DE60220973D1 - Material mit keiner Wärmeausdehnung und praktische Bauteile, die dieses Material verwenden - Google Patents

Material mit keiner Wärmeausdehnung und praktische Bauteile, die dieses Material verwenden

Info

Publication number
DE60220973D1
DE60220973D1 DE60220973T DE60220973T DE60220973D1 DE 60220973 D1 DE60220973 D1 DE 60220973D1 DE 60220973 T DE60220973 T DE 60220973T DE 60220973 T DE60220973 T DE 60220973T DE 60220973 D1 DE60220973 D1 DE 60220973D1
Authority
DE
Germany
Prior art keywords
thermal expansion
practical components
expansion material
practical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60220973T
Other languages
English (en)
Other versions
DE60220973T2 (de
Inventor
Tomoko Suzuki
Atsushi Omote
Jun Kuwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60220973D1 publication Critical patent/DE60220973D1/de
Publication of DE60220973T2 publication Critical patent/DE60220973T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/03—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite
    • C04B35/04—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
    • C04B35/053—Fine ceramics
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G39/00—Compounds of molybdenum
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G39/00—Compounds of molybdenum
    • C01G39/006—Compounds containing, besides molybdenum, two or more other elements, with the exception of oxygen or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G41/00—Compounds of tungsten
    • C01G41/006—Compounds containing, besides tungsten, two or more other elements, with the exception of oxygen or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G49/00—Compounds of iron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/486—Fine ceramics
    • C04B35/488—Composites
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE60220973T 2001-07-12 2002-07-09 Material mit keiner Wärmeausdehnung und praktische Bauteile, die dieses Material verwenden Expired - Lifetime DE60220973T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001211826 2001-07-12
JP2001211826 2001-07-12
JP2002150338 2002-05-24
JP2002150338A JP3601525B2 (ja) 2001-07-12 2002-05-24 零熱膨張材料及びそれを用いた応用部品

Publications (2)

Publication Number Publication Date
DE60220973D1 true DE60220973D1 (de) 2007-08-16
DE60220973T2 DE60220973T2 (de) 2008-03-13

Family

ID=26618587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60220973T Expired - Lifetime DE60220973T2 (de) 2001-07-12 2002-07-09 Material mit keiner Wärmeausdehnung und praktische Bauteile, die dieses Material verwenden

Country Status (4)

Country Link
US (2) US6812178B2 (de)
EP (1) EP1277712B1 (de)
JP (1) JP3601525B2 (de)
DE (1) DE60220973T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1300052C (zh) * 2003-01-14 2007-02-14 松下电器产业株式会社 低热膨胀材料
JPWO2005047206A1 (ja) 2003-11-14 2007-05-31 松下電器産業株式会社 負又は低い熱膨張係数を示す材料及びその製造方法
US20060073390A1 (en) * 2004-10-06 2006-04-06 Matsushita Electric Industrial Co., Ltd. Solid electrolyte
DE102005025206A1 (de) * 2005-05-25 2006-11-30 E.G.O. Elektro-Gerätebau GmbH Kochfeldplatte und Kochfeld
DE102005025896B4 (de) * 2005-05-25 2010-11-25 E.G.O. Elektro-Gerätebau GmbH Kochfeldplatte mit optischer Temperaturanzeige und mit Vorrichtung zur optischen Temperaturerfassung sowie entsprechendes Kochfeld
JP4997433B2 (ja) * 2006-03-13 2012-08-08 学校法人東京理科大学 タングステン酸ジルコニウム−タングステン酸マグネシウム複合体の製造方法
CN100349823C (zh) * 2006-06-09 2007-11-21 北京师范大学 双取代立方相钨酸锆固溶体温敏色散补偿陶瓷体及其制备方法
US7692898B2 (en) * 2006-12-27 2010-04-06 Hitachi Global Storage Technologies Netherlands B.V. Magnetic head that includes negative expansion material
KR100799759B1 (ko) * 2007-02-16 2008-02-01 김충식 자수기용 구슬 공급장치
JP4999091B2 (ja) * 2007-09-11 2012-08-15 学校法人東京理科大学 タングステン酸ジルコニウム−酸化ケイ素複合焼結体の製造方法
US8142874B1 (en) 2009-02-26 2012-03-27 United States Of America As Represented By The Secretary Of The Air Force Bi-material composite structure with reduced thermal expansion
CN109190265B (zh) * 2018-09-10 2022-03-01 北京航空航天大学 一种多相复合零热膨胀材料设计方法
CN114892037B (zh) * 2022-05-18 2023-03-24 重庆大学 一种在20～150℃范围内热膨胀系数近零的镁基复合材料及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4343029B4 (de) * 1992-12-17 2007-06-06 Kyocera Corp. Dielektrische keramische Zusammensetzung für die Hochfrequenz
TW270211B (de) * 1993-03-17 1996-02-11 Tdk Electronics Co Ltd
US5322559A (en) 1993-05-11 1994-06-21 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Negative thermal expansion material
US5433778A (en) 1993-05-11 1995-07-18 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Negative thermal expansion material
US5514360A (en) * 1995-03-01 1996-05-07 The State Of Oregon, Acting By And Through The Oregon State Board Of Higher Education, Acting For And On Behalf Of Oregon State University Negative thermal expansion materials
US5694503A (en) * 1996-09-09 1997-12-02 Lucent Technologies Inc. Article comprising a temperature compensated optical fiber refractive index grating
US6183716B1 (en) * 1997-07-30 2001-02-06 State Of Oregon Acting By And Through The State Board Of Higher Education Of Behalf Of Oregon State University Solution method for making molybdate and tungstate negative thermal expansion materials and compounds made by the method
EP1087915A2 (de) * 1998-05-19 2001-04-04 Corning Incorporated Materialen mit negativer thermischer ausdehnung,verfahren zur herstellung und verwendung dieser materialen
US6258743B1 (en) * 1998-09-03 2001-07-10 Agere Systems Guardian Corp. Isotropic negative thermal expansion cermics and process for making

Also Published As

Publication number Publication date
US20040204307A1 (en) 2004-10-14
US6844283B2 (en) 2005-01-18
DE60220973T2 (de) 2008-03-13
EP1277712A3 (de) 2003-11-05
US6812178B2 (en) 2004-11-02
EP1277712A2 (de) 2003-01-22
US20030027703A1 (en) 2003-02-06
JP2003089572A (ja) 2003-03-28
EP1277712B1 (de) 2007-07-04
JP3601525B2 (ja) 2004-12-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP