DE60326810D1 - Gleichrichteranordnung mit Pressverbindungselement - Google Patents

Gleichrichteranordnung mit Pressverbindungselement

Info

Publication number
DE60326810D1
DE60326810D1 DE60326810T DE60326810T DE60326810D1 DE 60326810 D1 DE60326810 D1 DE 60326810D1 DE 60326810 T DE60326810 T DE 60326810T DE 60326810 T DE60326810 T DE 60326810T DE 60326810 D1 DE60326810 D1 DE 60326810D1
Authority
DE
Germany
Prior art keywords
connection element
press connection
rectifier arrangement
rectifier
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60326810T
Other languages
English (en)
Inventor
Tatsumi Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Application granted granted Critical
Publication of DE60326810D1 publication Critical patent/DE60326810D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Synchronous Machinery (AREA)
  • Automatic Assembly (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
DE60326810T 2002-12-16 2003-12-12 Gleichrichteranordnung mit Pressverbindungselement Expired - Lifetime DE60326810D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002364485A JP2004195567A (ja) 2002-12-16 2002-12-16 圧入材、整流素子の圧入方法および整流装置

Publications (1)

Publication Number Publication Date
DE60326810D1 true DE60326810D1 (de) 2009-05-07

Family

ID=32501093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60326810T Expired - Lifetime DE60326810D1 (de) 2002-12-16 2003-12-12 Gleichrichteranordnung mit Pressverbindungselement

Country Status (4)

Country Link
US (1) US7282824B2 (de)
EP (1) EP1437770B1 (de)
JP (1) JP2004195567A (de)
DE (1) DE60326810D1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083609A1 (ja) * 2012-11-27 2014-06-05 三菱電機株式会社 整流装置の製造方法及び整流装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4693385B2 (ja) * 2004-09-29 2011-06-01 三菱電機株式会社 車両用交流発電機
JP4517991B2 (ja) * 2005-09-14 2010-08-04 株式会社ジェイテクト ガイドローラ装置及びガイドローラ装置の製造方法
JP4600366B2 (ja) * 2006-08-29 2010-12-15 株式会社デンソー 車両用交流発電機
KR101163569B1 (ko) 2008-06-09 2012-07-09 한국델파이주식회사 차량용 교류 발전기
FR2940379B1 (fr) * 2008-12-19 2011-01-28 Stephane Rey Douille a aiguilles a bague exterieure ayant une face cylindrique exterieure comportant un reseau d'elements en creux
TWM407546U (en) * 2010-11-11 2011-07-11 Victory Ind Corp Improved structure of heat sink module
JP5439430B2 (ja) * 2011-05-17 2014-03-12 日立オートモティブシステムズ株式会社 車両用交流発電機
JP5924142B2 (ja) * 2011-07-09 2016-05-25 株式会社デンソー 車両用交流発電機
CN102868259A (zh) * 2011-07-09 2013-01-09 株式会社电装 车辆用交流发电机
DE102013105807B4 (de) * 2013-06-05 2023-11-09 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Lageraufnahme mit Lager
DE102013225984B4 (de) * 2013-12-16 2017-03-23 Schaeffler Technologies AG & Co. KG Hydraulische Spannvorrichtung für einen Zugmitteltrieb

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GB256353A (en) * 1925-05-27 1926-08-12 Douglas Motors Ltd Improvements in the manufacture of cam mechanism
US3198874A (en) * 1961-01-23 1965-08-03 Standard Pressed Steel Co Semi-conductor housings and method of making the same
US4118134A (en) * 1974-04-08 1978-10-03 Lescoa, Inc. Fastener joint and method thereof
DE2603786C2 (de) * 1976-01-31 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart Gleichrichteranordnung
SE416664B (sv) * 1977-03-08 1981-01-26 Gkn Stenman Ab Lasroddare
US4375333A (en) * 1980-10-16 1983-03-01 Leeds & Northrup Company Microprocessor directed optical pyrometer
DE3124692A1 (de) * 1981-06-24 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "halbleitergleichrichter"
JPS5968586A (ja) * 1982-10-13 1984-04-18 Hitachi Ltd ロ−タリベ−ン型圧縮機及びその製造方法
US4943178A (en) * 1986-05-08 1990-07-24 Illinois Tool Works, Inc. Mounting structure for rotating bodies
JPH0229262Y2 (de) * 1986-09-30 1990-08-06
JPH0529370Y2 (de) * 1987-01-19 1993-07-28
JPH0672616B2 (ja) * 1987-04-21 1994-09-14 株式会社ゼクセル 鋼シャフト複合アルミニウム合金ローター
DE3931447A1 (de) * 1989-09-21 1991-04-04 Skf Gmbh Anordnung zur axialen lagesicherung eines waelzlagerringes
JPH078914Y2 (ja) * 1988-12-09 1995-03-06 光洋精工株式会社 軸体と環体の結合構造
EP0486876B2 (de) * 1990-11-19 1998-12-30 NIPPON PISTON RING CO., Ltd. Maschinenelement mit mindestens einem mit Druck auf einer Welle befestigten Verbindungsteil
JP3279329B2 (ja) 1991-11-01 2002-04-30 クルップ・プレスタ・アーゲー カムシャフトの製造装置
US5207525A (en) * 1992-04-27 1993-05-04 Delco Electronics Corporation Instrument spindle with relief design
JP2790614B2 (ja) 1994-09-02 1998-08-27 共栄精工株式会社 冷間プレスによる輪体成形方法
DE19517258A1 (de) * 1995-05-11 1996-11-14 Alpha Getriebebau Gmbh Wellen-Befestigung
JP3284887B2 (ja) * 1995-06-23 2002-05-20 トヨタ自動車株式会社 しまり嵌合方法およびしまり嵌合装置
FR2737618B1 (fr) * 1995-08-02 1997-10-24 Valeo Equip Electr Moteur Alternateur comportant des pieces d'adaptation pour diodes de pont redresseur, notamment pour vehicule automobile, et piece d'adaptation pour un tel alternateur
JP3426101B2 (ja) * 1997-02-25 2003-07-14 三菱電機株式会社 整流装置
US5882131A (en) * 1997-03-11 1999-03-16 Hewlett-Packard Company Printer drive roller with grit-blasted surface
JP2000042845A (ja) 1998-07-28 2000-02-15 Toyota Motor Corp 慣性圧入方法
JP2002119029A (ja) 2000-10-12 2002-04-19 Denso Corp 車両用交流発電機
US6661662B2 (en) * 2001-02-21 2003-12-09 Transpo Electronics, Inc. Vehicular modular design multiple application rectifier assembly
JP4056751B2 (ja) * 2002-01-28 2008-03-05 株式会社デンソー 車両用交流発電機の整流装置
US6731031B2 (en) * 2002-10-08 2004-05-04 Delphi Technologies, Inc. Apparatus and method for heat sink device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083609A1 (ja) * 2012-11-27 2014-06-05 三菱電機株式会社 整流装置の製造方法及び整流装置

Also Published As

Publication number Publication date
JP2004195567A (ja) 2004-07-15
EP1437770A2 (de) 2004-07-14
US7282824B2 (en) 2007-10-16
EP1437770A3 (de) 2004-09-22
US20040150273A1 (en) 2004-08-05
EP1437770B1 (de) 2009-03-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition