DE60218568D1 - Dünne Polymer-Schicht, Herstellungsverfahren, Bindemittel für Bio-Chip, Bio-Chip und Verfahren zu seiner Herstellung - Google Patents

Dünne Polymer-Schicht, Herstellungsverfahren, Bindemittel für Bio-Chip, Bio-Chip und Verfahren zu seiner Herstellung

Info

Publication number
DE60218568D1
DE60218568D1 DE60218568T DE60218568T DE60218568D1 DE 60218568 D1 DE60218568 D1 DE 60218568D1 DE 60218568 T DE60218568 T DE 60218568T DE 60218568 T DE60218568 T DE 60218568T DE 60218568 D1 DE60218568 D1 DE 60218568D1
Authority
DE
Germany
Prior art keywords
bio
chip
binder
production
polymer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60218568T
Other languages
English (en)
Other versions
DE60218568T2 (de
Inventor
Eiichi Nakamura
Kenichi Shibayama
Hiroshi Maruyama
Takashi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kisco Ltd
Original Assignee
Kishimoto Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001146675A external-priority patent/JP4554110B2/ja
Priority claimed from JP2002011707A external-priority patent/JP4106215B2/ja
Application filed by Kishimoto Sangyo Co Ltd filed Critical Kishimoto Sangyo Co Ltd
Publication of DE60218568D1 publication Critical patent/DE60218568D1/de
Application granted granted Critical
Publication of DE60218568T2 publication Critical patent/DE60218568T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/025—Polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
    • C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
    • C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C08J2365/04—Polyxylylenes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
DE2002618568 2001-05-16 2002-05-16 Dünne Polymer-Schicht, Herstellungsverfahren, Bindemittel für Bio-Chip, Bio-Chip und Verfahren zu seiner Herstellung Expired - Lifetime DE60218568T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001146675 2001-05-16
JP2001146675A JP4554110B2 (ja) 2001-05-16 2001-05-16 Ｄｎａチップ用結合剤、ｄｎａチップ、およびｄｎａチップの製造方法
JP2002011707A JP4106215B2 (ja) 2002-01-21 2002-01-21 高分子薄膜、高分子薄膜の製造方法、およびバイオチップ
JP2002011707 2002-01-21

Publications (2)

Publication Number Publication Date
DE60218568D1 true DE60218568D1 (de) 2007-04-19
DE60218568T2 DE60218568T2 (de) 2007-11-22

Family

ID=26615199

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2002618568 Expired - Lifetime DE60218568T2 (de) 2001-05-16 2002-05-16 Dünne Polymer-Schicht, Herstellungsverfahren, Bindemittel für Bio-Chip, Bio-Chip und Verfahren zu seiner Herstellung

Country Status (3)

Country Link
US (1) US6855419B2 (de)
EP (1) EP1260542B1 (de)
DE (1) DE60218568T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4772211B2 (ja) * 2001-05-29 2011-09-14 Ｋｉｓｃｏ株式会社 Ｄｎａチップの製造方法
EP2053070A4 (de) * 2006-07-28 2010-08-18 Daisankasei Co Ltd Cvd-vorrichtung und cvd-verfahren
KR101032971B1 (ko) 2009-06-15 2011-05-09 (주)펨토사이언스 친화도 바이오칩
JP5592842B2 (ja) * 2011-06-24 2014-09-17 Ｋｉｓｃｏ株式会社 細胞培養用基膜、細胞培養用基材、及び細胞培養用基材の製造方法
TW201540772A (zh) * 2014-04-24 2015-11-01 美樺興業股份有限公司 高分子粒子及其製備方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375419A (en) * 1965-02-25 1968-03-26 Union Carbide Corp Field effect transistor with poly-p-xylylene insulated gate structure and method
IT1222879B (it) * 1987-10-13 1990-09-12 Ausimont Spa Processo per il consolidamento di materiali bassofondenti
WO1990002546A1 (en) 1988-09-09 1990-03-22 The Ronald T. Dodge Company Pharmaceuticals microencapsulated by vapor deposited polymers and method
NL1007781C2 (nl) * 1997-12-12 1999-06-15 Packard Instr Bv Microtiterplaat.
US6123993A (en) * 1998-09-21 2000-09-26 Advanced Technology Materials, Inc. Method and apparatus for forming low dielectric constant polymeric films

Also Published As

Publication number Publication date
US6855419B2 (en) 2005-02-15
US20030012956A1 (en) 2003-01-16
EP1260542A1 (de) 2002-11-27
EP1260542B1 (de) 2007-03-07
DE60218568T2 (de) 2007-11-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KISCO LTD., OSAKA, JP