DE60202071D1 - Verfahren zur herstellung von leiterplatten aus einem extrudierten polymer - Google Patents

Verfahren zur herstellung von leiterplatten aus einem extrudierten polymer

Info

Publication number
DE60202071D1
DE60202071D1 DE60202071T DE60202071T DE60202071D1 DE 60202071 D1 DE60202071 D1 DE 60202071D1 DE 60202071 T DE60202071 T DE 60202071T DE 60202071 T DE60202071 T DE 60202071T DE 60202071 D1 DE60202071 D1 DE 60202071D1
Authority
DE
Germany
Prior art keywords
circuit boards
extruded polymer
producing circuit
producing
extruded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60202071T
Other languages
English (en)
Other versions
DE60202071T2 (de
Inventor
Pitel Jose Luis Cubero
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Application granted granted Critical
Publication of DE60202071D1 publication Critical patent/DE60202071D1/de
Publication of DE60202071T2 publication Critical patent/DE60202071T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
DE60202071T 2001-06-05 2002-06-05 Verfahren zur herstellung von leiterplatten aus einem extrudierten polymer Expired - Fee Related DE60202071T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ES200101301A ES2188381B1 (es) 2001-06-05 2001-06-05 Procedimiento de fabricacion de placas de circuito impreso a partir de un polimero extrusionado.
ES200101301 2001-06-05
PCT/ES2002/000273 WO2002100141A1 (es) 2001-06-05 2002-06-05 Procedimiento de fabricacion de placas de circuito impreso a partir de un polimero extrusionado

Publications (2)

Publication Number Publication Date
DE60202071D1 true DE60202071D1 (de) 2004-12-30
DE60202071T2 DE60202071T2 (de) 2005-12-01

Family

ID=8497965

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60202071T Expired - Fee Related DE60202071T2 (de) 2001-06-05 2002-06-05 Verfahren zur herstellung von leiterplatten aus einem extrudierten polymer

Country Status (5)

Country Link
US (1) US7052619B2 (de)
EP (1) EP1404164B1 (de)
DE (1) DE60202071T2 (de)
ES (1) ES2188381B1 (de)
WO (1) WO2002100141A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2709160B1 (de) * 2012-09-14 2016-03-30 ATOTECH Deutschland GmbH Verfahren zur Metallisierung von Solarzellensubstraten
DE102014104510B4 (de) * 2014-03-31 2019-02-07 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum Fügen und Einrichtung zum Fügen einer Anordnung unter Verwendung des Verfahrens

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry
CA1298451C (en) * 1985-08-02 1992-04-07 Hiromi Shigemoto Surface-roughened film and sheet, and process for production and use thereof
JPH01269516A (ja) * 1988-04-22 1989-10-27 Showa Denko Kk 積層物の製造方法
ES2125821B1 (es) * 1997-01-31 1999-12-01 Mecanismos Aux Ind Un procedimiento de fabricacion de circuitos impresos.
WO2001033614A1 (en) * 1999-11-02 2001-05-10 University Of Hawaii Method for fabricating arrays of micro-needles
WO2001050824A1 (es) * 1999-12-31 2001-07-12 Lear Automotive (Eeds) Spain, S.L. Procedimiento de fabricacion de placas de circuito impreso
GB0125350D0 (en) * 2001-10-22 2001-12-12 Sigtronics Ltd PCB formation by laser cleaning of conductive ink
US20030180448A1 (en) * 2002-03-21 2003-09-25 T.L.M. Advanced Laser Technology Ltd. Method for fabrication of printed circuit boards
US20030197285A1 (en) * 2002-04-23 2003-10-23 Kulicke & Soffa Investments, Inc. High density substrate for the packaging of integrated circuits

Also Published As

Publication number Publication date
US20040131764A1 (en) 2004-07-08
DE60202071T2 (de) 2005-12-01
ES2188381A1 (es) 2003-06-16
US7052619B2 (en) 2006-05-30
EP1404164A1 (de) 2004-03-31
WO2002100141A1 (es) 2002-12-12
ES2188381B1 (es) 2004-12-16
EP1404164B1 (de) 2004-11-24

Similar Documents

Publication Publication Date Title
DE60238389D1 (de) Verfahren zur herstellung von elektronikbauteilmaterial
DE602004030082D1 (de) Verfahren zur Herstellung einer elektronischen Vorrichtung
DE50109017D1 (de) Verfahren zur herstellung einer elektronischen baugruppe
DE60221399D1 (de) Verfahren zur herstellung von mitteldistillaten
ATE403641T1 (de) Verfahren zur herstellung von o- desmethylvenlafaxin
DE60230439D1 (de) Verfahren zur herstellung von einem linearen blockcopolymer
DE60209791D1 (de) Verfahren und vorrichtung zur herstellung von expandierbaren granulaten aus thermoplastischen polymeren
DE59910655D1 (de) Verfahren zur herstellung von schwefelhaltigen polymeren
DE60217650D1 (de) Verfahren zur herstellung von verglasungen aus kunststoff
DE60304583D1 (de) Verfahren zur herstellung von pastenextrudierten sulfonamidzusammensetzungen
DE50302737D1 (de) Verfahren zur herstellung von strukturbauteilen aus einem strangpressprofil
DE60039407D1 (de) Verfahren zur Herstellung chrombeschichteten Kupfers für Leiterplatten
DE60200836D1 (de) Verfahren zur herstellung von kunststoffteilanordnungen
DE60326151D1 (de) Verbessertes verfahren zur herstellung von polymeren
ATA7262003A (de) Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
ATE296287T1 (de) Verfahren zur herstellung von repaglinide
DE60210911D1 (de) Verfahren zur Herstellung von dehnungserfassenden Vorrichtungen
ATE553103T1 (de) Verfahren zur herstellung von (s)-pantoprazol
DE50308499D1 (de) Verfahren zur herstellung von verbundsystemen aus metall- und polymerformteilen
DE59906453D1 (de) Verfahren zur herstellung von schäumen aus polymeren oder polymergemischen
DE50200870D1 (de) Verfahren zur herstellung von hydroxyalkylpolysiloxanen
DE69911555D1 (de) Verfahren zur herstellung von polymeren
ATE402138T1 (de) Verfahren zur herstellung von 2- aminoindanderivaten
DE60031943D1 (de) Verfahren zur herstellung von elektronischen bauteilen
DE60219012D1 (de) Verfahren zur herstellung von elektrisch leitfähigem lack

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee