DE602005008289D1 - Plasmadetektor und Laservorrichtung mit dem Plasmadetektor - Google Patents

Plasmadetektor und Laservorrichtung mit dem Plasmadetektor

Info

Publication number
DE602005008289D1
DE602005008289D1 DE602005008289T DE602005008289T DE602005008289D1 DE 602005008289 D1 DE602005008289 D1 DE 602005008289D1 DE 602005008289 T DE602005008289 T DE 602005008289T DE 602005008289 T DE602005008289 T DE 602005008289T DE 602005008289 D1 DE602005008289 D1 DE 602005008289D1
Authority
DE
Germany
Prior art keywords
plasma detector
laser device
plasma
detector
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005008289T
Other languages
English (en)
Inventor
Tsunehiko Yamazaki
Naoomi Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamazaki Mazak Corp
Original Assignee
Yamazaki Mazak Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamazaki Mazak Corp filed Critical Yamazaki Mazak Corp
Publication of DE602005008289D1 publication Critical patent/DE602005008289D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Plasma Technology (AREA)
DE602005008289T 2004-02-05 2005-02-04 Plasmadetektor und Laservorrichtung mit dem Plasmadetektor Expired - Fee Related DE602005008289D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004029509A JP4646525B2 (ja) 2004-02-05 2004-02-05 プラズマ検出装置、及びプラズマ検出装置付きレーザ加工機

Publications (1)

Publication Number Publication Date
DE602005008289D1 true DE602005008289D1 (de) 2008-09-04

Family

ID=34675532

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005008289T Expired - Fee Related DE602005008289D1 (de) 2004-02-05 2005-02-04 Plasmadetektor und Laservorrichtung mit dem Plasmadetektor

Country Status (5)

Country Link
US (1) US7411152B2 (de)
EP (1) EP1561537B1 (de)
JP (1) JP4646525B2 (de)
CN (1) CN100337780C (de)
DE (1) DE602005008289D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828316B2 (ja) * 2006-06-13 2011-11-30 三菱電機株式会社 レーザ加工機用のギャップ検出装置及びレーザ加工システム並びにレーザ加工機用のギャップ検出方法
US7722778B2 (en) * 2006-06-28 2010-05-25 Lam Research Corporation Methods and apparatus for sensing unconfinement in a plasma processing chamber
JP4271696B2 (ja) * 2006-08-29 2009-06-03 ヤマザキマザック株式会社 レーザ加工機の自動工具交換装置
US8244494B2 (en) * 2007-04-06 2012-08-14 Hypertherm, Inc. Plasma insensitive height sensing
US8373425B2 (en) * 2007-04-06 2013-02-12 Hypertherm, Inc. Plasma insensitive height sensing
US8546724B2 (en) * 2010-01-26 2013-10-01 King Fahd University Of Petroleum & Minerals Apparatus and method for controlling laser cutting through surface plasma monitoring
US9638664B2 (en) 2011-05-13 2017-05-02 Dbd Innovations Pty Ltd Method of analyzing a material
JP5676405B2 (ja) * 2011-09-27 2015-02-25 富士フイルム株式会社 放射線画像撮影装置、放射線画像撮影システム、プログラムおよび放射線画像撮影方法
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置
JP6034030B2 (ja) * 2012-03-09 2016-11-30 株式会社ディスコ レーザー加工方法およびレーザー加工装置
JP5902540B2 (ja) * 2012-04-02 2016-04-13 株式会社ディスコ レーザー加工方法およびレーザー加工装置
DE102014217154B4 (de) * 2014-08-28 2016-09-22 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Einstechen in metallische Werkstücke mittels eines Laserstrahls sowie zugehörige Laserbearbeitungsmaschine und Computerprogrammprodukt
JP6339603B2 (ja) * 2016-01-28 2018-06-06 ファナック株式会社 レーザ加工開始条件を学習する機械学習装置、レーザ装置および機械学習方法
US10195683B2 (en) * 2016-11-14 2019-02-05 Matthew Fagan Metal analyzing plasma CNC cutting machine and associated methods
US10300551B2 (en) * 2016-11-14 2019-05-28 Matthew Fagan Metal analyzing plasma CNC cutting machine and associated methods
WO2019220611A1 (ja) * 2018-05-18 2019-11-21 株式会社Ｆｕｊｉ 加工時間割り当てシミュレート方法とシミュレート装置
JP6810110B2 (ja) 2018-08-24 2021-01-06 ファナック株式会社 加工条件調整装置及び機械学習装置
JP6740299B2 (ja) 2018-08-24 2020-08-12 ファナック株式会社 加工条件調整装置及び機械学習装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117586A (en) * 1979-03-05 1980-09-09 Hitachi Ltd Laser working machine
US4447151A (en) * 1981-06-18 1984-05-08 The United States Of America As Represented By The Department Of Energy Method and apparatus for fast laser pulse detection using gaseous plasmas
US5013886A (en) * 1990-07-23 1991-05-07 General Electric Company Real-time magnetic-flux breakthrough detection method and system for laser drilling
EP0473287A1 (de) * 1990-08-09 1992-03-04 Cmb Foodcan Plc Gerät und Verfahren zur Überwachung der Laserbearbeitung von Materialen
US5059761A (en) * 1990-12-21 1991-10-22 General Electric Company Inductive depth sensing and controlling method and system for laser drilling
CN1027579C (zh) * 1991-11-20 1995-02-08 华中理工大学 连续激光焊接过程中焊接质量的实时监测方法
JP3187147B2 (ja) * 1992-06-26 2001-07-11 東洋電子株式会社 レーザー加工装置
JPH06312283A (ja) * 1993-04-28 1994-11-08 Toyo Denshi Kk レーザー加工装置
JP3356043B2 (ja) * 1997-12-26 2002-12-09 三菱電機株式会社 レーザ加工装置用距離検出器
JP2000084683A (ja) * 1998-09-08 2000-03-28 Laser Oyo Kogaku Kenkyusho:Kk レーザー溶接時の異常モニタリング方法及び装置
EP1238749B1 (de) 2001-03-08 2005-12-07 Trumpf Werkzeugmaschinen GmbH + Co. KG Verfahren und Vorrichtung zum Brennschneiden von Werkstücken
US20030102294A1 (en) * 2001-05-23 2003-06-05 Yoshihide Kinbara Laser machining apparatus
JP2004243408A (ja) * 2003-02-17 2004-09-02 Yamazaki Mazak Corp レーザ加工機

Also Published As

Publication number Publication date
CN100337780C (zh) 2007-09-19
EP1561537A1 (de) 2005-08-10
US7411152B2 (en) 2008-08-12
JP4646525B2 (ja) 2011-03-09
US20050178749A1 (en) 2005-08-18
EP1561537B1 (de) 2008-07-23
JP2005219093A (ja) 2005-08-18
CN1651176A (zh) 2005-08-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee