DE602005013539D1 - Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen - Google Patents
Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungenInfo
- Publication number
- DE602005013539D1 DE602005013539D1 DE602005013539T DE602005013539T DE602005013539D1 DE 602005013539 D1 DE602005013539 D1 DE 602005013539D1 DE 602005013539 T DE602005013539 T DE 602005013539T DE 602005013539 T DE602005013539 T DE 602005013539T DE 602005013539 D1 DE602005013539 D1 DE 602005013539D1
- Authority
- DE
- Germany
- Prior art keywords
- polymer compositions
- semiconductor applications
- polycycloolefin polymer
- polycycloolefin
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
- C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F36/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60236404P | 2004-08-18 | 2004-08-18 | |
US11/204,685 US7875686B2 (en) | 2004-08-18 | 2005-08-16 | Polycycloolefin polymeric compositions for semiconductor applications |
PCT/US2005/029167 WO2006023511A1 (en) | 2004-08-18 | 2005-08-17 | Polycycloolefin polymeric compositions for semiconductor applications |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005013539D1 true DE602005013539D1 (de) | 2009-05-07 |
Family
ID=35954100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005013539T Active DE602005013539D1 (de) | 2004-08-18 | 2005-08-17 | Polycycloolefinpolymerzusammensetzungen für halbleiteranwendungen |
Country Status (7)
Country | Link |
---|---|
US (1) | US7875686B2 (de) |
EP (1) | EP1791888B1 (de) |
KR (1) | KR100894052B1 (de) |
DE (1) | DE602005013539D1 (de) |
HK (1) | HK1106782A1 (de) |
TW (1) | TW200617039A (de) |
WO (1) | WO2006023511A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090008682A1 (en) * | 2004-10-13 | 2009-01-08 | Junya Kusunoki | Light-Receiving Device |
TW200619843A (en) * | 2004-10-20 | 2006-06-16 | Sumitomo Bakelite Co | Semiconductor wafer and semiconductor device |
US7332822B2 (en) * | 2004-11-12 | 2008-02-19 | Delphi Technologies, Inc. | Flip chip system with organic/inorganic hybrid underfill composition |
US7799883B2 (en) * | 2005-02-22 | 2010-09-21 | Promerus Llc | Norbornene-type polymers, compositions thereof and lithographic process using such compositions |
US20060199301A1 (en) * | 2005-03-07 | 2006-09-07 | Basheer Rafil A | Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from |
US8030424B2 (en) | 2006-08-23 | 2011-10-04 | North Carolina State University | Cyclobutene polymers and methods of making the same |
JP2008063536A (ja) * | 2006-09-11 | 2008-03-21 | Fujifilm Corp | 環状オレフィン系樹脂フィルム |
US8039544B2 (en) | 2007-09-04 | 2011-10-18 | General Electric Company | Coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine |
US7906568B2 (en) | 2007-09-04 | 2011-03-15 | General Electric Company | Coupling agent composition and associated method |
US8039543B2 (en) | 2007-09-04 | 2011-10-18 | General Electric Company | Composition comprising a coupling agent and a cycloolefin, the coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine |
US7994238B2 (en) | 2007-09-04 | 2011-08-09 | General Electric Company | Article and associated method |
US7879123B2 (en) * | 2007-09-27 | 2011-02-01 | Pall Corporation | Inertial separator |
US7902279B2 (en) | 2007-12-04 | 2011-03-08 | General Electric Company | Composition, article, and associated method |
US7879963B2 (en) | 2007-12-18 | 2011-02-01 | General Electric Company | Composition, article, and associated method |
US8215496B2 (en) * | 2008-01-28 | 2012-07-10 | Promerus Llc | Polynorbornene pervaporation membrane films, preparation and use thereof |
KR20110020862A (ko) * | 2008-06-02 | 2011-03-03 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착성 캡슐화 조성물 및 그것을 사용하여 제조한 전자 소자 |
JP5890177B2 (ja) * | 2008-06-02 | 2016-03-22 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤封入組成物及びそれを用いて作製される電子デバイス |
KR101046430B1 (ko) | 2008-09-11 | 2011-07-05 | 삼성전기주식회사 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체, 이를이용한 절연재, 인쇄회로기판 및 기능성 소자 |
US8765894B2 (en) | 2009-12-11 | 2014-07-01 | Promerus, Llc | Norbornene-type polymers having quaternary ammonium functionality |
WO2011072304A2 (en) * | 2009-12-11 | 2011-06-16 | Promerus Llc | Norbornene-type polymers having quaternary ammonium functionality |
CA2933424A1 (en) * | 2013-12-13 | 2015-06-18 | Transfert Plus, Societe En Commandite | Insertion polynorbornene-based thermoset resins |
CN105985486B (zh) * | 2015-02-05 | 2020-11-10 | 中国石油化工股份有限公司 | 一种双环戊二烯-环戊烯共聚物及其制备方法 |
TWI723243B (zh) * | 2017-01-06 | 2021-04-01 | 日商住友電木股份有限公司 | 作為光學材料之聚環烯烴聚合物組成物 |
CN112313816A (zh) * | 2018-06-28 | 2021-02-02 | 默克专利有限公司 | 制造电子器件的方法 |
JP7223854B2 (ja) * | 2018-12-21 | 2023-02-16 | プロメラス, エルエルシー | ポリシクロオレフィンモノマー及び架橋剤に由来する高衝撃強度の3d印刷材料 |
WO2020243381A1 (en) * | 2019-05-31 | 2020-12-03 | Promerus, Llc | Fast photocurable polycycloolefin compositions as optical or 3d printing materials |
US11286338B2 (en) * | 2019-09-18 | 2022-03-29 | Promerus, Llc | Two component mass polymerizable compositions containing polycycloolefin monomers and organoruthenium carbide precatalyst |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL284832A (de) | 1961-10-30 | |||
US3644482A (en) | 1961-10-30 | 1972-02-22 | Geigy Ag J R | (4-hydroxy-5-alkylphenyl) alkanoic acid esters of polyols |
JPH02169619A (ja) | 1988-12-23 | 1990-06-29 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いてなる光半導体素子 |
US4975221A (en) | 1989-05-12 | 1990-12-04 | National Starch And Chemical Investment Holding Corporation | High purity epoxy formulations for use as die attach adhesives |
JPH0463807A (ja) | 1990-03-06 | 1992-02-28 | Idemitsu Kosan Co Ltd | ノルボルネン系重合体およびその製造方法ならびに該重合体からなるフィルムおよびその製造方法 |
US5659203A (en) | 1995-06-07 | 1997-08-19 | International Business Machines Corporation | Reworkable polymer chip encapsulant |
US5998867A (en) | 1996-02-23 | 1999-12-07 | Honeywell Inc. | Radiation enhanced chip encapsulant |
US6232417B1 (en) | 1996-03-07 | 2001-05-15 | The B. F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
DE69711378T2 (de) | 1996-11-04 | 2002-10-24 | The B.F. Goodrich Co., Richfield | Photostrukturierbare dielektrische zusammensetzungen |
DE1025587T1 (de) | 1997-07-21 | 2001-02-08 | Aguila Technologies, Inc. | Halbleiter-flipchippackung und herstellungsverfahren dafür |
US6117708A (en) | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device |
US6265530B1 (en) | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
SG105450A1 (en) | 1998-07-02 | 2004-08-27 | Nat Starch Chem Invest | Allylated amide compounds and die attach adhesives prepared therefrom |
CN1249105C (zh) | 1998-10-05 | 2006-04-05 | 普罗米鲁斯有限责任公司 | 环烯烃聚合催化剂及聚合方法 |
US6903171B2 (en) | 1998-10-05 | 2005-06-07 | Promerus, Llc | Polymerized cycloolefins using transition metal catalyst and end products thereof |
US6927270B2 (en) | 2001-06-27 | 2005-08-09 | Hybrid Plastics Llp | Process for the functionalization of polyhedral oligomeric silsesquioxanes |
US6911518B2 (en) | 1999-12-23 | 2005-06-28 | Hybrid Plastics, Llc | Polyhedral oligomeric -silsesquioxanes, -silicates and -siloxanes bearing ring-strained olefinic functionalities |
CA2347872A1 (en) | 2000-05-18 | 2001-11-18 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with vinyl ether and carbamate or urea functionality |
EP1307493A2 (de) | 2000-07-28 | 2003-05-07 | Goodrich Corporation | Polymerzusammensetzung zur herstellung von lichtwellenleitern, lichtenwellenleiter dadurch hergestellt und ihre herstellungsverfahren |
US6537851B1 (en) | 2000-10-13 | 2003-03-25 | Bridge Semiconductor Corporation | Method of connecting a bumped compliant conductive trace to a semiconductor chip |
US6617401B2 (en) | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
US6617400B2 (en) | 2001-08-23 | 2003-09-09 | General Electric Company | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
-
2005
- 2005-08-16 US US11/204,685 patent/US7875686B2/en not_active Expired - Fee Related
- 2005-08-17 WO PCT/US2005/029167 patent/WO2006023511A1/en active Application Filing
- 2005-08-17 DE DE602005013539T patent/DE602005013539D1/de active Active
- 2005-08-17 EP EP05786286A patent/EP1791888B1/de not_active Not-in-force
- 2005-08-17 KR KR1020077006247A patent/KR100894052B1/ko not_active IP Right Cessation
- 2005-08-18 TW TW094128148A patent/TW200617039A/zh unknown
-
2007
- 2007-11-07 HK HK07112075.6A patent/HK1106782A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20070053277A (ko) | 2007-05-23 |
US7875686B2 (en) | 2011-01-25 |
TW200617039A (en) | 2006-06-01 |
EP1791888A1 (de) | 2007-06-06 |
US20060041093A1 (en) | 2006-02-23 |
HK1106782A1 (en) | 2008-03-20 |
KR100894052B1 (ko) | 2009-04-20 |
WO2006023511A1 (en) | 2006-03-02 |
EP1791888B1 (de) | 2009-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |