DE602006010825D1 - Komponentenmontagevorrichtung und verfahren zum festlegen der komponentenhalteteile - Google Patents

Komponentenmontagevorrichtung und verfahren zum festlegen der komponentenhalteteile

Info

Publication number
DE602006010825D1
DE602006010825D1 DE602006010825T DE602006010825T DE602006010825D1 DE 602006010825 D1 DE602006010825 D1 DE 602006010825D1 DE 602006010825 T DE602006010825 T DE 602006010825T DE 602006010825 T DE602006010825 T DE 602006010825T DE 602006010825 D1 DE602006010825 D1 DE 602006010825D1
Authority
DE
Germany
Prior art keywords
component
fixing
mounting device
holding parts
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006010825T
Other languages
English (en)
Inventor
Osamu Okuda
Takeyuki Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of DE602006010825D1 publication Critical patent/DE602006010825D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE602006010825T 2005-02-22 2006-02-21 Komponentenmontagevorrichtung und verfahren zum festlegen der komponentenhalteteile Active DE602006010825D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005045173A JP4555118B2 (ja) 2005-02-22 2005-02-22 部品装着装置及び部品保持部材の判別方法
PCT/JP2006/303522 WO2006090867A2 (en) 2005-02-22 2006-02-21 Component mounting apparatus and method for determining component holding members

Publications (1)

Publication Number Publication Date
DE602006010825D1 true DE602006010825D1 (de) 2010-01-14

Family

ID=36809041

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006010825T Active DE602006010825D1 (de) 2005-02-22 2006-02-21 Komponentenmontagevorrichtung und verfahren zum festlegen der komponentenhalteteile

Country Status (7)

Country Link
US (1) US7950145B2 (de)
EP (1) EP1856961B1 (de)
JP (1) JP4555118B2 (de)
KR (1) KR101189884B1 (de)
CN (1) CN100574601C (de)
DE (1) DE602006010825D1 (de)
WO (1) WO2006090867A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6043993B2 (ja) * 2011-10-31 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法
JP2014038946A (ja) * 2012-08-16 2014-02-27 Sony Corp 実装装置、部材の配置方法及び基板の製造方法
US10312118B2 (en) * 2014-01-16 2019-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Bonding apparatus and method
CN107251673B (zh) * 2015-02-12 2019-10-22 株式会社富士 元件供给装置
JP6484822B2 (ja) * 2016-05-26 2019-03-20 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6906158B2 (ja) * 2017-02-15 2021-07-21 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
EP3589106B1 (de) * 2017-02-23 2023-09-06 Fuji Corporation Komponentenmontagevorrichtung
KR20230060337A (ko) * 2021-10-27 2023-05-04 삼성엔지니어링 주식회사 전자도면자동생성장치 및 방법, 그리고 그 방법이 기록된 컴퓨터 판독매체

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02132897A (ja) * 1988-11-14 1990-05-22 Toshiba Corp 部品実装装置
JPH1070395A (ja) 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 部品装着装置
US6868603B2 (en) 1996-08-27 2005-03-22 Matsushita Electric Industrial Co., Ltd. Method of mounting component on circuit board
JP4480840B2 (ja) 2000-03-23 2010-06-16 パナソニック株式会社 部品実装装置、及び部品実装方法
JP2006210705A (ja) * 2005-01-28 2006-08-10 Juki Corp 電子部品実装装置

Also Published As

Publication number Publication date
EP1856961A2 (de) 2007-11-21
KR20070108144A (ko) 2007-11-08
JP2006237046A (ja) 2006-09-07
US7950145B2 (en) 2011-05-31
JP4555118B2 (ja) 2010-09-29
WO2006090867A3 (en) 2007-04-19
EP1856961B1 (de) 2009-12-02
US20080005894A1 (en) 2008-01-10
WO2006090867A2 (en) 2006-08-31
CN100574601C (zh) 2009-12-23
CN101103663A (zh) 2008-01-09
KR101189884B1 (ko) 2012-10-10

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Legal Events

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8364 No opposition during term of opposition