsamt verstaerkungswerkstoffe zur verwendung bei der herstellung, und ein verfahren zur herstellung der verstaerkungswerkstoffe |
| US4393020A (en) * | 1979-12-20 | 1983-07-12 | The Standard Oil Company | Method for manufacturing a fiber-reinforced thermoplastic molded article |
| US4532275A (en) * | 1981-02-03 | 1985-07-30 | Teijin Limited | Fiber-reinforced composite materials |
| US4703338A (en) * | 1983-10-14 | 1987-10-27 | Daicel Chemical Industries, Ltd. | Resin composition to seal electronic device |
-
1988
- 1988-12-15 NL NL8803066A patent/NL8803066A/nl not_active Application Discontinuation
-
1989
- 1989-12-11 EP EP19890203140 patent/EP0376370B1/de not_active Expired - Lifetime
- 1989-12-11 DE DE1989609198 patent/DE68909198T2/de not_active Expired - Fee Related
- 1989-12-12 JP JP32070589A patent/JPH02212560A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0376370B1 (de) | 1993-09-15 |
| DE68909198T2 (de) | 1994-03-17 |
| NL8803066A (nl) | 1990-07-02 |
| JPH02212560A (ja) | 1990-08-23 |
| EP0376370A1 (de) | 1990-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE68903647T2 (de) | Vorrichtung und verfahren zum herstellen von gegenstaenden durch superplastische formgebung. | |
| DE68924132T2 (de) | Halbleiterbauteil und Verfahren zur dessen Herstellung. | |
| DE59003481D1 (de) | Verfahren zur formgebenden bearbeitung von werkstücken. | |
| DE68917813D1 (de) | Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten. | |
| DE69023410D1 (de) | Verfahren und Vorrichtung zur Herstellung von Pellets. | |
| DE3886461T2 (de) | Verfahren und vorrichtung zum regulieren des einspritzdruckes einer spritzgiessmaschine. | |
| DE68915374D1 (de) | Formmaschine zum spritzprägen und formverfahren durch verwendung derselben. | |
| DE59007663D1 (de) | Verfahren und Vorrichtung zum Herstellen von Giesserei-Formen. | |
| DE3886759D1 (de) | Vorrichtung und verfahren zum giessformen durch einspritz-verdichtung. | |
| DE68914875T2 (de) | Verfahren und Apparat zur Herstellung von Spänen aus magnetisch ausgerichtetem RE-Fe-B-Typ-Material. | |
| ATA207884A (de) | Verfahren und vorrichtung zum herstellen von stapeln aus biegsamen, flaechigen erzeugnissen, insbesondere druckprodukte | |
| DE69101545D1 (de) | Verfahren und vorrichtung zum positionieren von bestandteilen. | |
| DE68902787D1 (de) | Verfahren zur reduktion von carbonylverbindungen. | |
| DE59007672D1 (de) | Verfahren zum Bilden von Gruppen aus (Weich-)Packungen und Vorrichtung hierfür. | |
| AT384773B (de) | Vorrichtung zum herstellen von spritzgussteilen | |
| DE68902013D1 (de) | Vorrichtung und verfahren zum stapeln. | |
| DE69021824T2 (de) | Verfahren zum Spritzgiessen und Vorrichtung dafür. | |
| DE68915761T2 (de) | Verfahren und vorrichtung zum steuern eines spritzgiessvorgangs. | |
| DE68909198D1 (de) | Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement. | |
| DE69021087D1 (de) | Verfahren und vorrichtung zum herstellen von bauteilen aus rüttelbeton. | |
| DE3867681D1 (de) | Verfahren und vorrichtung zum spritzgiessen von reifenlaufflaechen. | |
| DE58907453D1 (de) | Verfahren und Vorrichtung zum Verdichten von Giesserei-Formstoff. | |
| DE3779541D1 (de) | Verfahren zum programmieren eines elektronischen taxameters und entsprechendes elektronisches taxameter. | |
| DE68910263T2 (de) | Vorrichtung und verfahren zum einsspritz-verdichtungsformen. | |
| DE69113676T2 (de) | Vorrichtung und Verfahren zum Präzisionsgiessen. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
| 8339 | Ceased/non-payment of the annual fee |