DE602005019168D1 - Fluidabgabeeinrichtung - Google Patents
FluidabgabeeinrichtungInfo
- Publication number
- DE602005019168D1 DE602005019168D1 DE602005019168T DE602005019168T DE602005019168D1 DE 602005019168 D1 DE602005019168 D1 DE 602005019168D1 DE 602005019168 T DE602005019168 T DE 602005019168T DE 602005019168 T DE602005019168 T DE 602005019168T DE 602005019168 D1 DE602005019168 D1 DE 602005019168D1
- Authority
- DE
- Germany
- Prior art keywords
- supply device
- fluid supply
- discharging
- fluid
- fluids
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
- B05B7/062—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet
- B05B7/065—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet an inner gas outlet being surrounded by an annular adjacent liquid outlet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Nozzles (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT12312004 | 2004-07-20 | ||
PCT/EP2005/053197 WO2006008236A1 (en) | 2004-07-20 | 2005-07-05 | Fluid discharging device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005019168D1 true DE602005019168D1 (de) | 2010-03-18 |
Family
ID=34972835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005019168T Active DE602005019168D1 (de) | 2004-07-20 | 2005-07-05 | Fluidabgabeeinrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7891314B2 (de) |
EP (1) | EP1771875B1 (de) |
KR (1) | KR101244903B1 (de) |
AT (1) | ATE456859T1 (de) |
DE (1) | DE602005019168D1 (de) |
TW (1) | TWI267405B (de) |
WO (1) | WO2006008236A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165661A (ja) * | 2005-12-14 | 2007-06-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
US8480011B2 (en) | 2007-09-04 | 2013-07-09 | Dehn's Innovations, Llc | Nozzle system and method |
JP2010045138A (ja) * | 2008-08-11 | 2010-02-25 | Murata Machinery Ltd | ノズル |
US8997764B2 (en) | 2011-05-27 | 2015-04-07 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
JP5854496B2 (ja) * | 2011-06-06 | 2016-02-09 | 株式会社k&kサービス | 逃し部材、および、ノズル |
US9355883B2 (en) | 2011-09-09 | 2016-05-31 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
EP2626140A1 (de) * | 2012-02-07 | 2013-08-14 | Süss Microtec Lithography GmbH | Verfahren zur tropffreien Abgabe einer Flüssigkeit und Düse dafür |
KR101298087B1 (ko) * | 2012-02-15 | 2013-08-20 | 주식회사 신성에프에이 | 에어로졸 젯 프린터의 마스킹 장치 |
TWI437936B (zh) * | 2012-05-23 | 2014-05-11 | Unimicron Technology Corp | 濕式蝕刻設備及其供應裝置 |
US9316443B2 (en) | 2012-08-23 | 2016-04-19 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US10182696B2 (en) | 2012-09-27 | 2019-01-22 | Dehn's Innovations, Llc | Steam nozzle system and method |
US9147593B2 (en) | 2012-10-10 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
US9093482B2 (en) | 2012-10-12 | 2015-07-28 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
US10562078B2 (en) | 2013-07-01 | 2020-02-18 | Ecp Incorporated | Vacuum spray apparatus and uses thereof |
TWI617360B (zh) * | 2013-10-31 | 2018-03-11 | 德恩的創新公司 | 真空噴灑裝置及其用途 |
JP6321353B2 (ja) * | 2013-11-19 | 2018-05-09 | 株式会社荏原製作所 | 基板洗浄装置および基板処理装置 |
SG10201407598VA (en) | 2013-11-19 | 2015-06-29 | Ebara Corp | Substrate cleaning apparatus and substrate processing apparatus |
JP6305040B2 (ja) * | 2013-12-04 | 2018-04-04 | 株式会社ディスコ | 洗浄装置 |
JP6445772B2 (ja) * | 2014-03-17 | 2018-12-26 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
US9500405B2 (en) * | 2014-10-28 | 2016-11-22 | Lam Research Ag | Convective wafer heating by impingement with hot gas |
US9972514B2 (en) | 2016-03-07 | 2018-05-15 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
US9887122B2 (en) | 2016-05-06 | 2018-02-06 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
CN106863799B (zh) * | 2017-02-28 | 2019-08-16 | 绍兴市华获智能装备有限公司 | 一种3d打印机耗材喷头 |
US11931760B2 (en) | 2018-08-14 | 2024-03-19 | Ecp Incorporated | Spray head structure |
CN115700899A (zh) * | 2021-07-16 | 2023-02-07 | 江苏鲁汶仪器股份有限公司 | 一种用于晶圆扫描的喷嘴及扫描系统、扫描方法 |
CN114823431B (zh) * | 2022-06-28 | 2022-10-18 | 江苏芯梦半导体设备有限公司 | 一种用于清洗晶圆的喷射装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3626722A (en) * | 1969-07-22 | 1971-12-14 | Donald J Corsentino | Method and apparatus for producing a finely divided protected spray of liquid |
CH640571A5 (fr) * | 1981-03-06 | 1984-01-13 | Battelle Memorial Institute | Procede et dispositif pour deposer sur un substrat une couche de matiere minerale. |
AT389959B (de) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
US5165605A (en) * | 1989-03-30 | 1992-11-24 | Iwata Air Compressor Mfg. Co., Ltd. | Low pressure air atomizing spray gun |
US5800867A (en) * | 1992-08-13 | 1998-09-01 | Nordson Corporation | Deflection control of liquid or powder stream during dispensing |
JPH11274116A (ja) * | 1998-03-18 | 1999-10-08 | Ebara Corp | ガスポリッシング方法、ガスポリッシング用ノズル及びポリッシング装置 |
US6447632B1 (en) * | 1998-03-18 | 2002-09-10 | Ebara Corporation | Apparatus and nozzle device for gaseous polishing |
JPH11269670A (ja) * | 1998-03-18 | 1999-10-05 | Ebara Corp | ノズル装置及び基板の研磨装置 |
EP1038593B1 (de) | 1999-04-06 | 2000-10-04 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Einrichtung zum Austrag von zwei oder mehreren Medien mit Mediendüsen |
US6290863B1 (en) * | 1999-07-31 | 2001-09-18 | Micron Technology, Inc. | Method and apparatus for etch of a specific subarea of a semiconductor work object |
DE60040386D1 (de) * | 2000-06-19 | 2008-11-13 | Imec Inter Uni Micro Electr | Verfahren und Vorrichtung zur lokalen Flüssigkeitsbehandlung von einer Substratoberfläche |
JP2003100717A (ja) | 2001-09-21 | 2003-04-04 | Tokyo Electron Ltd | プラズマ処理装置 |
DE10322343A1 (de) | 2002-07-23 | 2004-02-05 | Wella Aktiengesellschaft | Vorrichtung für eine Farbbehandlung von Kopfhaar mittels eines Farbsprühstrahls aus einer Düse |
US7198055B2 (en) * | 2002-09-30 | 2007-04-03 | Lam Research Corporation | Meniscus, vacuum, IPA vapor, drying manifold |
-
2005
- 2005-06-24 TW TW094121169A patent/TWI267405B/zh not_active IP Right Cessation
- 2005-07-05 EP EP05767970A patent/EP1771875B1/de not_active Not-in-force
- 2005-07-05 AT AT05767970T patent/ATE456859T1/de not_active IP Right Cessation
- 2005-07-05 DE DE602005019168T patent/DE602005019168D1/de active Active
- 2005-07-05 US US11/659,668 patent/US7891314B2/en not_active Expired - Fee Related
- 2005-07-05 KR KR1020077002736A patent/KR101244903B1/ko not_active IP Right Cessation
- 2005-07-05 WO PCT/EP2005/053197 patent/WO2006008236A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20070032355A (ko) | 2007-03-21 |
EP1771875A1 (de) | 2007-04-11 |
TW200603895A (en) | 2006-02-01 |
EP1771875B1 (de) | 2010-01-27 |
KR101244903B1 (ko) | 2013-03-18 |
ATE456859T1 (de) | 2010-02-15 |
US20080048056A1 (en) | 2008-02-28 |
WO2006008236A1 (en) | 2006-01-26 |
TWI267405B (en) | 2006-12-01 |
US7891314B2 (en) | 2011-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |