DE602004017728D1 - Verfahren zur messung von submikrometergrabenstrukturen - Google Patents

Verfahren zur messung von submikrometergrabenstrukturen

Info

Publication number
DE602004017728D1
DE602004017728D1 DE602004017728T DE602004017728T DE602004017728D1 DE 602004017728 D1 DE602004017728 D1 DE 602004017728D1 DE 602004017728 T DE602004017728 T DE 602004017728T DE 602004017728 T DE602004017728 T DE 602004017728T DE 602004017728 D1 DE602004017728 D1 DE 602004017728D1
Authority
DE
Germany
Prior art keywords
surface acoustic
trenches
acoustic wave
determining
generate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004017728T
Other languages
English (en)
Inventor
Alexei Maznev
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Metrology Systems LLC
Original Assignee
Advanced Metrology Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Metrology Systems LLC filed Critical Advanced Metrology Systems LLC
Publication of DE602004017728D1 publication Critical patent/DE602004017728D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/636—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited using an arrangement of pump beam and probe beam; using the measurement of optical non-linear properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0237—Thin materials, e.g. paper, membranes, thin films
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Acoustics & Sound (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
DE602004017728T 2003-06-24 2004-06-23 Verfahren zur messung von submikrometergrabenstrukturen Expired - Fee Related DE602004017728D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48209903P 2003-06-24 2003-06-24
US55807104P 2004-03-31 2004-03-31
PCT/IB2004/050985 WO2004113883A1 (en) 2003-06-24 2004-06-23 Method of measuring sub-micron trench structures

Publications (1)

Publication Number Publication Date
DE602004017728D1 true DE602004017728D1 (de) 2008-12-24

Family

ID=33544498

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004017728T Expired - Fee Related DE602004017728D1 (de) 2003-06-24 2004-06-23 Verfahren zur messung von submikrometergrabenstrukturen

Country Status (8)

Country Link
US (1) US7499183B2 (de)
EP (1) EP1639344B1 (de)
JP (1) JP2007521476A (de)
KR (1) KR20060024435A (de)
AT (1) ATE414271T1 (de)
DE (1) DE602004017728D1 (de)
TW (1) TWI296041B (de)
WO (1) WO2004113883A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5087864B2 (ja) * 2006-06-21 2012-12-05 富士通株式会社 膜厚予測プログラム、記録媒体、膜厚予測装置および膜厚予測方法
KR101741191B1 (ko) * 2009-04-14 2017-05-29 가부시키가이샤 리가쿠 표면미세구조 계측방법, 표면미세구조 계측데이터 해석방법 및 ｘ선 산란 측정장치
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
WO2014081909A1 (en) * 2012-11-21 2014-05-30 Kla-Tencor Corporation In-situ metrology
WO2016171772A1 (en) * 2015-04-21 2016-10-27 Massachusetts Institute Of Technology Dual trench deep trench-based unreleased mems resonators
KR20170138207A (ko) 2016-06-07 2017-12-15 삼성전자주식회사 표면 검사 방법
JP2020505638A (ja) 2017-01-25 2020-02-20 エーエスエムエル ネザーランズ ビー．ブイ． 基板上の構造を測定するための方法及び装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978713A (en) * 1975-05-27 1976-09-07 General Electric Company Laser generation of ultrasonic waves for nondestructive testing
US4710030A (en) * 1985-05-17 1987-12-01 Bw Brown University Research Foundation Optical generator and detector of stress pulses
US5633711A (en) * 1991-07-08 1997-05-27 Massachusettes Institute Of Technology Measurement of material properties with optically induced phonons
US5812261A (en) * 1992-07-08 1998-09-22 Active Impulse Systems, Inc. Method and device for measuring the thickness of opaque and transparent films
US5546811A (en) * 1995-01-24 1996-08-20 Massachusetts Instittue Of Technology Optical measurements of stress in thin film materials
US5585921A (en) * 1995-03-15 1996-12-17 Hughes Aircraft Company Laser-ultrasonic non-destructive, non-contacting inspection system
US6016202A (en) * 1997-06-30 2000-01-18 U.S. Philips Corporation Method and apparatus for measuring material properties using transient-grating spectroscopy
US5982482A (en) * 1997-07-31 1999-11-09 Massachusetts Institute Of Technology Determining the presence of defects in thin film structures
US6256100B1 (en) * 1998-04-27 2001-07-03 Active Impulse Systems, Inc. Method and device for measuring the thickness of thin films near a sample's edge and in a damascene-type structure
US6795198B1 (en) * 1998-05-28 2004-09-21 Martin Fuchs Method and device for measuring thin films and semiconductor substrates using reflection mode geometry
US6188478B1 (en) * 1998-10-21 2001-02-13 Philips Electronics North America Corporation Method and apparatus for film-thickness measurements
US6174739B1 (en) * 1999-06-30 2001-01-16 Advanced Micro Devices, Inc. Method of monitoring via and trench profiles during manufacture
US6587794B1 (en) * 1999-07-30 2003-07-01 Koninklijke Philips Electronics N.V. Method for measuring thin metal films
US6809991B1 (en) * 2003-01-21 2004-10-26 Raytheon Company Method and apparatus for detecting hidden features disposed in an opaque environment

Also Published As

Publication number Publication date
US20080123080A1 (en) 2008-05-29
KR20060024435A (ko) 2006-03-16
EP1639344B1 (de) 2008-11-12
WO2004113883A1 (en) 2004-12-29
TW200516228A (en) 2005-05-16
US7499183B2 (en) 2009-03-03
ATE414271T1 (de) 2008-11-15
TWI296041B (en) 2008-04-21
EP1639344A1 (de) 2006-03-29
JP2007521476A (ja) 2007-08-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee