DE602007008400D1 - Kaliummonopersulfatlösungen - Google Patents

Kaliummonopersulfatlösungen

Info

Publication number
DE602007008400D1
DE602007008400D1 DE602007008400T DE602007008400T DE602007008400D1 DE 602007008400 D1 DE602007008400 D1 DE 602007008400D1 DE 602007008400 T DE602007008400 T DE 602007008400T DE 602007008400 T DE602007008400 T DE 602007008400T DE 602007008400 D1 DE602007008400 D1 DE 602007008400D1
Authority
DE
Germany
Prior art keywords
kaliummonopersulfatlösungen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007008400T
Other languages
German (de)
English (en)
Inventor
Robert Jeffrey Durante
Harvey James Bohn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE602007008400D1 publication Critical patent/DE602007008400D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08Peroxysulfates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/055Peroxyhydrates; Peroxyacids or salts thereof
    • C01B15/06Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
    • C01B15/08Peroxysulfates
    • C01B15/085Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/18Acidic compositions for etching copper or alloys thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00Brightening metals by chemical means
    • C23F3/04Heavy metals
    • C23F3/06Heavy metals with acidic solutions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Detergent Compositions (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE602007008400T 2006-06-02 2007-06-01 Kaliummonopersulfatlösungen Active DE602007008400D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/445,610 US7442323B2 (en) 2006-06-02 2006-06-02 Potassium monopersulfate solutions
PCT/US2007/012995 WO2007143127A1 (en) 2006-06-02 2007-06-01 Potassium monopersulfate solutions

Publications (1)

Publication Number Publication Date
DE602007008400D1 true DE602007008400D1 (de) 2010-09-23

Family

ID=38566311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007008400T Active DE602007008400D1 (de) 2006-06-02 2007-06-01 Kaliummonopersulfatlösungen

Country Status (10)

Country Link
US (2) US7442323B2 (https=)
EP (1) EP2024281B1 (https=)
JP (1) JP5292285B2 (https=)
KR (1) KR101397363B1 (https=)
CN (1) CN101460397B (https=)
CA (1) CA2652151C (https=)
DE (1) DE602007008400D1 (https=)
MY (2) MY142427A (https=)
TW (1) TWI349648B (https=)
WO (1) WO2007143127A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100239678A1 (en) * 2006-07-18 2010-09-23 Ali Razavi Ionically functionalized nanodiamonds
SG183744A1 (en) 2007-08-20 2012-09-27 Advanced Tech Materials Composition and method for removing ion-implanted photoresist
KR20100133507A (ko) * 2008-05-01 2010-12-21 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 고밀도 주입된 레지스트의 제거를 위한 저 ph 혼합물
TWI480360B (zh) 2009-04-03 2015-04-11 杜邦股份有限公司 蝕刻劑組成物及方法
JP5340071B2 (ja) * 2009-08-03 2013-11-13 株式会社Adeka 安定剤を含むペルオキシ一硫酸水溶液の製造方法
US10383894B2 (en) * 2010-03-17 2019-08-20 Lutran Industries, Inc. Human medicinal treatment using salt of peroxymonosulfuric acid
US20120074014A1 (en) * 2010-09-27 2012-03-29 Lutran Industries, Inc. Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication
US20130005998A1 (en) * 2010-03-18 2013-01-03 Gyongyi Gulyas Process for preparing divinylarene dioxides
CN102296293B (zh) * 2011-06-24 2015-01-07 李沛泓 印刷线路板微蚀刻剂
JP5885971B2 (ja) * 2011-09-08 2016-03-16 関東化學株式会社 銅および銅合金のエッチング液
US20150104938A1 (en) * 2013-10-16 2015-04-16 United Microelectronics Corporation Method for forming damascene opening and applications thereof
JP2016104474A (ja) * 2014-08-22 2016-06-09 有限会社情報科学研究所 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。
ES2706877T3 (es) 2014-11-13 2019-04-01 Gerresheimer Glas Gmbh Filtro de partículas de máquina para conformar vidrio, unidad de émbolo, cabeza de soplado, soporte de cabeza de soplado y máquina para conformar vidrio adaptada a dicho filtro o que lo comprende
CN108950558A (zh) * 2018-08-27 2018-12-07 深圳市星扬高新科技有限公司 一种铜制件表面粗化剂
CN110172349B (zh) * 2019-05-08 2020-11-20 厦门大学 一种氮化镓半导体光电化学刻蚀液及加工方法
FR3102008B1 (fr) * 2019-10-10 2021-09-24 Commissariat Energie Atomique Procede de recyclage des batteries li-ion
CN111039309A (zh) * 2019-12-31 2020-04-21 中船重工(邯郸)派瑞特种气体有限公司 一种分离硫酸氢钾和硫酸钾混合物的装置及方法
CN111662641B (zh) * 2020-06-30 2021-10-26 中国科学院上海微系统与信息技术研究所 一种高选择比的化学机械抛光液及其应用
KR102581261B1 (ko) * 2021-03-04 2023-09-21 우석대학교 산학협력단 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법
CN115124204A (zh) * 2022-06-16 2022-09-30 安徽省交通航务工程有限公司 一种实现疏浚泥浆快速泥水分离的处理方法
CN116235863A (zh) * 2023-01-04 2023-06-09 四川省畜牧科学研究院 一种耐分解的消毒剂

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3555147A (en) * 1967-12-19 1971-01-12 Fmc Corp Peroxydiphosphate neutralizer for hair waving
US3805809A (en) * 1972-10-02 1974-04-23 Procter & Gamble Hair setting process
ATE74879T1 (de) * 1983-12-30 1992-05-15 Du Pont Kaliummonopersulfat-zusammensetzungen und verfahren zu deren herstellung.
DE4014655A1 (de) * 1990-05-08 1991-11-14 Behringwerke Ag Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren
DE4020856A1 (de) * 1990-06-29 1992-01-09 Degussa Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen
US5139763A (en) * 1991-03-06 1992-08-18 E. I. Du Pont De Nemours And Company Class of stable potassium monopersulfate compositions
DE19503900C1 (de) 1995-02-07 1995-11-23 Degussa Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶
JP4767401B2 (ja) * 2000-10-30 2011-09-07 ルネサスエレクトロニクス株式会社 半導体記憶装置及びその製造方法
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
US6818142B2 (en) * 2003-03-31 2004-11-16 E. I. Du Pont De Nemours And Company Potassium hydrogen peroxymonosulfate solutions
US20050063895A1 (en) * 2003-09-23 2005-03-24 Martin Perry L. Production of potassium monopersulfate triple salt using oleum
US7090820B2 (en) * 2003-09-23 2006-08-15 Truox, Inc. Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8
US20060013750A1 (en) * 2004-07-16 2006-01-19 Martin Perry L Solvent-activated reactor
CN1778669A (zh) * 2004-11-22 2006-05-31 上海嘉源实业有限公司 一种单过硫酸氢钾的制备方法

Also Published As

Publication number Publication date
EP2024281A1 (en) 2009-02-18
TWI349648B (en) 2011-10-01
MY156749A (en) 2016-03-31
WO2007143127A1 (en) 2007-12-13
JP2009539740A (ja) 2009-11-19
TW200804174A (en) 2008-01-16
HK1133420A1 (en) 2010-03-26
KR101397363B1 (ko) 2014-05-19
CN101460397A (zh) 2009-06-17
JP5292285B2 (ja) 2013-09-18
KR20090016003A (ko) 2009-02-12
EP2024281B1 (en) 2010-08-11
US20090008601A1 (en) 2009-01-08
CA2652151C (en) 2015-08-04
CN101460397B (zh) 2011-07-06
US8123970B2 (en) 2012-02-28
US7442323B2 (en) 2008-10-28
CA2652151A1 (en) 2007-12-13
MY142427A (en) 2010-11-30
US20070278182A1 (en) 2007-12-06

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