DE60224710D1 - Halbleiterbauelement, karte, verfahren zur initialisierung und zur prüfung ihrer authentizität und ihrer identität - Google Patents

Halbleiterbauelement, karte, verfahren zur initialisierung und zur prüfung ihrer authentizität und ihrer identität

Info

Publication number
DE60224710D1
DE60224710D1 DE60224710T DE60224710T DE60224710D1 DE 60224710 D1 DE60224710 D1 DE 60224710D1 DE 60224710 T DE60224710 T DE 60224710T DE 60224710 T DE60224710 T DE 60224710T DE 60224710 D1 DE60224710 D1 DE 60224710D1
Authority
DE
Germany
Prior art keywords
authenticity
actual value
initializing
verifying
identity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60224710T
Other languages
English (en)
Other versions
DE60224710T2 (de
Inventor
Jongh Petra E De
Edwin Roks
Robertus A Wolters
Hermanus L Peek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Publication of DE60224710D1 publication Critical patent/DE60224710D1/de
Application granted granted Critical
Publication of DE60224710T2 publication Critical patent/DE60224710T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Storage Device Security (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE60224710T 2001-11-28 2002-11-28 Halbleiterbauelement, karte, verfahren zur initialisierung und zur prüfung ihrer authentizität und ihrer identität Expired - Lifetime DE60224710T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP01204589 2001-11-28
EP01204589 2001-11-28
PCT/IB2002/005191 WO2003046802A2 (en) 2001-11-28 2002-11-28 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof

Publications (2)

Publication Number Publication Date
DE60224710D1 true DE60224710D1 (de) 2008-03-06
DE60224710T2 DE60224710T2 (de) 2008-06-05

Family

ID=8181324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60224710T Expired - Lifetime DE60224710T2 (de) 2001-11-28 2002-11-28 Halbleiterbauelement, karte, verfahren zur initialisierung und zur prüfung ihrer authentizität und ihrer identität

Country Status (9)

Country Link
US (1) US7309907B2 (de)
EP (1) EP1451759B1 (de)
JP (1) JP4511182B2 (de)
KR (1) KR20040060994A (de)
CN (1) CN100382307C (de)
AT (1) ATE384304T1 (de)
AU (1) AU2002365497A1 (de)
DE (1) DE60224710T2 (de)
WO (1) WO2003046802A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002353267A1 (en) * 2001-11-28 2003-06-10 Koninklijke Philips Electronics N.V. Semiconductor device, and means for checking the authenticity
AU2003216618A1 (en) * 2002-04-09 2003-10-20 Koninklijke Philips Electronics N.V. Method and arrangement for protecting a chip and checking its authenticity
JP2007514987A (ja) * 2003-05-26 2007-06-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体デバイス、認証方法およびシステム
DE102004019367B4 (de) * 2004-04-21 2006-03-16 Infineon Technologies Ag Verfahren zum Verifizieren von elektronischen Schaltungseinheiten und Vorrichtung zur Durchführung des Verfahrens
US20080192446A1 (en) 2007-02-09 2008-08-14 Johannes Hankofer Protection For Circuit Boards
WO2008099348A2 (en) * 2007-02-16 2008-08-21 Nxp B.V. Semiconductor device identifier generation
US8522051B2 (en) * 2007-05-07 2013-08-27 Infineon Technologies Ag Protection for circuit boards
WO2009016589A2 (en) * 2007-08-02 2009-02-05 Nxp B.V. Tamper-resistant semiconductor device and methods of manufacturing thereof
KR101322267B1 (ko) * 2008-06-12 2013-10-25 엘지디스플레이 주식회사 액정표시장치용 어레이 기판 및 그 제조방법
CN102265395B (zh) 2008-12-29 2013-10-16 Nxp股份有限公司 用于物理不可复制功能的物理结构
EP2256702A1 (de) 2009-05-28 2010-12-01 Dmitri Pakhomov Tragbarer Kartenbeschreiber, Kartensystem und Verfahren zur Verwendung eines tragbaren Kartenbeschreibers
EP2665094A1 (de) 2012-05-15 2013-11-20 Nxp B.V. Manipulationssichere IC
US9363261B2 (en) * 2013-05-02 2016-06-07 Sync-N-Scale, Llc Synchronous timestamp computer authentication system and method
US9342710B2 (en) * 2013-11-21 2016-05-17 Nxp B.V. Electronic tamper detection
JP6516146B2 (ja) * 2015-03-02 2019-05-22 国立大学法人神戸大学 発振回路装置及び半導体装置、並びに半導体装置の真正性検出方法
US9735105B2 (en) * 2015-10-16 2017-08-15 Nokia Technologies Oy Integrated secure device
AT519490B1 (de) * 2016-12-30 2020-01-15 Avl List Gmbh Kommunikation eines Netzwerkknotens in einem Datennetz

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2617979B1 (fr) * 1987-07-10 1989-11-10 Thomson Semiconducteurs Dispositif de detection de la depassivation d'un circuit integre
US5032708A (en) * 1989-08-10 1991-07-16 International Business Machines Corp. Write-once-read-once batteryless authentication token
GB2244164A (en) * 1990-05-18 1991-11-20 Philips Electronic Associated Fingerprint sensing
US5426373A (en) * 1992-09-30 1995-06-20 The United States Of America As Represented By The Secretary Of The Navy Two electrode device for determining electrical properties of a material on a metal substratum
FR2738971B1 (fr) * 1995-09-19 1997-10-10 Schlumberger Ind Sa Procede de determination d'une cle de cryptage associee a un circuit integre
AT408925B (de) * 1996-10-22 2002-04-25 Posch Reinhard Dr Anordnung zum schutz von elektronischen recheneinheiten, insbesondere von chipkarten
DE19737324A1 (de) * 1997-08-28 1999-03-04 Philips Patentverwaltung Vielschichtkondensator mit silber- und seltenerdmetalldotiertem Bariumtitanat
DE19737693A1 (de) * 1997-08-29 1999-03-04 Philips Patentverwaltung Verfahren zur Überprüfung der Unverfälschtheit einer elektrischen Schaltung
WO1999065074A2 (en) * 1998-06-10 1999-12-16 Koninklijke Philips Electronics N.V. Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
US7005733B2 (en) * 1999-12-30 2006-02-28 Koemmerling Oliver Anti tamper encapsulation for an integrated circuit
US6774643B2 (en) * 2001-03-21 2004-08-10 Signature Control Systems Non-bridged single electrode impedance measurement system for determining a condition of a dielectric according to impedance related changes over a range of frequencies
AU2002353267A1 (en) * 2001-11-28 2003-06-10 Koninklijke Philips Electronics N.V. Semiconductor device, and means for checking the authenticity
AU2003216618A1 (en) * 2002-04-09 2003-10-20 Koninklijke Philips Electronics N.V. Method and arrangement for protecting a chip and checking its authenticity

Also Published As

Publication number Publication date
WO2003046802A2 (en) 2003-06-05
AU2002365497A8 (en) 2003-06-10
KR20040060994A (ko) 2004-07-06
WO2003046802A3 (en) 2004-02-26
EP1451759A2 (de) 2004-09-01
US7309907B2 (en) 2007-12-18
CN1596470A (zh) 2005-03-16
DE60224710T2 (de) 2008-06-05
EP1451759B1 (de) 2008-01-16
ATE384304T1 (de) 2008-02-15
CN100382307C (zh) 2008-04-16
JP4511182B2 (ja) 2010-07-28
JP2005510863A (ja) 2005-04-21
US20050021993A1 (en) 2005-01-27
AU2002365497A1 (en) 2003-06-10

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