DE602005007417D1 - Verfahren zur Herstellung von eingebetteten Dünnschichtwiderständen - Google Patents

Verfahren zur Herstellung von eingebetteten Dünnschichtwiderständen

Info

Publication number
DE602005007417D1
DE602005007417D1 DE200560007417 DE602005007417T DE602005007417D1 DE 602005007417 D1 DE602005007417 D1 DE 602005007417D1 DE 200560007417 DE200560007417 DE 200560007417 DE 602005007417 T DE602005007417 T DE 602005007417T DE 602005007417 D1 DE602005007417 D1 DE 602005007417D1
Authority
DE
Germany
Prior art keywords
production
thin film
film resistors
embedded thin
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560007417
Other languages
English (en)
Inventor
Sung-Ling Su
Zhiqiang Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brain Power Co
Original Assignee
Brain Power Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brain Power Co filed Critical Brain Power Co
Publication of DE602005007417D1 publication Critical patent/DE602005007417D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE200560007417 2004-04-30 2005-04-28 Verfahren zur Herstellung von eingebetteten Dünnschichtwiderständen Active DE602005007417D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100372602A CN100482037C (zh) 2004-04-30 2004-04-30 印刷电路板的嵌入式薄膜电阻制造方法

Publications (1)

Publication Number Publication Date
DE602005007417D1 true DE602005007417D1 (de) 2008-07-24

Family

ID=34935917

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560007417 Active DE602005007417D1 (de) 2004-04-30 2005-04-28 Verfahren zur Herstellung von eingebetteten Dünnschichtwiderständen

Country Status (3)

Country Link
EP (1) EP1592289B1 (de)
CN (1) CN100482037C (de)
DE (1) DE602005007417D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101222819B (zh) * 2007-01-09 2011-05-18 健鼎科技股份有限公司 嵌入式被动元件的制造方法
JP6110113B2 (ja) * 2012-11-20 2017-04-05 株式会社日本マイクロニクス 多層配線基板、及びその製造方法
WO2019066815A1 (en) * 2017-09-27 2019-04-04 Intel Corporation SUBSTRATE WITH INTEGRATED RESISTIVE CIRCUIT MEMBER AND METHOD FOR PROVIDING THE SAME
CN108990270A (zh) * 2018-08-07 2018-12-11 江苏普诺威电子股份有限公司 平面内埋薄膜电阻pcb板及其加工工艺
CN111642075A (zh) * 2020-07-03 2020-09-08 广东兴达鸿业电子有限公司 单面电阻线路板的制作方法及多层pcb板的制作方法
CN115720414B (zh) * 2023-01-10 2023-05-05 四川斯艾普电子科技有限公司 一种厚薄膜防打火电路板形成方法
CN117693088A (zh) * 2023-12-29 2024-03-12 中山市成源光电科技有限公司 一种对cob光源调光调色的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163760A2 (de) * 1984-06-05 1985-12-11 Nippon Mektron, Ltd. Gedruckte Schaltung mit integriertem elektronischem Widerstand und Verfahren zu ihrer Herstellung
EP0837623B1 (de) * 1996-10-16 2004-08-18 Macdermid Incorporated Verfahren zur Herstellung gedruckter Leiterplatten mit plattierten Widerständen
US6767445B2 (en) * 2002-10-16 2004-07-27 Peter Kukanskis Method for the manufacture of printed circuit boards with integral plated resistors

Also Published As

Publication number Publication date
EP1592289B1 (de) 2008-06-11
EP1592289A1 (de) 2005-11-02
CN100482037C (zh) 2009-04-22
CN1691874A (zh) 2005-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition