DE60307609D1 - Vorrichtung zur begrenzung eines plasmas in einem volumen - Google Patents

Vorrichtung zur begrenzung eines plasmas in einem volumen

Info

Publication number
DE60307609D1
DE60307609D1 DE60307609T DE60307609T DE60307609D1 DE 60307609 D1 DE60307609 D1 DE 60307609D1 DE 60307609 T DE60307609 T DE 60307609T DE 60307609 T DE60307609 T DE 60307609T DE 60307609 D1 DE60307609 D1 DE 60307609D1
Authority
DE
Germany
Prior art keywords
plasma
magnets
housing
volume
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60307609T
Other languages
English (en)
Other versions
DE60307609T2 (de
Inventor
Ana Lacoste
Alban-Marie Arnal
Stephane Bechu
Jacques Pelletier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Original Assignee
Centre National de la Recherche Scientifique CNRS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique CNRS filed Critical Centre National de la Recherche Scientifique CNRS
Application granted granted Critical
Publication of DE60307609D1 publication Critical patent/DE60307609D1/de
Publication of DE60307609T2 publication Critical patent/DE60307609T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means
    • H01J37/32688Multi-cusp fields

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Discharge Heating (AREA)
  • Measurement Of Radiation (AREA)
DE60307609T 2002-03-28 2003-02-27 Vorrichtung zur begrenzung eines plasmas in einem volumen Expired - Lifetime DE60307609T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0203900A FR2838020B1 (fr) 2002-03-28 2002-03-28 Dispositif de confinement de plasma
FR0203900 2002-03-28
PCT/FR2003/000634 WO2003083893A1 (fr) 2002-03-28 2003-02-27 Dispositif de confinement d'un plasma dans un volume

Publications (2)

Publication Number Publication Date
DE60307609D1 true DE60307609D1 (de) 2006-09-28
DE60307609T2 DE60307609T2 (de) 2007-08-23

Family

ID=27839276

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60307609T Expired - Lifetime DE60307609T2 (de) 2002-03-28 2003-02-27 Vorrichtung zur begrenzung eines plasmas in einem volumen

Country Status (8)

Country Link
US (1) US7304435B2 (de)
EP (1) EP1488443B1 (de)
JP (1) JP2005527941A (de)
AT (1) ATE336801T1 (de)
AU (1) AU2003224228A1 (de)
DE (1) DE60307609T2 (de)
FR (1) FR2838020B1 (de)
WO (1) WO2003083893A1 (de)

Families Citing this family (24)

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Publication number Priority date Publication date Assignee Title
FR2904178B1 (fr) 2006-07-21 2008-11-07 Centre Nat Rech Scient Dispositif et procede de production et/ou de confinement d'un plasma
FR2922358B1 (fr) 2007-10-16 2013-02-01 Hydromecanique & Frottement Procede de traitement de surface d'au moins une piece au moyen de sources elementaires de plasma par resonance cyclotronique electronique
GB2461094B (en) * 2008-06-20 2012-08-22 Mantis Deposition Ltd Deposition of materials
FR2938150B1 (fr) 2008-10-30 2010-12-17 Centre Nat Rech Scient Dispositif et procede de production et/ou de confinement d'un plasma
US9111729B2 (en) 2009-12-03 2015-08-18 Lam Research Corporation Small plasma chamber systems and methods
US9190289B2 (en) * 2010-02-26 2015-11-17 Lam Research Corporation System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas
US8999104B2 (en) 2010-08-06 2015-04-07 Lam Research Corporation Systems, methods and apparatus for separate plasma source control
US9967965B2 (en) 2010-08-06 2018-05-08 Lam Research Corporation Distributed, concentric multi-zone plasma source systems, methods and apparatus
US9449793B2 (en) 2010-08-06 2016-09-20 Lam Research Corporation Systems, methods and apparatus for choked flow element extraction
US9155181B2 (en) 2010-08-06 2015-10-06 Lam Research Corporation Distributed multi-zone plasma source systems, methods and apparatus
US9177762B2 (en) 2011-11-16 2015-11-03 Lam Research Corporation System, method and apparatus of a wedge-shaped parallel plate plasma reactor for substrate processing
US10283325B2 (en) 2012-10-10 2019-05-07 Lam Research Corporation Distributed multi-zone plasma source systems, methods and apparatus
US9083182B2 (en) 2011-11-21 2015-07-14 Lam Research Corporation Bypass capacitors for high voltage bias power in the mid frequency RF range
US8872525B2 (en) 2011-11-21 2014-10-28 Lam Research Corporation System, method and apparatus for detecting DC bias in a plasma processing chamber
US10586686B2 (en) 2011-11-22 2020-03-10 Law Research Corporation Peripheral RF feed and symmetric RF return for symmetric RF delivery
US8898889B2 (en) 2011-11-22 2014-12-02 Lam Research Corporation Chuck assembly for plasma processing
US9263240B2 (en) * 2011-11-22 2016-02-16 Lam Research Corporation Dual zone temperature control of upper electrodes
US9396908B2 (en) 2011-11-22 2016-07-19 Lam Research Corporation Systems and methods for controlling a plasma edge region
CN104024477B (zh) * 2011-11-23 2016-05-18 朗姆研究公司 多区域气体注入上电极系统
KR102011535B1 (ko) 2011-11-24 2019-08-16 램 리써치 코포레이션 가요성 있는 대칭적 rf 복귀 스트랩을 갖는 플라즈마 프로세싱 챔버
FR2984769B1 (fr) 2011-12-22 2014-03-07 Total Sa Procede de texturation de la surface d'un substrat de silicium, substrat structure et dispositif photovoltaique comportant un tel substrat structure
FR2993429B1 (fr) 2012-07-11 2016-08-05 Centre Nat De La Rech Scient (Cnrs) Applicateur micro-onde coaxial pour la production de plasma
CN103052249A (zh) * 2013-01-11 2013-04-17 哈尔滨工业大学 一种射流等离子体密度分布调节器
US20230107392A1 (en) * 2021-10-01 2023-04-06 Applied Materials, Inc Method and apparatus for generating plasma with ion blocker plate

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
FR2583250B1 (fr) * 1985-06-07 1989-06-30 France Etat Procede et dispositif d'excitation d'un plasma par micro-ondes a la resonance cyclotronique electronique
FR2595868B1 (fr) * 1986-03-13 1988-05-13 Commissariat Energie Atomique Source d'ions a resonance cyclotronique electronique a injection coaxiale d'ondes electromagnetiques
KR920002864B1 (ko) * 1987-07-20 1992-04-06 가부시기가이샤 히다찌세이사꾸쇼 플라즈마 처리방법 및 그 장치
JPH01297141A (ja) * 1988-05-25 1989-11-30 Canon Inc マイクロ波プラズマ処理装置
JP2709162B2 (ja) * 1989-11-15 1998-02-04 株式会社日立製作所 マイクロ波プラズマ処理装置
US5252178A (en) * 1992-06-24 1993-10-12 Texas Instruments Incorporated Multi-zone plasma processing method and apparatus
US5290416A (en) * 1992-07-10 1994-03-01 Read-Rite Corporation Unidirectional field generator
JPH06181187A (ja) * 1992-12-11 1994-06-28 Hitachi Ltd スパッタリング装置
JP3142408B2 (ja) * 1993-01-21 2001-03-07 ティーディーケイ株式会社 プラズマ処理装置
JP3210207B2 (ja) * 1994-04-20 2001-09-17 東京エレクトロン株式会社 プラズマ処理装置
JP2875221B2 (ja) * 1996-11-15 1999-03-31 ニチメン電子工研株式会社 プラズマ発生装置
JPH10270428A (ja) * 1997-03-27 1998-10-09 Mitsubishi Electric Corp プラズマ処理装置
JPH10303182A (ja) * 1997-04-23 1998-11-13 Sumitomo Metal Ind Ltd プラズマ処理方法、プラズマ処理装置及び半導体装置の製造方法
US6051151A (en) * 1997-11-12 2000-04-18 International Business Machines Corporation Apparatus and method of producing a negative ion plasma
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
US7067034B2 (en) * 2000-03-27 2006-06-27 Lam Research Corporation Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma
US6436252B1 (en) * 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
US6683425B1 (en) * 2002-02-05 2004-01-27 Novellus Systems, Inc. Null-field magnetron apparatus with essentially flat target

Also Published As

Publication number Publication date
EP1488443B1 (de) 2006-08-16
FR2838020B1 (fr) 2004-07-02
WO2003083893A1 (fr) 2003-10-09
DE60307609T2 (de) 2007-08-23
JP2005527941A (ja) 2005-09-15
US20050184670A1 (en) 2005-08-25
AU2003224228A1 (en) 2003-10-13
FR2838020A1 (fr) 2003-10-03
US7304435B2 (en) 2007-12-04
EP1488443A1 (de) 2004-12-22
ATE336801T1 (de) 2006-09-15

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Legal Events

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8364 No opposition during term of opposition