NL8803066A - Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component. - Google Patents

Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component. Download PDF

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Publication number
NL8803066A
NL8803066A NL8803066A NL8803066A NL8803066A NL 8803066 A NL8803066 A NL 8803066A NL 8803066 A NL8803066 A NL 8803066A NL 8803066 A NL8803066 A NL 8803066A NL 8803066 A NL8803066 A NL 8803066A
Authority
NL
Netherlands
Prior art keywords
fibers
electronic component
casting resin
liquid crystalline
monomers
Prior art date
Application number
NL8803066A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8803066A priority Critical patent/NL8803066A/nl
Priority to DE1989609198 priority patent/DE68909198T2/de
Priority to EP19890203140 priority patent/EP0376370B1/de
Priority to JP32070589A priority patent/JPH02212560A/ja
Publication of NL8803066A publication Critical patent/NL8803066A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
NL8803066A 1988-12-15 1988-12-15 Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component. NL8803066A (nl)

Priority Applications (4)

Application Number Priority Date Filing Date Title
NL8803066A NL8803066A (nl) 1988-12-15 1988-12-15 Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component.
DE1989609198 DE68909198T2 (de) 1988-12-15 1989-12-11 Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement.
EP19890203140 EP0376370B1 (de) 1988-12-15 1989-12-11 Giessharzzusammensetzung, Verfahren zum Vergiessen eines elektronischen Bauelementes und vergossenes elektronisches Bauelement
JP32070589A JPH02212560A (ja) 1988-12-15 1989-12-12 成形材料、電子素子の封入方法及び封入電子素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8803066 1988-12-15
NL8803066A NL8803066A (nl) 1988-12-15 1988-12-15 Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component.

Publications (1)

Publication Number Publication Date
NL8803066A true NL8803066A (nl) 1990-07-02

Family

ID=19853378

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8803066A NL8803066A (nl) 1988-12-15 1988-12-15 Gietharssamenstelling, werkwijze voor het inkapselen van een elektronische component en ingekapselde elektronische component.

Country Status (4)

Country Link
EP (1) EP0376370B1 (de)
JP (1) JPH02212560A (de)
DE (1) DE68909198T2 (de)
NL (1) NL8803066A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992019695A2 (en) * 1991-05-02 1992-11-12 Kent State University Crystalline light modulating device and material
CN110770203B (zh) 2017-06-21 2022-07-15 Dic株式会社 活性酯化合物以及使用其的组合物和固化物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930331A1 (de) * 1978-08-04 1980-02-21 Elkem Spigerverket As Verfahren zur herstellung von verstaerktem duroplast, mitsamt verstaerkungswerkstoffe zur verwendung bei der herstellung, und ein verfahren zur herstellung der verstaerkungswerkstoffe
US4393020A (en) * 1979-12-20 1983-07-12 The Standard Oil Company Method for manufacturing a fiber-reinforced thermoplastic molded article
US4532275A (en) * 1981-02-03 1985-07-30 Teijin Limited Fiber-reinforced composite materials
US4703338A (en) * 1983-10-14 1987-10-27 Daicel Chemical Industries, Ltd. Resin composition to seal electronic device

Also Published As

Publication number Publication date
JPH02212560A (ja) 1990-08-23
DE68909198T2 (de) 1994-03-17
EP0376370A1 (de) 1990-07-04
DE68909198D1 (de) 1993-10-21
EP0376370B1 (de) 1993-09-15

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BV The patent application has lapsed