DE60238108D1 - Formen von schutzkappen - Google Patents

Formen von schutzkappen

Info

Publication number
DE60238108D1
DE60238108D1 DE60238108T DE60238108T DE60238108D1 DE 60238108 D1 DE60238108 D1 DE 60238108D1 DE 60238108 T DE60238108 T DE 60238108T DE 60238108 T DE60238108 T DE 60238108T DE 60238108 D1 DE60238108 D1 DE 60238108D1
Authority
DE
Germany
Prior art keywords
sheet
shapes
caps
protective caps
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238108T
Other languages
English (en)
Inventor
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Application granted granted Critical
Publication of DE60238108D1 publication Critical patent/DE60238108D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/503—Removing moulded articles using ejector pins, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0127—Using a carrier for applying a plurality of packaging lids to the system wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
DE60238108T 2001-01-10 2002-01-08 Formen von schutzkappen Expired - Lifetime DE60238108D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR2449A AUPR244901A0 (en) 2001-01-10 2001-01-10 A method (WSM02)
PCT/AU2002/000009 WO2002056375A1 (en) 2001-01-10 2002-01-08 Molding of protective caps

Publications (1)

Publication Number Publication Date
DE60238108D1 true DE60238108D1 (de) 2010-12-09

Family

ID=3826484

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238108T Expired - Lifetime DE60238108D1 (de) 2001-01-10 2002-01-08 Formen von schutzkappen

Country Status (7)

Country Link
US (2) US20030102603A1 (de)
EP (1) EP1356513B1 (de)
JP (1) JP4197947B2 (de)
AT (1) ATE485932T1 (de)
AU (2) AUPR244901A0 (de)
DE (1) DE60238108D1 (de)
WO (1) WO2002056375A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920172B2 (ja) * 2002-08-26 2007-05-30 Ｎｅｃエレクトロニクス株式会社 蓋保持フレーム及び電子部品の封止方法
US7018867B2 (en) * 2003-02-06 2006-03-28 Intel Corporation Fabricating stacked chips using fluidic templated-assembly
WO2007026605A1 (ja) * 2005-08-30 2007-03-08 Riken 微細パターン形成方法
US8293165B2 (en) * 2005-11-15 2012-10-23 Techno Polymer Co., Ltd. Resin forming method and resin forming apparatus
US7682860B2 (en) * 2006-03-21 2010-03-23 Dalsa Semiconductor Inc. Protection capsule for MEMS devices
JP4956270B2 (ja) * 2007-05-14 2012-06-20 テクノポリマー株式会社 樹脂成形方法及び樹脂成形装置
EP2098478A1 (de) * 2008-03-07 2009-09-09 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Herstellung von Mikrokomponenten mit einer Abdeckungsstruktur
DE102016105440A1 (de) * 2016-03-23 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Komponenten unter Verwendung von Funktionselementen
KR102352901B1 (ko) * 2016-08-01 2022-01-19 닝보 써니 오포테크 코., 엘티디. 촬영 모듈과 그 몰딩 회로기판 컴포넌트 및 몰딩 감광 컴포넌트와 제조방법
CA3014989C (en) * 2017-05-03 2020-03-24 Nanotech Security Corp. Methods for micro and nano fabrication by selective template removal

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846521A (en) * 1971-02-03 1974-11-05 Union Carbide Corp Low energy electron beam treatment of polymeric films, and apparatus therefore
US4010088A (en) * 1972-11-14 1977-03-01 Japan Atomic Energy Research Institute Process for preparing highly-cured transparent resin molded products
US4370189A (en) * 1980-12-16 1983-01-25 Phillips Petroleum Company Modifying thermoplastic materials and products thereof
JPS59211238A (ja) * 1983-05-17 1984-11-30 Nec Kyushu Ltd 半導体集積回路の封止用金型
GB8413330D0 (en) * 1984-05-24 1984-06-27 Mbm Technology Ltd Mounting semi-conductor chips
US5447679A (en) * 1990-07-18 1995-09-05 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. Process of producing plastic plates with wells by placing a film on a mold and applying hot gas
JPH06263164A (ja) * 1993-03-12 1994-09-20 Urawa Polymer Kk キャリアテープおよびその製造方法
DE4307869C2 (de) * 1993-03-12 1996-04-04 Microparts Gmbh Mikrostrukturkörper und Verfahren zu deren Herstellung
JPH06347475A (ja) * 1993-06-08 1994-12-22 Murata Mfg Co Ltd 加速度センサおよびその製造方法
JP3496347B2 (ja) * 1995-07-13 2004-02-09 株式会社デンソー 半導体装置及びその製造方法
US5640746A (en) * 1995-08-15 1997-06-24 Motorola, Inc. Method of hermetically encapsulating a crystal oscillator using a thermoplastic shell
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US5923995A (en) * 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems

Also Published As

Publication number Publication date
US20030102603A1 (en) 2003-06-05
JP4197947B2 (ja) 2008-12-17
JP2004524184A (ja) 2004-08-12
EP1356513B1 (de) 2010-10-27
EP1356513A4 (de) 2006-05-17
AU2002216846B2 (en) 2004-03-18
AUPR244901A0 (en) 2001-02-01
ATE485932T1 (de) 2010-11-15
EP1356513A1 (de) 2003-10-29
US20020089097A1 (en) 2002-07-11
WO2002056375A1 (en) 2002-07-18

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