DE602007003553D1 - Herstellungsverfahren für einen piezoelektrischen Aktor - Google Patents

Herstellungsverfahren für einen piezoelektrischen Aktor

Info

Publication number
DE602007003553D1
DE602007003553D1 DE602007003553T DE602007003553T DE602007003553D1 DE 602007003553 D1 DE602007003553 D1 DE 602007003553D1 DE 602007003553 T DE602007003553 T DE 602007003553T DE 602007003553 T DE602007003553 T DE 602007003553T DE 602007003553 D1 DE602007003553 D1 DE 602007003553D1
Authority
DE
Germany
Prior art keywords
region
manufacturing
piezoelectric actuator
sheets
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007003553T
Other languages
English (en)
Inventor
Chris Goat
Michael Peter Cooke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Operations Luxembourg SARL
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE602007003553D1 publication Critical patent/DE602007003553D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
    • B29C39/18—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
    • B29C39/20—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0008—Magnetic or paramagnetic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
DE602007003553T 2007-01-30 2007-01-30 Herstellungsverfahren für einen piezoelektrischen Aktor Active DE602007003553D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07250387A EP1953841B1 (de) 2007-01-30 2007-01-30 Herstellungsverfahren für einen piezoelektrischen Aktor

Publications (1)

Publication Number Publication Date
DE602007003553D1 true DE602007003553D1 (de) 2010-01-14

Family

ID=38001995

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007003553T Active DE602007003553D1 (de) 2007-01-30 2007-01-30 Herstellungsverfahren für einen piezoelektrischen Aktor

Country Status (5)

Country Link
US (1) US8006358B2 (de)
EP (1) EP1953841B1 (de)
JP (1) JP2008205445A (de)
AT (1) ATE450894T1 (de)
DE (1) DE602007003553D1 (de)

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US8182501B2 (en) 2004-02-27 2012-05-22 Ethicon Endo-Surgery, Inc. Ultrasonic surgical shears and method for sealing a blood vessel using same
PL1802245T3 (pl) 2004-10-08 2017-01-31 Ethicon Endosurgery Llc Ultradźwiękowy przyrząd chirurgiczny
US20070191713A1 (en) 2005-10-14 2007-08-16 Eichmann Stephen E Ultrasonic device for cutting and coagulating
JP2008004764A (ja) * 2006-06-22 2008-01-10 Fujitsu Ltd 圧電アクチュエータおよびその製造方法、磁気ディスク装置
US8057498B2 (en) 2007-11-30 2011-11-15 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instrument blades
US8808319B2 (en) 2007-07-27 2014-08-19 Ethicon Endo-Surgery, Inc. Surgical instruments
US8523889B2 (en) 2007-07-27 2013-09-03 Ethicon Endo-Surgery, Inc. Ultrasonic end effectors with increased active length
US8430898B2 (en) 2007-07-31 2013-04-30 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US9044261B2 (en) 2007-07-31 2015-06-02 Ethicon Endo-Surgery, Inc. Temperature controlled ultrasonic surgical instruments
US8512365B2 (en) 2007-07-31 2013-08-20 Ethicon Endo-Surgery, Inc. Surgical instruments
US10010339B2 (en) 2007-11-30 2018-07-03 Ethicon Llc Ultrasonic surgical blades
US7783012B2 (en) * 2008-09-15 2010-08-24 General Electric Company Apparatus for a surface graded x-ray tube insulator and method of assembling same
US8650728B2 (en) 2009-06-24 2014-02-18 Ethicon Endo-Surgery, Inc. Method of assembling a transducer for a surgical instrument
US8951272B2 (en) 2010-02-11 2015-02-10 Ethicon Endo-Surgery, Inc. Seal arrangements for ultrasonically powered surgical instruments
DE102010044739A1 (de) * 2010-09-08 2012-03-08 Epcos Ag Verfahren zum Herstellen von piezoelektrischen Aktoren aus einem Materialblock
US20130279044A1 (en) * 2012-04-19 2013-10-24 Sae Magnetics (H.K.) Ltd. Thin film piezoelectric element and manufacturing method thereof, micro-actuator, head gimbal assembly and disk drive unit with the same
CN103378286B (zh) * 2012-04-19 2017-12-01 新科实业有限公司 薄膜压电元件及其制造方法、磁头折片组合及磁盘驱动器
US9820768B2 (en) 2012-06-29 2017-11-21 Ethicon Llc Ultrasonic surgical instruments with control mechanisms
DE102012218755B4 (de) * 2012-10-15 2018-07-05 Continental Automotive Gmbh Verfahren zum Herstellen eines elektronischen Bauelements als Stapel und als Stapel ausgebildetes elektronisches Bauelement
US10226273B2 (en) 2013-03-14 2019-03-12 Ethicon Llc Mechanical fasteners for use with surgical energy devices
US10357303B2 (en) 2015-06-30 2019-07-23 Ethicon Llc Translatable outer tube for sealing using shielded lap chole dissector
US10245064B2 (en) 2016-07-12 2019-04-02 Ethicon Llc Ultrasonic surgical instrument with piezoelectric central lumen transducer
JP6730876B2 (ja) * 2016-08-03 2020-07-29 日本特殊陶業株式会社 保持装置の製造方法
US10828056B2 (en) 2016-08-25 2020-11-10 Ethicon Llc Ultrasonic transducer to waveguide acoustic coupling, connections, and configurations
WO2020044919A1 (ja) * 2018-08-30 2020-03-05 富士フイルム株式会社 圧電デバイスおよび圧電デバイスの製造方法

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US4514247A (en) * 1983-08-15 1985-04-30 North American Philips Corporation Method for fabricating composite transducers
JPS6384175A (ja) * 1986-09-29 1988-04-14 Toyota Motor Corp 積層型セラミツクス素子の製造方法
JP2738706B2 (ja) * 1988-07-15 1998-04-08 株式会社日立製作所 積層型圧電素子の製法
US5384030A (en) * 1994-02-15 1995-01-24 General Motors Corporation Exhaust sensor including a composite tile sensing element and methods of making the same
JPH09153649A (ja) * 1995-12-01 1997-06-10 Sony Corp 積層型圧電素子の製造方法
US5844349A (en) * 1997-02-11 1998-12-01 Tetrad Corporation Composite autoclavable ultrasonic transducers and methods of making
JP2000332313A (ja) * 1999-05-21 2000-11-30 Matsushita Electric Ind Co Ltd 薄膜圧電型バイモルフ素子及びその応用
US6822374B1 (en) 2000-11-15 2004-11-23 General Electric Company Multilayer piezoelectric structure with uniform electric field
US6868594B2 (en) * 2001-01-05 2005-03-22 Koninklijke Philips Electronics, N.V. Method for making a transducer
DE10201641A1 (de) * 2002-01-17 2003-08-07 Epcos Ag Piezoelektrisches Bauelement und Verfahren zu dessen Herstellung
US6960741B2 (en) * 2002-08-26 2005-11-01 Lexmark International, Inc. Large area alumina ceramic heater
JP2004111608A (ja) * 2002-09-18 2004-04-08 Murata Mfg Co Ltd 積層セラミックコンデンサ及びその製造方法
TWI356658B (en) * 2003-01-23 2012-01-11 Toray Industries Members for circuit board, method and device for m
JP4483275B2 (ja) * 2003-02-05 2010-06-16 株式会社デンソー 積層型圧電素子及びその製造方法
EP2365553A1 (de) * 2003-07-28 2011-09-14 Kyocera Corporation Mehrschichtiges piezoelektrisches Element
US20060074790A1 (en) * 2004-10-06 2006-04-06 Jeremy Anspach Method for marketing leased assets
US8061147B2 (en) * 2005-01-12 2011-11-22 The Technical University Of Denmark Magnetic regenerator, a method of making a magnetic regenerator, a method of making an active magnetic refrigerator and an active magnetic refrigerator

Also Published As

Publication number Publication date
US20090038130A1 (en) 2009-02-12
JP2008205445A (ja) 2008-09-04
EP1953841A1 (de) 2008-08-06
EP1953841B1 (de) 2009-12-02
ATE450894T1 (de) 2009-12-15
US8006358B2 (en) 2011-08-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DELPHI TECHNOLOGIES HOLDING S.A.R.L., BASCHARA, LU