DE60206660D1 - Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren - Google Patents

Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren

Info

Publication number
DE60206660D1
DE60206660D1 DE60206660T DE60206660T DE60206660D1 DE 60206660 D1 DE60206660 D1 DE 60206660D1 DE 60206660 T DE60206660 T DE 60206660T DE 60206660 T DE60206660 T DE 60206660T DE 60206660 D1 DE60206660 D1 DE 60206660D1
Authority
DE
Germany
Prior art keywords
polishing
finishing
regulating
post
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60206660T
Other languages
English (en)
Other versions
DE60206660T2 (de
Inventor
Dirk Wollstein
Jan Raebiger
Gerd Marxsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to DE60206660T priority Critical patent/DE60206660T2/de
Priority claimed from PCT/US2002/041668 external-priority patent/WO2003072305A1/en
Publication of DE60206660D1 publication Critical patent/DE60206660D1/de
Application granted granted Critical
Publication of DE60206660T2 publication Critical patent/DE60206660T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE60206660T 2002-02-26 2002-12-20 Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren Expired - Lifetime DE60206660T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE60206660T DE60206660T2 (de) 2002-02-26 2002-12-20 Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE10208165A DE10208165C1 (de) 2002-02-26 2002-02-26 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten
DE10208165 2002-02-26
US261612 2002-09-30
US10/261,612 US7268000B2 (en) 2002-02-26 2002-09-30 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
PCT/US2002/041668 WO2003072305A1 (en) 2002-02-26 2002-12-20 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
DE60206660T DE60206660T2 (de) 2002-02-26 2002-12-20 Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren

Publications (2)

Publication Number Publication Date
DE60206660D1 true DE60206660D1 (de) 2006-02-23
DE60206660T2 DE60206660T2 (de) 2006-05-04

Family

ID=27797529

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10208165A Expired - Fee Related DE10208165C1 (de) 2002-02-26 2002-02-26 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten
DE60206660T Expired - Lifetime DE60206660T2 (de) 2002-02-26 2002-12-20 Verfahren und system zur regelung der nachpolierdauer und/oder der polierdauer in der endbearbeitung beim chemisch mechanischen polieren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10208165A Expired - Fee Related DE10208165C1 (de) 2002-02-26 2002-02-26 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten

Country Status (4)

Country Link
US (1) US7268000B2 (de)
JP (1) JP4740540B2 (de)
KR (1) KR100941481B1 (de)
DE (2) DE10208165C1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304430B3 (de) * 2003-02-04 2004-09-23 Oerlikon Geartec Ag Verfahren zum Kalibrieren einer Schleifmaschine
US7217649B2 (en) * 2003-03-14 2007-05-15 Lam Research Corporation System and method for stress free conductor removal
US7078344B2 (en) * 2003-03-14 2006-07-18 Lam Research Corporation Stress free etch processing in combination with a dynamic liquid meniscus
US7232766B2 (en) * 2003-03-14 2007-06-19 Lam Research Corporation System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
US7009281B2 (en) * 2003-03-14 2006-03-07 Lam Corporation Small volume process chamber with hot inner surfaces
WO2006126420A1 (ja) * 2005-05-26 2006-11-30 Nikon Corporation Ｃｍｐ研磨装置における研磨終了点検出方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
US7817241B2 (en) * 2007-07-05 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5369478B2 (ja) * 2008-04-11 2013-12-18 株式会社ニコン 研磨装置
JP7115850B2 (ja) * 2017-12-28 2022-08-09 株式会社ディスコ 被加工物の加工方法および加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3558794B2 (ja) * 1996-09-27 2004-08-25 株式会社荏原製作所 半導体ウエハーの研磨方法及び研磨装置
WO1998014306A1 (en) * 1996-10-04 1998-04-09 Obsidian, Inc. A method and system for controlling chemical mechanical polishing thickness removal
TW358983B (en) * 1997-11-15 1999-05-21 Taiwan Semiconductor Mfg Co Ltd Chemical mechanical grinding method
KR20010032223A (ko) * 1997-11-18 2001-04-16 카리 홀란드 화학적 기계 연마 공정의 모델링 방법 및 장치
JP3440826B2 (ja) * 1998-06-03 2003-08-25 株式会社日立製作所 半導体装置および半導体基板の研磨方法
US6230069B1 (en) * 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
JP3082850B2 (ja) * 1998-10-16 2000-08-28 株式会社東京精密 ウェーハ研磨装置
US6409936B1 (en) * 1999-02-16 2002-06-25 Micron Technology, Inc. Composition and method of formation and use therefor in chemical-mechanical polishing
JP2000310512A (ja) * 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
US6492273B1 (en) * 1999-08-31 2002-12-10 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
US6439964B1 (en) * 1999-10-12 2002-08-27 Applied Materials, Inc. Method of controlling a polishing machine
US6506097B1 (en) 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2001298008A (ja) * 2000-04-14 2001-10-26 Sony Corp 研磨方法および研磨装置

Also Published As

Publication number Publication date
US7268000B2 (en) 2007-09-11
JP4740540B2 (ja) 2011-08-03
KR20040086456A (ko) 2004-10-08
US20030186546A1 (en) 2003-10-02
DE60206660T2 (de) 2006-05-04
DE10208165C1 (de) 2003-10-02
KR100941481B1 (ko) 2010-02-10
JP2005518667A (ja) 2005-06-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER,