DE602005013539D1 - Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen - Google Patents

Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen

Info

Publication number
DE602005013539D1
DE602005013539D1 DE602005013539T DE602005013539T DE602005013539D1 DE 602005013539 D1 DE602005013539 D1 DE 602005013539D1 DE 602005013539 T DE602005013539 T DE 602005013539T DE 602005013539 T DE602005013539 T DE 602005013539T DE 602005013539 D1 DE602005013539 D1 DE 602005013539D1
Authority
DE
Germany
Prior art keywords
polymer compositions
semiconductor applications
polycycloolefin polymer
polycycloolefin
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005013539T
Other languages
English (en)
Inventor
Ramakrisha Ravikiran
Hendra Ng
Rajesh Raja Puthenkovilakom
Linda Zhang
Dino Amoroso
Brian Knapp
Andrew Bell
Larry F Rhodes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Promerus LLC
Original Assignee
Promerus LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promerus LLC filed Critical Promerus LLC
Publication of DE602005013539D1 publication Critical patent/DE602005013539D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F36/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5425Silicon-containing compounds containing oxygen containing at least one C=C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE602005013539T 2004-08-18 2005-08-17 Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen Active DE602005013539D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60236404P 2004-08-18 2004-08-18
US11/204,685 US7875686B2 (en) 2004-08-18 2005-08-16 Polycycloolefin polymeric compositions for semiconductor applications
PCT/US2005/029167 WO2006023511A1 (en) 2004-08-18 2005-08-17 Polycycloolefin polymeric compositions for semiconductor applications

Publications (1)

Publication Number Publication Date
DE602005013539D1 true DE602005013539D1 (de) 2009-05-07

Family

ID=35954100

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005013539T Active DE602005013539D1 (de) 2004-08-18 2005-08-17 Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen

Country Status (7)

Country Link
US (1) US7875686B2 (de)
EP (1) EP1791888B1 (de)
KR (1) KR100894052B1 (de)
DE (1) DE602005013539D1 (de)
HK (1) HK1106782A1 (de)
TW (1) TW200617039A (de)
WO (1) WO2006023511A1 (de)

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US20090008682A1 (en) * 2004-10-13 2009-01-08 Junya Kusunoki Light-Receiving Device
TW200619843A (en) * 2004-10-20 2006-06-16 Sumitomo Bakelite Co Semiconductor wafer and semiconductor device
US7332822B2 (en) * 2004-11-12 2008-02-19 Delphi Technologies, Inc. Flip chip system with organic/inorganic hybrid underfill composition
US7799883B2 (en) * 2005-02-22 2010-09-21 Promerus Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
US20060199301A1 (en) * 2005-03-07 2006-09-07 Basheer Rafil A Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from
US8030424B2 (en) 2006-08-23 2011-10-04 North Carolina State University Cyclobutene polymers and methods of making the same
JP2008063536A (ja) * 2006-09-11 2008-03-21 Fujifilm Corp 環状オレフィン系樹脂フィルム
US8039544B2 (en) 2007-09-04 2011-10-18 General Electric Company Coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US7906568B2 (en) 2007-09-04 2011-03-15 General Electric Company Coupling agent composition and associated method
US8039543B2 (en) 2007-09-04 2011-10-18 General Electric Company Composition comprising a coupling agent and a cycloolefin, the coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US7994238B2 (en) 2007-09-04 2011-08-09 General Electric Company Article and associated method
US7879123B2 (en) * 2007-09-27 2011-02-01 Pall Corporation Inertial separator
US7902279B2 (en) 2007-12-04 2011-03-08 General Electric Company Composition, article, and associated method
US7879963B2 (en) 2007-12-18 2011-02-01 General Electric Company Composition, article, and associated method
US8215496B2 (en) * 2008-01-28 2012-07-10 Promerus Llc Polynorbornene pervaporation membrane films, preparation and use thereof
KR20110020862A (ko) * 2008-06-02 2011-03-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착성 캡슐화 조성물 및 그것을 사용하여 제조한 전자 소자
JP5890177B2 (ja) * 2008-06-02 2016-03-22 スリーエム イノベイティブ プロパティズ カンパニー 接着剤封入組成物及びそれを用いて作製される電子デバイス
KR101046430B1 (ko) 2008-09-11 2011-07-05 삼성전기주식회사 저유전율 및 저손실 특성을 가진 노르보넨계 중합체, 이를이용한 절연재, 인쇄회로기판 및 기능성 소자
US8765894B2 (en) 2009-12-11 2014-07-01 Promerus, Llc Norbornene-type polymers having quaternary ammonium functionality
WO2011072304A2 (en) * 2009-12-11 2011-06-16 Promerus Llc Norbornene-type polymers having quaternary ammonium functionality
CA2933424A1 (en) * 2013-12-13 2015-06-18 Transfert Plus, Societe En Commandite Insertion polynorbornene-based thermoset resins
CN105985486B (zh) * 2015-02-05 2020-11-10 中国石油化工股份有限公司 一种双环戊二烯-环戊烯共聚物及其制备方法
TWI723243B (zh) * 2017-01-06 2021-04-01 日商住友電木股份有限公司 作為光學材料之聚環烯烴聚合物組成物
CN112313816A (zh) * 2018-06-28 2021-02-02 默克专利有限公司 制造电子器件的方法
JP7223854B2 (ja) * 2018-12-21 2023-02-16 プロメラス, エルエルシー ポリシクロオレフィンモノマー及び架橋剤に由来する高衝撃強度の3d印刷材料
WO2020243381A1 (en) * 2019-05-31 2020-12-03 Promerus, Llc Fast photocurable polycycloolefin compositions as optical or 3d printing materials
US11286338B2 (en) * 2019-09-18 2022-03-29 Promerus, Llc Two component mass polymerizable compositions containing polycycloolefin monomers and organoruthenium carbide precatalyst

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JPH02169619A (ja) 1988-12-23 1990-06-29 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いてなる光半導体素子
US4975221A (en) 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
JPH0463807A (ja) 1990-03-06 1992-02-28 Idemitsu Kosan Co Ltd ノルボルネン系重合体およびその製造方法ならびに該重合体からなるフィルムおよびその製造方法
US5659203A (en) 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant
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SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
CN1249105C (zh) 1998-10-05 2006-04-05 普罗米鲁斯有限责任公司 环烯烃聚合催化剂及聚合方法
US6903171B2 (en) 1998-10-05 2005-06-07 Promerus, Llc Polymerized cycloolefins using transition metal catalyst and end products thereof
US6927270B2 (en) 2001-06-27 2005-08-09 Hybrid Plastics Llp Process for the functionalization of polyhedral oligomeric silsesquioxanes
US6911518B2 (en) 1999-12-23 2005-06-28 Hybrid Plastics, Llc Polyhedral oligomeric -silsesquioxanes, -silicates and -siloxanes bearing ring-strained olefinic functionalities
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EP1307493A2 (de) 2000-07-28 2003-05-07 Goodrich Corporation Polymerzusammensetzung zur herstellung von lichtwellenleitern, lichtenwellenleiter dadurch hergestellt und ihre herstellungsverfahren
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US6617401B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst

Also Published As

Publication number Publication date
KR20070053277A (ko) 2007-05-23
US7875686B2 (en) 2011-01-25
TW200617039A (en) 2006-06-01
EP1791888A1 (de) 2007-06-06
US20060041093A1 (en) 2006-02-23
HK1106782A1 (en) 2008-03-20
KR100894052B1 (ko) 2009-04-20
WO2006023511A1 (en) 2006-03-02
EP1791888B1 (de) 2009-03-25

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