DE602006021785D1 - Oberflächenrauhigkeitsprüfer - Google Patents

Oberflächenrauhigkeitsprüfer

Info

Publication number
DE602006021785D1
DE602006021785D1 DE602006021785T DE602006021785T DE602006021785D1 DE 602006021785 D1 DE602006021785 D1 DE 602006021785D1 DE 602006021785 T DE602006021785 T DE 602006021785T DE 602006021785 T DE602006021785 T DE 602006021785T DE 602006021785 D1 DE602006021785 D1 DE 602006021785D1
Authority
DE
Germany
Prior art keywords
oberflächenrauhigkeitsprüfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006021785T
Other languages
English (en)
Inventor
Yoshinori Hayashi
Hideki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of DE602006021785D1 publication Critical patent/DE602006021785D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE602006021785T 2005-12-06 2006-12-05 Oberflächenrauhigkeitsprüfer Active DE602006021785D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005352767 2005-12-06
PCT/JP2006/324264 WO2007066659A1 (ja) 2005-12-06 2006-12-05 面粗さ検査装置

Publications (1)

Publication Number Publication Date
DE602006021785D1 true DE602006021785D1 (de) 2011-06-16

Family

ID=38122805

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006021785T Active DE602006021785D1 (de) 2005-12-06 2006-12-05 Oberflächenrauhigkeitsprüfer

Country Status (8)

Country Link
US (1) US8433102B2 (de)
EP (1) EP1959487B1 (de)
JP (1) JP5322257B2 (de)
KR (1) KR100958493B1 (de)
CN (1) CN101326622B (de)
DE (1) DE602006021785D1 (de)
TW (1) TWI408333B (de)
WO (1) WO2007066659A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101202883B1 (ko) 2007-10-23 2012-11-19 시바우라 메카트로닉스 가부시키가이샤 원반형 기판의 검사 장치
JP2009250653A (ja) * 2008-04-02 2009-10-29 Nikon Corp 表面検査方法および装置
EP2291666A1 (de) * 2008-06-26 2011-03-09 Siemens Aktiengesellschaft Verfahren zur erfassung der kontaktierung zwischen messnadeln und einem prüfobjekt
KR20110110041A (ko) * 2010-03-31 2011-10-06 아사히 가라스 가부시키가이샤 광 투과성 직사각형 판상물의 단부면 검사 방법 및 단부면 검사 장치
US8629902B2 (en) 2010-10-12 2014-01-14 Kla-Tencor Corporation Coordinate fusion and thickness calibration for semiconductor wafer edge inspection
TWI489420B (zh) * 2012-02-29 2015-06-21 Chroma Ate Inc 表面花紋之檢測方法
TWI460395B (zh) * 2012-07-25 2014-11-11 Ind Tech Res Inst 平整度檢測裝置及其檢測方法
CN104332426A (zh) * 2014-11-18 2015-02-04 天津中环领先材料技术有限公司 非接触式扫描抛光片表面粗糙度的检测设备和检测方法
JP6834174B2 (ja) * 2016-05-13 2021-02-24 株式会社ジェイテクト 外観検査方法および外観検査装置
AU2017345588A1 (en) * 2016-10-20 2019-05-16 Ih Ip Holdings Limited Method of plating a metallic substrate to achieve a desired surface coarseness
CN108036736B (zh) * 2017-12-06 2020-03-13 长江存储科技有限责任公司 沟槽弯曲度测量方法及装置、缺陷数量预测方法及装置
TWI770906B (zh) * 2021-03-26 2022-07-11 環球晶圓股份有限公司 晶圓表面缺陷檢測方法及其裝置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106546A (ja) * 1986-06-14 1988-05-11 Narumi China Corp 欠陥検出方法
US5078954A (en) * 1990-04-17 1992-01-07 Smith Thurman D Method and apparatus for carrying out the in situ inspection of the shafts of pumps
JPH07270114A (ja) * 1994-03-31 1995-10-20 Japan Radio Co Ltd 光路長変動測定装置
JP2539182B2 (ja) * 1994-10-17 1996-10-02 株式会社日立製作所 半導体ウエハ上の異物検査方法
US5835220A (en) * 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
JPH11281337A (ja) * 1997-09-22 1999-10-15 Kobe Steel Ltd 欠陥検査装置
JP3425590B2 (ja) 1998-06-04 2003-07-14 三菱住友シリコン株式会社 端部傷検査方法およびその装置
JP3904565B2 (ja) 1998-07-28 2007-04-11 株式会社日立製作所 欠陥検査装置およびその方法
JP3544323B2 (ja) * 1998-08-31 2004-07-21 セントラル硝子株式会社 透明板の表面粗さ検査方法および装置
JP2000114329A (ja) * 1998-09-29 2000-04-21 Yuhi Denshi Kk 基板端部の研削面の検査方法とその装置
US6738505B1 (en) * 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
JP3897272B2 (ja) * 1999-09-28 2007-03-22 富士フイルム株式会社 画像解析装置
TW516083B (en) * 2000-09-18 2003-01-01 Olympus Optical Co Optical sensor
JP2004529485A (ja) * 2000-10-06 2004-09-24 アプライド　マテリアルズ　インコーポレイテッド 自動処理検査と階層型基板試験を規定するための方法と装置
JP4690584B2 (ja) * 2001-06-06 2011-06-01 有限会社ユナテック 表面評価装置及び表面評価方法
JP3709426B2 (ja) * 2001-11-02 2005-10-26 日本エレクトロセンサリデバイス株式会社 表面欠陥検出方法および表面欠陥検出装置
JP3629244B2 (ja) 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
US7009695B2 (en) * 2003-04-01 2006-03-07 Applied Materials, Inc. Full frame thermal pump probe technique for detecting subsurface defects
US7340087B2 (en) * 2003-07-14 2008-03-04 Rudolph Technologies, Inc. Edge inspection

Also Published As

Publication number Publication date
CN101326622B (zh) 2010-06-16
TW200728683A (en) 2007-08-01
EP1959487B1 (de) 2011-05-04
KR100958493B1 (ko) 2010-05-17
US8433102B2 (en) 2013-04-30
JP5322257B2 (ja) 2013-10-23
TWI408333B (zh) 2013-09-11
JPWO2007066659A1 (ja) 2009-05-21
WO2007066659A1 (ja) 2007-06-14
CN101326622A (zh) 2008-12-17
EP1959487A1 (de) 2008-08-20
US20090177415A1 (en) 2009-07-09
KR20080078812A (ko) 2008-08-28
EP1959487A4 (de) 2009-12-23

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