DE602005016473D1 - Oberflächenwellenvorrichtung - Google Patents
OberflächenwellenvorrichtungInfo
- Publication number
- DE602005016473D1 DE602005016473D1 DE602005016473T DE602005016473T DE602005016473D1 DE 602005016473 D1 DE602005016473 D1 DE 602005016473D1 DE 602005016473 T DE602005016473 T DE 602005016473T DE 602005016473 T DE602005016473 T DE 602005016473T DE 602005016473 D1 DE602005016473 D1 DE 602005016473D1
- Authority
- DE
- Germany
- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- wave
- acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6436—Coupled resonator filters having one acoustic track only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004005954A JP2005203889A (ja) | 2004-01-13 | 2004-01-13 | 弾性表面波デバイス |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005016473D1 true DE602005016473D1 (de) | 2009-10-22 |
Family
ID=34616851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005016473T Active DE602005016473D1 (de) | 2004-01-13 | 2005-01-12 | Oberflächenwellenvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7215223B2 (de) |
EP (1) | EP1555751B1 (de) |
JP (1) | JP2005203889A (de) |
KR (1) | KR100614556B1 (de) |
CN (1) | CN1642004A (de) |
DE (1) | DE602005016473D1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8623709B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount silicon condenser microphone packages |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
JP4412123B2 (ja) * | 2004-09-09 | 2010-02-10 | エプソントヨコム株式会社 | 表面弾性波デバイス |
WO2007083432A1 (ja) * | 2006-01-18 | 2007-07-26 | Murata Manufacturing Co., Ltd. | 弾性表面波装置及び弾性境界波装置 |
JP5269301B2 (ja) | 2006-07-21 | 2013-08-21 | 太陽誘電株式会社 | 弾性表面波装置 |
WO2009057195A1 (ja) * | 2007-10-30 | 2009-05-07 | Fujitsu Limited | 弾性波素子、デュープレクサ、通信モジュール、および通信装置 |
TWI420810B (zh) | 2010-12-17 | 2013-12-21 | Ind Tech Res Inst | 石英振盪器及其製造方法 |
US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US20150077960A1 (en) * | 2013-09-19 | 2015-03-19 | Murata Manufacturing Co., Ltd. | Low-temperature packaging methodology for electronic devices and other devices |
JP6494470B2 (ja) * | 2015-03-18 | 2019-04-03 | 太陽誘電株式会社 | 弾性波デバイス |
US10218334B2 (en) | 2015-03-18 | 2019-02-26 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
JP6365436B2 (ja) * | 2015-06-24 | 2018-08-01 | 株式会社村田製作所 | 弾性波装置 |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
KR20180080875A (ko) * | 2017-01-05 | 2018-07-13 | 삼성전기주식회사 | 음향 공진기 및 그 제조방법 |
WO2021231132A1 (en) * | 2020-05-13 | 2021-11-18 | Avx Corporation | Filter with cover layer and shield layer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0840369A4 (de) | 1995-06-30 | 2001-12-19 | Toshiba Kk | Elektronisches bauteil und herstellungsverfahren dafür |
EP0961404B1 (de) | 1998-05-29 | 2008-07-02 | Fujitsu Limited | Akustisches Oberflächenwellenfilter mit verbesserter Unterdrückung ausserhalb eines Durchlassbereichs |
JP2000114916A (ja) | 1998-09-29 | 2000-04-21 | Nec Corp | 表面弾性波デバイス及びその製造方法 |
JP3726998B2 (ja) * | 1999-04-01 | 2005-12-14 | 株式会社村田製作所 | 表面波装置 |
JP2000332564A (ja) | 1999-05-20 | 2000-11-30 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス |
JP3860364B2 (ja) * | 1999-08-11 | 2006-12-20 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
JP2002141771A (ja) * | 2000-08-21 | 2002-05-17 | Murata Mfg Co Ltd | 弾性表面波フィルタ装置 |
TWI315607B (en) * | 2001-10-29 | 2009-10-01 | Panasonic Corp | Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same |
-
2004
- 2004-01-13 JP JP2004005954A patent/JP2005203889A/ja active Pending
-
2005
- 2005-01-12 EP EP05250120A patent/EP1555751B1/de not_active Expired - Fee Related
- 2005-01-12 DE DE602005016473T patent/DE602005016473D1/de active Active
- 2005-01-12 US US11/033,274 patent/US7215223B2/en active Active
- 2005-01-13 KR KR1020050003272A patent/KR100614556B1/ko active IP Right Grant
- 2005-01-13 CN CNA2005100057000A patent/CN1642004A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2005203889A (ja) | 2005-07-28 |
KR20050074332A (ko) | 2005-07-18 |
US7215223B2 (en) | 2007-05-08 |
CN1642004A (zh) | 2005-07-20 |
EP1555751A1 (de) | 2005-07-20 |
EP1555751B1 (de) | 2009-09-09 |
US20050151602A1 (en) | 2005-07-14 |
KR100614556B1 (ko) | 2006-08-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: TAIYO YUDEN CO., LTD., TOKIO/TOKYO, JP |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |