DE602007010690D1 - PSA-Folie zum Zerschneiden - Google Patents

PSA-Folie zum Zerschneiden

Info

Publication number
DE602007010690D1
DE602007010690D1 DE602007010690T DE602007010690T DE602007010690D1 DE 602007010690 D1 DE602007010690 D1 DE 602007010690D1 DE 602007010690 T DE602007010690 T DE 602007010690T DE 602007010690 T DE602007010690 T DE 602007010690T DE 602007010690 D1 DE602007010690 D1 DE 602007010690D1
Authority
DE
Germany
Prior art keywords
psa
foil
cutting
psa foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007010690T
Other languages
English (en)
Inventor
Shouji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602007010690D1 publication Critical patent/DE602007010690D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
DE602007010690T 2006-06-02 2007-05-31 PSA-Folie zum Zerschneiden Active DE602007010690D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006154736A JP4891659B2 (ja) 2006-06-02 2006-06-02 ダイシング用粘着シート

Publications (1)

Publication Number Publication Date
DE602007010690D1 true DE602007010690D1 (de) 2011-01-05

Family

ID=38220636

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007010690T Active DE602007010690D1 (de) 2006-06-02 2007-05-31 PSA-Folie zum Zerschneiden

Country Status (8)

Country Link
US (1) US20110003147A2 (de)
EP (1) EP1862519B1 (de)
JP (1) JP4891659B2 (de)
KR (1) KR101115197B1 (de)
CN (1) CN101081967B (de)
DE (1) DE602007010690D1 (de)
MY (1) MY143272A (de)
TW (1) TWI430346B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8264342B2 (en) 2008-10-28 2012-09-11 RF Surgical Systems, Inc Method and apparatus to detect transponder tagged objects, for example during medical procedures
US8726911B2 (en) 2008-10-28 2014-05-20 Rf Surgical Systems, Inc. Wirelessly detectable objects for use in medical procedures and methods of making same
JP5290853B2 (ja) * 2009-04-28 2013-09-18 三菱樹脂株式会社 ダイシング用粘着シート
JP5901422B2 (ja) * 2012-05-15 2016-04-13 古河電気工業株式会社 半導体ウェハのダイシング方法およびこれに用いる半導体加工用ダイシングテープ
WO2016118755A1 (en) 2015-01-21 2016-07-28 Covidien Lp Sterilizable wirelessly detectable objects for use in medical procedures and methods of making same
AU2016200173B2 (en) * 2015-01-21 2019-10-31 Covidien Lp Wirelessly detectable objects for use in medical procedures and methods of making same
US10874560B2 (en) 2015-01-21 2020-12-29 Covidien Lp Detectable sponges for use in medical procedures and methods of making, packaging, and accounting for same
US10193209B2 (en) 2015-04-06 2019-01-29 Covidien Lp Mat based antenna and heater system, for use during medical procedures
JP6673734B2 (ja) * 2016-03-29 2020-03-25 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124037C (de) * 1964-01-27
US3558554A (en) * 1966-06-09 1971-01-26 Yoshitomi Pharmaceutical Oxidatively stable polyolefin composition
US4343856A (en) * 1981-03-09 1982-08-10 Stauffer Chemical Company Polymeric marking film
AU618208B2 (en) * 1990-03-19 1991-12-12 National Starch And Chemical Investment Holding Corporation Plasticizer resistant pressure sensitive adhesive
JPH08109299A (ja) * 1994-10-13 1996-04-30 Chisso Corp 塩化ビニル樹脂組成物
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP3594853B2 (ja) * 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2001207140A (ja) * 2000-01-26 2001-07-31 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
US7029759B2 (en) * 2002-09-30 2006-04-18 Omnova Solutions Inc. Halogen-containing vinyl polymer compositions
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
US7955703B2 (en) * 2004-07-12 2011-06-07 Lintec Corporation Silicone rubber based pressure sensitive adhesive sheet

Also Published As

Publication number Publication date
MY143272A (en) 2011-04-15
KR20070115738A (ko) 2007-12-06
TW200805469A (en) 2008-01-16
TWI430346B (zh) 2014-03-11
EP1862519A1 (de) 2007-12-05
CN101081967A (zh) 2007-12-05
US20110003147A2 (en) 2011-01-06
CN101081967B (zh) 2012-02-29
JP4891659B2 (ja) 2012-03-07
JP2007321087A (ja) 2007-12-13
EP1862519B1 (de) 2010-11-24
US20070281153A1 (en) 2007-12-06
KR101115197B1 (ko) 2012-02-24

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