DE602005016473D1 - Oberflächenwellenvorrichtung - Google Patents

Oberflächenwellenvorrichtung

Info

Publication number
DE602005016473D1
DE602005016473D1 DE602005016473T DE602005016473T DE602005016473D1 DE 602005016473 D1 DE602005016473 D1 DE 602005016473D1 DE 602005016473 T DE602005016473 T DE 602005016473T DE 602005016473 T DE602005016473 T DE 602005016473T DE 602005016473 D1 DE602005016473 D1 DE 602005016473D1
Authority
DE
Germany
Prior art keywords
acoustic wave
surface acoustic
wave device
wave
acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005016473T
Other languages
English (en)
Inventor
Tomoka Hattanda
Osamu Kawachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Fujitsu Media Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Media Devices Ltd filed Critical Fujitsu Media Devices Ltd
Publication of DE602005016473D1 publication Critical patent/DE602005016473D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6436—Coupled resonator filters having one acoustic track only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE602005016473T 2004-01-13 2005-01-12 Oberflächenwellenvorrichtung Active DE602005016473D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004005954A JP2005203889A (ja) 2004-01-13 2004-01-13 弾性表面波デバイス

Publications (1)

Publication Number Publication Date
DE602005016473D1 true DE602005016473D1 (de) 2009-10-22

Family

ID=34616851

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005016473T Active DE602005016473D1 (de) 2004-01-13 2005-01-12 Oberflächenwellenvorrichtung

Country Status (6)

Country Link
US (1) US7215223B2 (de)
EP (1) EP1555751B1 (de)
JP (1) JP2005203889A (de)
KR (1) KR100614556B1 (de)
CN (1) CN1642004A (de)
DE (1) DE602005016473D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US8623710B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
JP4412123B2 (ja) * 2004-09-09 2010-02-10 エプソントヨコム株式会社 表面弾性波デバイス
JP4670872B2 (ja) * 2006-01-18 2011-04-13 株式会社村田製作所 弾性表面波装置
JP5269301B2 (ja) 2006-07-21 2013-08-21 太陽誘電株式会社 弾性表面波装置
KR101115185B1 (ko) 2007-10-30 2012-02-24 다이요 유덴 가부시키가이샤 탄성파 소자, 듀플렉서, 통신 모듈, 및 통신 장치
TWI420810B (zh) 2010-12-17 2013-12-21 Ind Tech Res Inst 石英振盪器及其製造方法
US9374643B2 (en) 2011-11-04 2016-06-21 Knowles Electronics, Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US20150077960A1 (en) * 2013-09-19 2015-03-19 Murata Manufacturing Co., Ltd. Low-temperature packaging methodology for electronic devices and other devices
US10218334B2 (en) 2015-03-18 2019-02-26 Taiyo Yuden Co., Ltd. Acoustic wave device
JP6494470B2 (ja) * 2015-03-18 2019-04-03 太陽誘電株式会社 弾性波デバイス
JP6365436B2 (ja) * 2015-06-24 2018-08-01 株式会社村田製作所 弾性波装置
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
KR20180080875A (ko) * 2017-01-05 2018-07-13 삼성전기주식회사 음향 공진기 및 그 제조방법
US20210360837A1 (en) * 2020-05-13 2021-11-18 Avx Corporation Filter with Cover Layer and Shield Layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1146029C (zh) 1995-06-30 2004-04-14 株式会社东芝 电子元件及包含该电子元件的移动体通信装置
EP0961404B1 (de) 1998-05-29 2008-07-02 Fujitsu Limited Akustisches Oberflächenwellenfilter mit verbesserter Unterdrückung ausserhalb eines Durchlassbereichs
JP2000114916A (ja) 1998-09-29 2000-04-21 Nec Corp 表面弾性波デバイス及びその製造方法
JP3726998B2 (ja) * 1999-04-01 2005-12-14 株式会社村田製作所 表面波装置
JP2000332564A (ja) 1999-05-20 2000-11-30 Matsushita Electric Ind Co Ltd 弾性表面波デバイス
JP3860364B2 (ja) * 1999-08-11 2006-12-20 富士通メディアデバイス株式会社 弾性表面波装置
JP2002141771A (ja) * 2000-08-21 2002-05-17 Murata Mfg Co Ltd 弾性表面波フィルタ装置
TWI315607B (en) * 2001-10-29 2009-10-01 Panasonic Corp Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same

Also Published As

Publication number Publication date
JP2005203889A (ja) 2005-07-28
EP1555751B1 (de) 2009-09-09
KR100614556B1 (ko) 2006-08-22
US7215223B2 (en) 2007-05-08
KR20050074332A (ko) 2005-07-18
CN1642004A (zh) 2005-07-20
US20050151602A1 (en) 2005-07-14
EP1555751A1 (de) 2005-07-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TAIYO YUDEN CO., LTD., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE