DE60230830D1 - Zusammensetzung für Isolierfilmbildung - Google Patents

Zusammensetzung für Isolierfilmbildung

Info

Publication number
DE60230830D1
DE60230830D1 DE60230830T DE60230830T DE60230830D1 DE 60230830 D1 DE60230830 D1 DE 60230830D1 DE 60230830 T DE60230830 T DE 60230830T DE 60230830 T DE60230830 T DE 60230830T DE 60230830 D1 DE60230830 D1 DE 60230830D1
Authority
DE
Germany
Prior art keywords
composition
insulating film
film formation
formation
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60230830T
Other languages
English (en)
Inventor
Noriyasu Shinohara
Kaori Shirato
Michinori Nishikawa
Takashi Okada
Kinji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60230830D1 publication Critical patent/DE60230830D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09D171/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312—Organic layers, e.g. photoresist
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Paints Or Removers (AREA)
  • Polyethers (AREA)
DE60230830T 2001-03-26 2002-03-25 Zusammensetzung für Isolierfilmbildung Expired - Lifetime DE60230830D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001088033A JP5320653B2 (ja) 2001-03-26 2001-03-26 膜形成用組成物および絶縁膜形成用材料

Publications (1)

Publication Number Publication Date
DE60230830D1 true DE60230830D1 (de) 2009-03-05

Family

ID=18943183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60230830T Expired - Lifetime DE60230830D1 (de) 2001-03-26 2002-03-25 Zusammensetzung für Isolierfilmbildung

Country Status (6)

Country Link
US (1) US6852370B2 (de)
EP (1) EP1245638B1 (de)
JP (1) JP5320653B2 (de)
KR (1) KR100885368B1 (de)
DE (1) DE60230830D1 (de)
TW (1) TW583262B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3606224B2 (ja) * 2001-04-27 2005-01-05 Ｊｓｒ株式会社 重合体及びその製造方法、並びにそれを含有する膜形成用組成物
US10014475B2 (en) 2013-04-17 2018-07-03 Empire Technology Development Llc Graphene nanoribbons as semiconductors for organic thin film transistors
CN104650593B (zh) * 2013-11-20 2018-02-23 弗洛里光电材料（苏州）有限公司 一种有机硅组合物、制备方法及其使用其的半导体装置
KR101992951B1 (ko) * 2016-11-30 2019-06-25 이근수 공중합체, 이를 포함하는 반도체 소자, 이를 포함하는 조성물 및 공중합체 제조방법
US9985316B1 (en) * 2017-02-24 2018-05-29 Wildcat Discovery Technologies, Inc Electrolyte additives

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3384588A (en) * 1964-11-17 1968-05-21 Texaco Inc Lubricants containing p-polyphenyl
GB1404247A (en) 1973-03-21 1975-08-28 Zbrojovka Brno Np Protective coatings on metals and alloys
DE2452532C3 (de) * 1974-11-06 1978-08-24 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Polyisocyanaten mit Isocyanurat-Struktur
US4186255A (en) * 1978-03-13 1980-01-29 Texaco Development Corporation Bis-quaternary ammonium salts as polyisocyanurate catalysts
CA1112243A (en) * 1978-09-08 1981-11-10 Manfred Bock Process for the preparation of polyisocyanates containing isocyanurate groups and the use thereof
DE3314790A1 (de) * 1983-04-23 1984-10-25 Basf Ag, 6700 Ludwigshafen Mehrstufenverfahren zur herstellung von 3-isocyanatomethyl-3,5,5-trimethyl-cyclohexylisocyanat
DE3314788A1 (de) * 1983-04-23 1984-10-25 Basf Ag, 6700 Ludwigshafen Mehrstufenverfahren zur herstellung von hexamethylendiisocyanat-1,6 und/oder isomeren aliphatischen diisocyanaten mit 6 kohlenstoffatomen im alkylenrest
US4503226A (en) * 1984-04-30 1985-03-05 Olin Corporation Process for trimerizing organic polyisocyanates
FR2579205B1 (fr) * 1985-03-25 1987-05-15 Rhone Poulenc Spec Chim Procede de preparation de polyisocyanates polyisocyanurates par cyclotrimerisation catalytique de polyisocyanates
DE3828033A1 (de) * 1988-08-18 1990-03-08 Huels Chemische Werke Ag Kreislaufverfahren zur herstellung von (cyclo)aliphatischen diisocyanaten
CA2083014C (en) 1991-11-18 2003-06-24 David J. Romenesko Poly(phenylene ether) resin modified with silicone rubber powder
US5221743A (en) * 1992-03-02 1993-06-22 Olin Corporation Process for producing isocyanurates by cyclotrimerizing isocyanates using polymer-bound catalysts
US5258482A (en) * 1992-06-12 1993-11-02 Miles Inc. Polyisocyanates containing allophanate and isocyanurate groups, a process for their production from a mixture of diisocyanates and their use in two-component coating compositions
US5552503A (en) * 1993-12-22 1996-09-03 At&T Corp. Photodefinable dielectric layers comprising poly(aromatic diacetylenes)
KR100505778B1 (ko) * 1996-11-20 2005-10-26 제이에스알 가부시끼가이샤 경화성수지조성물및경화물
EP0875906B1 (de) * 1997-04-30 2004-04-07 JSR Corporation Elektronisches Teil und Verfahren zu seiner Herstellung
WO1999003926A1 (fr) * 1997-07-15 1999-01-28 Asahi Kasei Kogyo Kabushiki Kaisha Composition alcoxysilane/polymere organique destinee a la production de fines pellicules isolantes et procede d'utilisation
US6060170A (en) * 1998-02-25 2000-05-09 Air Products And Chemicals, Inc. Functional groups for thermal crosslinking of polymeric systems
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Ｊｓｒ株式会社 電子部品およびその製造方法
JPH11323256A (ja) * 1998-05-18 1999-11-26 Jsr Corp 膜形成用組成物、膜の形成方法および多孔質膜
US6184284B1 (en) * 1998-08-24 2001-02-06 The Dow Chemical Company Adhesion promoter and self-priming resin compositions and articles made therefrom
JP2000119600A (ja) * 1998-10-12 2000-04-25 Jsr Corp 膜形成用組成物、膜の製造方法および多孔質膜
JP2000345041A (ja) * 1999-06-04 2000-12-12 Jsr Corp 膜形成用組成物、膜形成用組成物の製造方法および絶縁膜形成用材料
JP4069553B2 (ja) * 1999-08-17 2008-04-02 Ｊｓｒ株式会社 フェニレン基含有共重合体の製造方法、膜形成材料、絶縁材料、光学材料、処理方法及びフェニレン基含有共重合体膜
JP2001072927A (ja) * 1999-09-08 2001-03-21 Sumitomo Chem Co Ltd 膜形成用塗布液および絶縁膜
US6346296B1 (en) 1999-09-14 2002-02-12 Alliedsignal Inc. Highly stable packaging substrates
US6468589B2 (en) 2000-02-02 2002-10-22 Jsr Corporation Composition for film formation and insulating film
KR20010112887A (ko) * 2000-06-15 2001-12-22 이구택 선재압연시 선단부 벌어짐이 없는 Ｂｉ-Ｓ계 쾌삭강 빌렛및 그 제조방법
JP4697361B2 (ja) * 2000-07-24 2011-06-08 Ｊｓｒ株式会社 膜形成用組成物および絶縁膜形成用材料

Also Published As

Publication number Publication date
EP1245638B1 (de) 2009-01-14
US20020172652A1 (en) 2002-11-21
TW583262B (en) 2004-04-11
KR20020076126A (ko) 2002-10-09
JP2002285080A (ja) 2002-10-03
US6852370B2 (en) 2005-02-08
EP1245638A1 (de) 2002-10-02
JP5320653B2 (ja) 2013-10-23
KR100885368B1 (ko) 2009-02-26

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