DE602006016598D1 - Laserbestrahlungsverfahren und vorrichtung dafür - Google Patents

Laserbestrahlungsverfahren und vorrichtung dafür

Info

Publication number
DE602006016598D1
DE602006016598D1 DE602006016598T DE602006016598T DE602006016598D1 DE 602006016598 D1 DE602006016598 D1 DE 602006016598D1 DE 602006016598 T DE602006016598 T DE 602006016598T DE 602006016598 T DE602006016598 T DE 602006016598T DE 602006016598 D1 DE602006016598 D1 DE 602006016598D1
Authority
DE
Germany
Prior art keywords
laser radiation
device therefor
radiation process
therefor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006016598T
Other languages
English (en)
Inventor
Junichi Shida
Suk-Hwan Chung
Shuichi Uryu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Publication of DE602006016598D1 publication Critical patent/DE602006016598D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
DE602006016598T 2005-06-13 2006-06-02 Laserbestrahlungsverfahren und vorrichtung dafür Active DE602006016598D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005172329A JP3845650B1 (ja) 2005-06-13 2005-06-13 レーザ照射方法及びその装置
PCT/JP2006/311069 WO2006134785A1 (ja) 2005-06-13 2006-06-02 レーザ照射方法及びその装置

Publications (1)

Publication Number Publication Date
DE602006016598D1 true DE602006016598D1 (de) 2010-10-14

Family

ID=37478007

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006016598T Active DE602006016598D1 (de) 2005-06-13 2006-06-02 Laserbestrahlungsverfahren und vorrichtung dafür

Country Status (7)

Country Link
US (2) US7471712B2 (de)
EP (1) EP1892751B1 (de)
JP (1) JP3845650B1 (de)
KR (1) KR100860252B1 (de)
DE (1) DE602006016598D1 (de)
TW (1) TWI303453B (de)
WO (1) WO2006134785A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4998946B2 (ja) * 2007-08-01 2012-08-15 株式会社日本製鋼所 レーザ照射方法及びその装置
WO2009066370A1 (ja) * 2007-11-20 2009-05-28 Mitsubishi Electric Corporation レーザ発振器内出射ミラーの劣化状態測定方法およびレーザ加工装置
JP5464972B2 (ja) * 2009-10-29 2014-04-09 住友重機械工業株式会社 レーザ加工装置
JP5731939B2 (ja) * 2011-09-27 2015-06-10 ビアメカニクス株式会社 レーザ加工装置
JP5789527B2 (ja) 2012-01-18 2015-10-07 株式会社アマダホールディングス レーザ加工装置及びレーザ発振制御方法
JP5454968B2 (ja) * 2012-02-14 2014-03-26 株式会社日本製鋼所 レーザ照射方法及びその装置
CN105102170A (zh) * 2013-04-17 2015-11-25 村田机械株式会社 激光加工机以及激光加工方法
EP2875896B1 (de) * 2013-11-22 2016-10-05 SALVAGNINI ITALIA S.p.A. Laserschneidkopf für Werkzeugmaschine mit einer an dem Kopf fixierten Kühleinrichtung
US9731381B2 (en) 2013-11-22 2017-08-15 Salvagnini Italia S.P.A. Laser cutting head for machine tool
WO2018047823A1 (ja) * 2016-09-09 2018-03-15 三菱電機株式会社 レーザ加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60247488A (ja) * 1985-05-08 1985-12-07 Hitachi Ltd レーザ装置
JPH04167990A (ja) * 1990-10-29 1992-06-16 Mitsubishi Electric Corp 焦点距離調整装置
JPH1137895A (ja) 1997-07-17 1999-02-12 Nikon Corp 反射率測定センサの検査方法
DE19782307T1 (de) * 1997-12-26 2001-02-01 Mitsubishi Electric Corp Laserbearbeitungsgerät
JP2000094173A (ja) * 1998-09-18 2000-04-04 Nippei Toyama Corp レーザ加工機におけるレーザビームの焦点位置調節装置及び調節方法
KR100916656B1 (ko) 2002-10-22 2009-09-08 삼성전자주식회사 레이저 조사 장치 및 이를 이용한 다결정 규소 박막트랜지스터의 제조 방법

Also Published As

Publication number Publication date
US7471712B2 (en) 2008-12-30
KR100860252B1 (ko) 2008-09-25
US20080030823A1 (en) 2008-02-07
EP1892751A1 (de) 2008-02-27
JP3845650B1 (ja) 2006-11-15
US7680163B2 (en) 2010-03-16
TWI303453B (en) 2008-11-21
KR20070069163A (ko) 2007-07-02
EP1892751A4 (de) 2009-07-29
TW200721274A (en) 2007-06-01
JP2006351593A (ja) 2006-12-28
EP1892751B1 (de) 2010-09-01
WO2006134785A1 (ja) 2006-12-21
US20090034578A1 (en) 2009-02-05

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