DE602005027781D1 - Aluminium/Keramik-Verbundsubstrat - Google Patents
Aluminium/Keramik-VerbundsubstratInfo
- Publication number
- DE602005027781D1 DE602005027781D1 DE602005027781T DE602005027781T DE602005027781D1 DE 602005027781 D1 DE602005027781 D1 DE 602005027781D1 DE 602005027781 T DE602005027781 T DE 602005027781T DE 602005027781 T DE602005027781 T DE 602005027781T DE 602005027781 D1 DE602005027781 D1 DE 602005027781D1
- Authority
- DE
- Germany
- Prior art keywords
- aluminum
- bonding substrate
- ceramic bonding
- ceramic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/95—Products characterised by their size, e.g. microceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/368—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/402—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004247005A JP4756165B2 (ja) | 2004-08-26 | 2004-08-26 | アルミニウム−セラミックス接合基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005027781D1 true DE602005027781D1 (de) | 2011-06-16 |
Family
ID=35429618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005027781T Active DE602005027781D1 (de) | 2004-08-26 | 2005-08-23 | Aluminium/Keramik-Verbundsubstrat |
Country Status (4)
Country | Link |
---|---|
US (1) | US7304378B2 (de) |
EP (1) | EP1631132B1 (de) |
JP (1) | JP4756165B2 (de) |
DE (1) | DE602005027781D1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1518847B1 (de) * | 2003-09-29 | 2013-08-28 | Dowa Metaltech Co., Ltd. | Aluminium-Keramik-Verbundsubstrat und Verfahren zu seiner Herstellung |
JP2013512155A (ja) | 2009-11-26 | 2013-04-11 | デイヴィッド,アルバート,ジョン | 保存ユニット用構造体 |
JP5524877B2 (ja) * | 2010-02-26 | 2014-06-18 | 富士フイルム株式会社 | アルミニウム合金板およびその製造方法 |
JP6099453B2 (ja) * | 2012-11-28 | 2017-03-22 | Dowaメタルテック株式会社 | 電子部品搭載基板およびその製造方法 |
EP3186077A4 (de) * | 2014-08-28 | 2018-04-18 | BYD Company Limited | Keramisches substrat, herstellungsverfahren dafür und leistungsmodul |
JP2016051778A (ja) * | 2014-08-29 | 2016-04-11 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板 |
CN105367076A (zh) * | 2015-10-27 | 2016-03-02 | 合肥龙多电子科技有限公司 | 一种高韧低膨胀系数的氮化铝-碳化硅复合电路板基板材料及其制备方法 |
CN105367071A (zh) * | 2015-10-27 | 2016-03-02 | 合肥龙多电子科技有限公司 | 一种光滑抗弯的高导热氮化铝-碳化硅复合电路板基板材料及其制备方法 |
WO2019006101A1 (en) * | 2017-06-30 | 2019-01-03 | Kyocera International, Inc. | MICROELECTRONIC BUILDING CONSTRUCTION ACTIVATED BY REINFORCING AND DESIGNING CERAMIC INSULATION |
CN114342209A (zh) | 2019-09-13 | 2022-04-12 | 米沃奇电动工具公司 | 具有宽带隙半导体的功率转换器 |
CN114349471B (zh) * | 2022-01-20 | 2022-11-25 | 深圳思睿辰新材料有限公司 | 一种用于igbt封装的陶瓷覆铝板及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5432011A (en) * | 1991-01-18 | 1995-07-11 | Centre National De La Recherche Scientifique | Aluminum alloys, substrates coated with these alloys and their applications |
TW350194B (en) * | 1994-11-30 | 1999-01-11 | Mitsubishi Gas Chemical Co | Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production |
JP3127754B2 (ja) | 1995-01-19 | 2001-01-29 | 富士電機株式会社 | 半導体装置 |
JPH09153567A (ja) | 1995-09-28 | 1997-06-10 | Toshiba Corp | 高熱伝導性窒化珪素回路基板および半導体装置 |
JP2000128654A (ja) | 1998-10-28 | 2000-05-09 | Sumitomo Electric Ind Ltd | 窒化ケイ素複合基板 |
JP2002012936A (ja) * | 2000-06-30 | 2002-01-15 | Furukawa Electric Co Ltd:The | 電子電気部品用基板に適したアルミニウム合金板およびその製造方法 |
US6613443B2 (en) * | 2000-10-27 | 2003-09-02 | Kabushiki Kaisha Toshiba | Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate |
JP3797905B2 (ja) * | 2000-10-27 | 2006-07-19 | 株式会社東芝 | 窒化けい素セラミックス基板およびそれを用いた窒化けい素セラミックス回路基板並びにその製造方法 |
JP4434545B2 (ja) * | 2001-03-01 | 2010-03-17 | Dowaホールディングス株式会社 | 半導体実装用絶縁基板及びパワーモジュール |
JP5073135B2 (ja) * | 2001-07-05 | 2012-11-14 | 電気化学工業株式会社 | 窒化アルミニウム焼結体、その製造方法及び用途 |
JP4356274B2 (ja) * | 2001-08-23 | 2009-11-04 | パナソニック電工株式会社 | 高周波回路用ジルコニア−アルミナ複合セラミック焼結体及び高周波用配線基板 |
JP4168114B2 (ja) | 2001-09-28 | 2008-10-22 | Dowaホールディングス株式会社 | 金属−セラミックス接合体 |
JP2003163315A (ja) * | 2001-11-29 | 2003-06-06 | Denki Kagaku Kogyo Kk | モジュール |
-
2004
- 2004-08-26 JP JP2004247005A patent/JP4756165B2/ja active Active
-
2005
- 2005-08-19 US US11/208,246 patent/US7304378B2/en active Active
- 2005-08-23 EP EP05018314A patent/EP1631132B1/de not_active Expired - Fee Related
- 2005-08-23 DE DE602005027781T patent/DE602005027781D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP1631132A2 (de) | 2006-03-01 |
EP1631132B1 (de) | 2011-05-04 |
US7304378B2 (en) | 2007-12-04 |
US20060043574A1 (en) | 2006-03-02 |
JP4756165B2 (ja) | 2011-08-24 |
JP2006062907A (ja) | 2006-03-09 |
EP1631132A3 (de) | 2007-08-01 |
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