DE602004015192D1 - Fokussierungsoptik zum Laserschneiden - Google Patents
Fokussierungsoptik zum LaserschneidenInfo
- Publication number
- DE602004015192D1 DE602004015192D1 DE602004015192T DE602004015192T DE602004015192D1 DE 602004015192 D1 DE602004015192 D1 DE 602004015192D1 DE 602004015192 T DE602004015192 T DE 602004015192T DE 602004015192 T DE602004015192 T DE 602004015192T DE 602004015192 D1 DE602004015192 D1 DE 602004015192D1
- Authority
- DE
- Germany
- Prior art keywords
- optical unit
- laser cutting
- focusing optics
- line segment
- optic axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
- B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lenses (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0306155A FR2855084A1 (fr) | 2003-05-22 | 2003-05-22 | Optique de focalisation pour le coupage laser |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004015192D1 true DE602004015192D1 (de) | 2008-09-04 |
Family
ID=33042016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004015192T Expired - Fee Related DE602004015192D1 (de) | 2003-05-22 | 2004-05-12 | Fokussierungsoptik zum Laserschneiden |
Country Status (9)
Country | Link |
---|---|
US (1) | US20050024743A1 (de) |
EP (1) | EP1479473B1 (de) |
JP (1) | JP2004348137A (de) |
CN (1) | CN1573364A (de) |
AT (1) | ATE401989T1 (de) |
BR (1) | BRPI0401806A (de) |
CA (1) | CA2469861A1 (de) |
DE (1) | DE602004015192D1 (de) |
FR (1) | FR2855084A1 (de) |
Families Citing this family (74)
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WO2004101512A2 (en) * | 2003-05-13 | 2004-11-25 | Smithkline Beecham Corporation | Naphthyridine integrase inhibitors |
FR2880566A1 (fr) * | 2005-01-12 | 2006-07-14 | Air Liquide | Coupage laser avec une lentille revetue de baf2 |
FR2880567B1 (fr) * | 2005-01-12 | 2007-02-23 | Air Liquide | Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur |
FR2880568B1 (fr) * | 2005-01-12 | 2007-03-30 | Air Liquide | Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur |
CN102009270B (zh) * | 2005-06-27 | 2013-03-06 | 日东电工株式会社 | 激光材料加工用表面保护片 |
FR2893873B1 (fr) * | 2005-11-25 | 2008-12-12 | Air Liquide | Procede de coupage avec un laser a fibre d'acier inoxydable |
EP1815937A1 (de) * | 2006-02-07 | 2007-08-08 | Air Liquide Espana SA | Laserstrahlschneidverfahren eines Werkstückes aus Titanium unter Verwendung eines Gasmischung Ar/He |
DE102007024701A1 (de) | 2007-05-25 | 2008-11-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens |
DE102007024700A1 (de) * | 2007-05-25 | 2008-12-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens |
US9664012B2 (en) | 2008-08-20 | 2017-05-30 | Foro Energy, Inc. | High power laser decomissioning of multistring and damaged wells |
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US8624155B1 (en) * | 2009-05-12 | 2014-01-07 | Vinyl Technologies, Inc. | Apparatus for scribing thin films in photovoltaic cells |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
US8000212B2 (en) * | 2009-12-15 | 2011-08-16 | Cymer, Inc. | Metrology for extreme ultraviolet light source |
JP5737900B2 (ja) * | 2010-10-15 | 2015-06-17 | 三菱重工業株式会社 | レーザ加工装置及びレーザ加工方法 |
RU2459690C1 (ru) * | 2011-01-17 | 2012-08-27 | Открытое акционерное общество "Машиностроительный завод" | Способ лазерного раскроя металлического листового материала |
CN102230983A (zh) * | 2011-06-17 | 2011-11-02 | 山西飞虹激光科技有限公司 | 用于激光加工的光学元件及激光加工设备 |
TW201343296A (zh) * | 2012-03-16 | 2013-11-01 | Ipg Microsystems Llc | 使一工件中具有延伸深度虛飾之雷射切割系統及方法 |
BR112015004458A8 (pt) | 2012-09-01 | 2019-08-27 | Chevron Usa Inc | sistema de controle de poço, bop a laser e conjunto de bop |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
US9701564B2 (en) | 2013-01-15 | 2017-07-11 | Corning Incorporated | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles |
US9085050B1 (en) | 2013-03-15 | 2015-07-21 | Foro Energy, Inc. | High power laser fluid jets and beam paths using deuterium oxide |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9687936B2 (en) | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US20150165563A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
JP2017510535A (ja) * | 2014-01-27 | 2017-04-13 | コーニング インコーポレイテッド | レーザ切断済みガラスを機械的に加工することによる縁部面取り |
EP3166895B1 (de) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Verfahren und vorrichtung zur laserbearbeitung von materialien |
WO2016007843A1 (en) * | 2014-07-11 | 2016-01-14 | Corning Incorporated | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles |
JP2017530867A (ja) | 2014-07-14 | 2017-10-19 | コーニング インコーポレイテッド | 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法 |
US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
CN105481236A (zh) * | 2014-07-14 | 2016-04-13 | 康宁股份有限公司 | 用于切割叠层结构的系统和方法 |
CN107073641B (zh) * | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
EP3169635B1 (de) | 2014-07-14 | 2022-11-23 | Corning Incorporated | Verfahren und system zur herstellung von perforationen |
US9617180B2 (en) | 2014-07-14 | 2017-04-11 | Corning Incorporated | Methods and apparatuses for fabricating glass articles |
DE102014213775B4 (de) * | 2014-07-15 | 2018-02-15 | Innolas Solutions Gmbh | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
WO2016115017A1 (en) | 2015-01-12 | 2016-07-21 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
WO2016154284A1 (en) | 2015-03-24 | 2016-09-29 | Corning Incorporated | Laser cutting and processing of display glass compositions |
WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
KR102499697B1 (ko) | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US11253955B2 (en) | 2016-06-14 | 2022-02-22 | Evana Technologies, Uab | Multi-segment focusing lens and the laser processing for wafer dicing or cutting |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
WO2018022476A1 (en) | 2016-07-29 | 2018-02-01 | Corning Incorporated | Apparatuses and methods for laser processing |
JP2019532908A (ja) | 2016-08-30 | 2019-11-14 | コーニング インコーポレイテッド | 強度マッピング光学システムによる材料のレーザー切断 |
JP6923284B2 (ja) | 2016-09-30 | 2021-08-18 | コーニング インコーポレイテッド | 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法 |
JP7066701B2 (ja) | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
CN106695117A (zh) * | 2017-02-13 | 2017-05-24 | 武汉澳谱激光科技有限公司 | 一种实现轴向均匀线焦斑的光学器件 |
US20180257170A1 (en) | 2017-03-13 | 2018-09-13 | Coherent Lasersystems Gmbh & Co. Kg | Controlled separation of laser processed brittle material |
DE102017208290A1 (de) | 2017-05-17 | 2018-11-22 | Schott Ag | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie |
WO2018210519A1 (de) | 2017-05-19 | 2018-11-22 | Schott Ag | Bauteil, umfassend glas oder glaskeramik, mit entlang einer vorgegebenen trennlinie angeordneten vorschädigungen, verfahren und vorrichtung zur herstellung des bauteils und dessen verwendung |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
CN107695544A (zh) * | 2017-10-24 | 2018-02-16 | 袁卉 | 激光打孔方法及装置 |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
TW202023735A (zh) * | 2018-11-13 | 2020-07-01 | 香港商準晶科技有限公司 | 用於切割透明和半透明基板的基於激光的系統 |
CN110435160A (zh) * | 2019-09-09 | 2019-11-12 | 广东利元亨智能装备股份有限公司 | 一种激光焊接头及激光焊接方法 |
CN113634874B (zh) * | 2021-09-23 | 2023-03-14 | 山东理工大学 | 多聚焦点透镜大功率水导激光水光耦合装置 |
CN113634921B (zh) * | 2021-09-23 | 2023-01-03 | 山东理工大学 | 多焦点聚焦透镜大功率无气爆水导激光水光耦合对准切割头 |
CN113634930B (zh) * | 2021-09-23 | 2023-01-31 | 山东理工大学 | 水导激光水光耦合变曲率聚焦光柱透镜 |
CN114670288B (zh) * | 2022-03-08 | 2023-08-15 | 海目星激光科技集团股份有限公司 | 超声波裂片方法及裂片装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1946088A (en) * | 1930-07-24 | 1934-02-06 | Rca Corp | Condensing lens system for motion picture projection |
US3004470A (en) * | 1956-07-28 | 1961-10-17 | Zeiss Ikon A G Stuttgart | Multiple focal length lens |
FR1550406A (de) * | 1967-11-08 | 1968-12-20 | ||
DK168593B1 (da) * | 1985-05-09 | 1994-05-02 | Aga Ab | Fremgangsmåde ved laserskæring af metalliske emner |
IT1261304B (it) * | 1993-06-21 | 1996-05-14 | Lara Consultants Srl | Processo di taglio mediante un fascio laser |
US5521352A (en) * | 1993-09-23 | 1996-05-28 | Laser Machining, Inc. | Laser cutting apparatus |
JPH08108289A (ja) * | 1994-10-07 | 1996-04-30 | Sumitomo Electric Ind Ltd | レーザ加工用光学装置 |
US5843626A (en) * | 1995-04-19 | 1998-12-01 | Pioneer Video Corporation | Method for manufacturing a master disc for optical discs |
US5715031A (en) * | 1995-05-04 | 1998-02-03 | Johnson & Johnson Vision Products, Inc. | Concentric aspheric multifocal lens designs |
GB9516099D0 (en) * | 1995-08-05 | 1995-10-04 | Boc Group Plc | Laser cutting of materials |
DK109197A (da) * | 1996-09-30 | 1998-03-31 | Force Instituttet | Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle |
US5995292A (en) * | 1998-06-16 | 1999-11-30 | Siros Technologies, Inc. | Apparatus for adjustable spherical aberration correction |
US6246524B1 (en) * | 1998-07-13 | 2001-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device |
US6545807B2 (en) * | 1999-12-28 | 2003-04-08 | Pentax Corporation | Refractive-diffractive hybrid lens |
FR2803549B1 (fr) * | 2000-01-10 | 2002-03-29 | Air Liquide | Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale |
US6927922B2 (en) * | 2001-12-18 | 2005-08-09 | The University Of Rochester | Imaging using a multifocal aspheric lens to obtain extended depth of field |
-
2003
- 2003-05-22 FR FR0306155A patent/FR2855084A1/fr active Pending
-
2004
- 2004-05-12 AT AT04291208T patent/ATE401989T1/de not_active IP Right Cessation
- 2004-05-12 DE DE602004015192T patent/DE602004015192D1/de not_active Expired - Fee Related
- 2004-05-12 EP EP04291208A patent/EP1479473B1/de not_active Expired - Lifetime
- 2004-05-21 CN CNA2004100424433A patent/CN1573364A/zh active Pending
- 2004-05-21 JP JP2004151962A patent/JP2004348137A/ja not_active Withdrawn
- 2004-05-21 CA CA002469861A patent/CA2469861A1/fr not_active Abandoned
- 2004-05-21 US US10/851,431 patent/US20050024743A1/en not_active Abandoned
- 2004-05-24 BR BR0401806-0A patent/BRPI0401806A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2855084A1 (fr) | 2004-11-26 |
EP1479473B1 (de) | 2008-07-23 |
CN1573364A (zh) | 2005-02-02 |
CA2469861A1 (fr) | 2004-11-22 |
BRPI0401806A (pt) | 2005-01-18 |
JP2004348137A (ja) | 2004-12-09 |
US20050024743A1 (en) | 2005-02-03 |
ATE401989T1 (de) | 2008-08-15 |
EP1479473A1 (de) | 2004-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |