DE602007001366D1 - Elektronisches Bauelement für Wärmetransport durch Verdampfen und Kondensation, sowie Verfahren zur Herstellung. - Google Patents

Elektronisches Bauelement für Wärmetransport durch Verdampfen und Kondensation, sowie Verfahren zur Herstellung.

Info

Publication number
DE602007001366D1
DE602007001366D1 DE602007001366T DE602007001366T DE602007001366D1 DE 602007001366 D1 DE602007001366 D1 DE 602007001366D1 DE 602007001366 T DE602007001366 T DE 602007001366T DE 602007001366 T DE602007001366 T DE 602007001366T DE 602007001366 D1 DE602007001366 D1 DE 602007001366D1
Authority
DE
Germany
Prior art keywords
electronic component
condensation
evaporation
production
well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007001366T
Other languages
English (en)
Inventor
Jean-Antoine Gruss
Marc Plissonnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602007001366D1 publication Critical patent/DE602007001366D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/11—Automated chemical analysis
    • Y10T436/113332—Automated chemical analysis with conveyance of sample along a test line in a container or rack
    • Y10T436/114998—Automated chemical analysis with conveyance of sample along a test line in a container or rack with treatment or replacement of aspirator element [e.g., cleaning, etc.]
DE602007001366T 2006-07-20 2007-07-10 Elektronisches Bauelement für Wärmetransport durch Verdampfen und Kondensation, sowie Verfahren zur Herstellung. Active DE602007001366D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0606615A FR2904145B1 (fr) 2006-07-20 2006-07-20 Composant electronique a transfert de chaleur par ebullition et condensation et procede de fabrication

Publications (1)

Publication Number Publication Date
DE602007001366D1 true DE602007001366D1 (de) 2009-08-06

Family

ID=37946726

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007001366T Active DE602007001366D1 (de) 2006-07-20 2007-07-10 Elektronisches Bauelement für Wärmetransport durch Verdampfen und Kondensation, sowie Verfahren zur Herstellung.

Country Status (7)

Country Link
US (1) US7802437B2 (de)
EP (1) EP1881538B1 (de)
JP (1) JP5042736B2 (de)
AT (1) ATE434836T1 (de)
DE (1) DE602007001366D1 (de)
ES (1) ES2327970T3 (de)
FR (1) FR2904145B1 (de)

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Publication number Priority date Publication date Assignee Title
US8278800B2 (en) * 2008-08-21 2012-10-02 Innowattech Ltd. Multi-layer piezoelectric generator
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US8568027B2 (en) * 2009-08-26 2013-10-29 Ut-Battelle, Llc Carbon nanotube temperature and pressure sensors
EP2312661A1 (de) * 2009-10-16 2011-04-20 Alcatel Lucent Thermoelektrische Einheit
US8344597B2 (en) * 2009-10-22 2013-01-01 Lawrence Livermore National Security, Llc Matrix-assisted energy conversion in nanostructured piezoelectric arrays
KR20110064702A (ko) * 2009-12-08 2011-06-15 삼성전자주식회사 요철 구조를 지닌 코어-쉘 나노 와이어 및 이를 이용한 열전 소자
US8642974B2 (en) * 2009-12-30 2014-02-04 Fei Company Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation
IT1398955B1 (it) * 2010-03-22 2013-03-28 Itec Srl Radiatore di tipo alettato
FR2959875B1 (fr) * 2010-05-05 2012-05-18 Commissariat Energie Atomique Dispositif thermoelectrique modulable.
JP5577897B2 (ja) * 2010-07-02 2014-08-27 富士通株式会社 電子デバイスとその製造方法
US9444027B2 (en) * 2011-10-04 2016-09-13 Infineon Technologies Ag Thermoelectrical device and method for manufacturing same
US20140096939A1 (en) * 2012-10-10 2014-04-10 Novel Concepts, Inc. Heat Spreader with Thermal Conductivity Inversely Proportional to Increasing Heat
CN103233966B (zh) * 2012-12-21 2015-06-03 珠海一多监测科技有限公司 具有测温功能的智能螺栓
GB201312535D0 (en) * 2013-07-12 2013-08-28 Europ Thermodynamics Ltd Thermoelectric generator
CN103515524B (zh) * 2013-10-23 2015-08-12 中国科学院半导体研究所 面向片上集成的热电器件制备方法
JP6241201B2 (ja) * 2013-10-29 2017-12-06 富士通株式会社 電子デバイス及びその製造方法
CN103904209B (zh) * 2014-04-18 2016-08-24 中国科学院半导体研究所 基于纳米线的平面热电器件的制备方法
WO2016044638A1 (en) 2014-09-17 2016-03-24 The Regents Of The University Of Colorado, A Body Corporate Micropillar-enabled thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
WO2018089432A1 (en) * 2016-11-08 2018-05-17 Kelvin Thermal Technologies, Inc. Method and device for spreading high heat fluxes in thermal ground planes
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
US11477911B1 (en) * 2021-05-19 2022-10-18 Dell Products L.P. Heat pipe tapered down in fin stack region and oppositely tapered fin stack

Family Cites Families (14)

* Cited by examiner, † Cited by third party
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JPH11121816A (ja) * 1997-10-21 1999-04-30 Morikkusu Kk 熱電モジュールユニット
KR101008294B1 (ko) * 2001-03-30 2011-01-13 더 리전트 오브 더 유니버시티 오브 캘리포니아 나노구조체 및 나노와이어의 제조 방법 및 그로부터 제조되는 디바이스
JP4123017B2 (ja) * 2002-04-02 2008-07-23 三菱電機株式会社 熱輸送素子および熱輸送素子を用いた半導体装置および熱輸送素子を用いた大気圏外移動体
US7163659B2 (en) * 2002-12-03 2007-01-16 Hewlett-Packard Development Company, L.P. Free-standing nanowire sensor and method for detecting an analyte in a fluid
US7211143B2 (en) * 2002-12-09 2007-05-01 The Regents Of The University Of California Sacrificial template method of fabricating a nanotube
US6864571B2 (en) * 2003-07-07 2005-03-08 Gelcore Llc Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
US20050126766A1 (en) * 2003-09-16 2005-06-16 Koila,Inc. Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact
US20050257821A1 (en) * 2004-05-19 2005-11-24 Shriram Ramanathan Thermoelectric nano-wire devices
JP2008506254A (ja) * 2004-07-07 2008-02-28 ナノシス・インコーポレイテッド ナノワイヤーの集積及び組み込みのためのシステムおよび方法
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus
JP4482667B2 (ja) * 2004-09-13 2010-06-16 独立行政法人産業技術総合研究所 冷却効果を持つ配線構造
US20060090885A1 (en) * 2004-10-29 2006-05-04 Stephen Montgomery Thermally conductive channel between a semiconductor chip and an external thermal interface
US7449776B2 (en) * 2005-05-10 2008-11-11 Hewlett-Packard Development Company, L.P. Cooling devices that use nanowires
US20090056917A1 (en) * 2005-08-09 2009-03-05 The Regents Of The University Of California Nanostructured micro heat pipes

Also Published As

Publication number Publication date
EP1881538A1 (de) 2008-01-23
ATE434836T1 (de) 2009-07-15
JP2008047892A (ja) 2008-02-28
JP5042736B2 (ja) 2012-10-03
US20080017356A1 (en) 2008-01-24
ES2327970T3 (es) 2009-11-05
FR2904145A1 (fr) 2008-01-25
US7802437B2 (en) 2010-09-28
FR2904145B1 (fr) 2008-10-17
EP1881538B1 (de) 2009-06-24

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