DE60217199D1 - Bleifreies Weichlot und Weichlotverbindung - Google Patents

Bleifreies Weichlot und Weichlotverbindung

Info

Publication number
DE60217199D1
DE60217199D1 DE60217199T DE60217199T DE60217199D1 DE 60217199 D1 DE60217199 D1 DE 60217199D1 DE 60217199 T DE60217199 T DE 60217199T DE 60217199 T DE60217199 T DE 60217199T DE 60217199 D1 DE60217199 D1 DE 60217199D1
Authority
DE
Germany
Prior art keywords
soft solder
lead
free
connection
solder connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60217199T
Other languages
English (en)
Other versions
DE60217199T2 (de
Inventor
Yoshitome Daisuke
Tanaka Yasuhisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiho Kogyo Co Ltd
Original Assignee
Taiho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiho Kogyo Co Ltd filed Critical Taiho Kogyo Co Ltd
Publication of DE60217199D1 publication Critical patent/DE60217199D1/de
Application granted granted Critical
Publication of DE60217199T2 publication Critical patent/DE60217199T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60217199T 2001-02-09 2002-02-07 Bleifreies Weichlot und Weichlotverbindung Expired - Lifetime DE60217199T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001033206 2001-02-09
JP2001033206 2001-02-09

Publications (2)

Publication Number Publication Date
DE60217199D1 true DE60217199D1 (de) 2007-02-15
DE60217199T2 DE60217199T2 (de) 2007-10-04

Family

ID=18896992

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60217199T Expired - Lifetime DE60217199T2 (de) 2001-02-09 2002-02-07 Bleifreies Weichlot und Weichlotverbindung

Country Status (5)

Country Link
US (1) US6689488B2 (de)
EP (1) EP1231015B1 (de)
KR (1) KR100499754B1 (de)
CN (1) CN1190294C (de)
DE (1) DE60217199T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE334775T1 (de) * 2001-12-15 2006-08-15 Pfarr Stanztechnik Gmbh Bleifreies weichlot
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
JP4416373B2 (ja) * 2002-03-08 2010-02-17 株式会社日立製作所 電子機器
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
TW200529963A (en) * 2004-02-04 2005-09-16 Senju Metal Industry Co Solder alloy for preventing Fe erosion and method for preventing Fe erosion
JP4285753B2 (ja) * 2004-06-21 2009-06-24 田中貴金属工業株式会社 ハーメチックシールカバー及びその製造方法
US20060060639A1 (en) * 2004-09-21 2006-03-23 Byrne Tiffany A Doped contact formations
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
US8691143B2 (en) * 2005-06-03 2014-04-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US8641964B2 (en) 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
WO2007023288A2 (en) * 2005-08-24 2007-03-01 Fry's Metals Inc. Solder alloy
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
EP2177305B1 (de) * 2007-07-18 2013-07-03 Senju Metal Industry Co., Ltd In-haltiges bleifreies lot für elektronische schaltung eines fahrzeuges
US7943227B2 (en) * 2007-10-11 2011-05-17 The Boeing Company Ceramic heat shield
US7927686B2 (en) * 2007-10-11 2011-04-19 The Boeing Company Composite heat shield
CN102017111B (zh) * 2008-03-05 2013-01-16 千住金属工业株式会社 无铅焊料连接构造体和焊料球
CN101722379B (zh) * 2009-11-26 2011-04-13 大丰市大奇金属磨料有限公司 一种球栅阵列封装无铅锡球的制备工艺
KR20140100585A (ko) 2012-06-30 2014-08-14 센주긴조쿠고교 가부시키가이샤 납프리 땜납 볼
CN103084749B (zh) * 2013-01-18 2015-08-19 江苏师范大学 一种高使用寿命的无铅钎料
CN103480978A (zh) * 2013-09-29 2014-01-01 宁波市鄞州恒迅电子材料有限公司 环保无铅防电极溶出焊锡丝
CN103978319B (zh) * 2014-05-14 2016-06-22 张海鹏 一种用于制作压敏电阻器的无铅焊料
JP6648468B2 (ja) * 2014-10-29 2020-02-14 Tdk株式会社 Ｐｂフリーはんだ及び電子部品内蔵モジュール
JP6826995B2 (ja) * 2015-05-15 2021-02-10 アプティブ・テクノロジーズ・リミテッド インジウム−スズ−銀ベースの無鉛はんだ
CN114227057B (zh) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 无铅焊料合金及其制备方法、用途

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520752A (en) 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
JPH09326554A (ja) 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
US5863493A (en) 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions

Also Published As

Publication number Publication date
KR100499754B1 (ko) 2005-07-07
EP1231015A1 (de) 2002-08-14
CN1369351A (zh) 2002-09-18
KR20020066215A (ko) 2002-08-14
US6689488B2 (en) 2004-02-10
EP1231015B1 (de) 2007-01-03
CN1190294C (zh) 2005-02-23
DE60217199T2 (de) 2007-10-04
US20020150787A1 (en) 2002-10-17

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Legal Events

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