BRPI0401806A - Componente óptico que pode ser utilizado para o corte a laser de um material e processo utilizando o mesmo - Google Patents

Componente óptico que pode ser utilizado para o corte a laser de um material e processo utilizando o mesmo

Info

Publication number
BRPI0401806A
BRPI0401806A BR0401806-0A BRPI0401806A BRPI0401806A BR PI0401806 A BRPI0401806 A BR PI0401806A BR PI0401806 A BRPI0401806 A BR PI0401806A BR PI0401806 A BRPI0401806 A BR PI0401806A
Authority
BR
Brazil
Prior art keywords
same
optical component
laser cutting
optical unit
line segment
Prior art date
Application number
BR0401806-0A
Other languages
English (en)
Inventor
Frederic Camy-Peyret
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of BRPI0401806A publication Critical patent/BRPI0401806A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

"COMPONENTE óPTICO QUE PODE SER UTILIZADO PARA O CORTE A LASER DE UM MATERIAL E PROCESSO UTILIZANDO O MESMO". A invenção relaciona-se a um componente óptico (21), que pode ser utilizado para o corte a laser de um material (26), que compreende pelo menos uma superfície refrativa esférica (22) com o formato para focalizar os raios (30) do feixe incidente sobre um segmento de linha reta (25) situado no eixo óptico (29) do componente óptico (21). O componente óptico (21) é do tipo transmissivo (21) ou do tipo refletivo. Por exemplo, o elemento óptico é formado por uma lente (21) cuja superfície refrativa esférica (22) é definida por um raio de curvatura (24) que varia continuamente com a distância do eixo óptico (29) da lente. O feixe de laser é auxiliado por um gás auxiliar que contém pelo menos um componente escolhido de nitrogênio, oxigênio, hélio, argónio e misturas destes.
BR0401806-0A 2003-05-22 2004-05-24 Componente óptico que pode ser utilizado para o corte a laser de um material e processo utilizando o mesmo BRPI0401806A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0306155A FR2855084A1 (fr) 2003-05-22 2003-05-22 Optique de focalisation pour le coupage laser

Publications (1)

Publication Number Publication Date
BRPI0401806A true BRPI0401806A (pt) 2005-01-18

Family

ID=33042016

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0401806-0A BRPI0401806A (pt) 2003-05-22 2004-05-24 Componente óptico que pode ser utilizado para o corte a laser de um material e processo utilizando o mesmo

Country Status (9)

Country Link
US (1) US20050024743A1 (pt)
EP (1) EP1479473B1 (pt)
JP (1) JP2004348137A (pt)
CN (1) CN1573364A (pt)
AT (1) ATE401989T1 (pt)
BR (1) BRPI0401806A (pt)
CA (1) CA2469861A1 (pt)
DE (1) DE602004015192D1 (pt)
FR (1) FR2855084A1 (pt)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004101512A2 (en) * 2003-05-13 2004-11-25 Smithkline Beecham Corporation Naphthyridine integrase inhibitors
FR2880566A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec une lentille revetue de baf2
FR2880567B1 (fr) * 2005-01-12 2007-02-23 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur
FR2880568B1 (fr) * 2005-01-12 2007-03-30 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur
CN102009270B (zh) * 2005-06-27 2013-03-06 日东电工株式会社 激光材料加工用表面保护片
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
EP1815937A1 (fr) * 2006-02-07 2007-08-08 Air Liquide Espana SA Procédé de coupage par faisceau laser d'une pièce en titane à l'aide d'un mélange gazeux Ar/He
DE102007024701A1 (de) 2007-05-25 2008-11-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
US9664012B2 (en) 2008-08-20 2017-05-30 Foro Energy, Inc. High power laser decomissioning of multistring and damaged wells
US9669492B2 (en) 2008-08-20 2017-06-06 Foro Energy, Inc. High power laser offshore decommissioning tool, system and methods of use
US9719302B2 (en) 2008-08-20 2017-08-01 Foro Energy, Inc. High power laser perforating and laser fracturing tools and methods of use
US8624155B1 (en) * 2009-05-12 2014-01-07 Vinyl Technologies, Inc. Apparatus for scribing thin films in photovoltaic cells
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
US8000212B2 (en) * 2009-12-15 2011-08-16 Cymer, Inc. Metrology for extreme ultraviolet light source
JP5737900B2 (ja) * 2010-10-15 2015-06-17 三菱重工業株式会社 レーザ加工装置及びレーザ加工方法
RU2459690C1 (ru) * 2011-01-17 2012-08-27 Открытое акционерное общество "Машиностроительный завод" Способ лазерного раскроя металлического листового материала
CN102230983A (zh) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 用于激光加工的光学元件及激光加工设备
TW201343296A (zh) * 2012-03-16 2013-11-01 Ipg Microsystems Llc 使一工件中具有延伸深度虛飾之雷射切割系統及方法
BR112015004458A8 (pt) 2012-09-01 2019-08-27 Chevron Usa Inc sistema de controle de poço, bop a laser e conjunto de bop
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
US9085050B1 (en) 2013-03-15 2015-07-21 Foro Energy, Inc. High power laser fluid jets and beam paths using deuterium oxide
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150165563A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP2017510535A (ja) * 2014-01-27 2017-04-13 コーニング インコーポレイテッド レーザ切断済みガラスを機械的に加工することによる縁部面取り
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016007843A1 (en) * 2014-07-11 2016-01-14 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
JP2017530867A (ja) 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
CN105481236A (zh) * 2014-07-14 2016-04-13 康宁股份有限公司 用于切割叠层结构的系统和方法
CN107073641B (zh) * 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
DE102014213775B4 (de) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
KR102499697B1 (ko) 2015-07-10 2023-02-14 코닝 인코포레이티드 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US11253955B2 (en) 2016-06-14 2022-02-22 Evana Technologies, Uab Multi-segment focusing lens and the laser processing for wafer dicing or cutting
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106695117A (zh) * 2017-02-13 2017-05-24 武汉澳谱激光科技有限公司 一种实现轴向均匀线焦斑的光学器件
US20180257170A1 (en) 2017-03-13 2018-09-13 Coherent Lasersystems Gmbh & Co. Kg Controlled separation of laser processed brittle material
DE102017208290A1 (de) 2017-05-17 2018-11-22 Schott Ag Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie
WO2018210519A1 (de) 2017-05-19 2018-11-22 Schott Ag Bauteil, umfassend glas oder glaskeramik, mit entlang einer vorgegebenen trennlinie angeordneten vorschädigungen, verfahren und vorrichtung zur herstellung des bauteils und dessen verwendung
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
CN107695544A (zh) * 2017-10-24 2018-02-16 袁卉 激光打孔方法及装置
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
TW202023735A (zh) * 2018-11-13 2020-07-01 香港商準晶科技有限公司 用於切割透明和半透明基板的基於激光的系統
CN110435160A (zh) * 2019-09-09 2019-11-12 广东利元亨智能装备股份有限公司 一种激光焊接头及激光焊接方法
CN113634874B (zh) * 2021-09-23 2023-03-14 山东理工大学 多聚焦点透镜大功率水导激光水光耦合装置
CN113634921B (zh) * 2021-09-23 2023-01-03 山东理工大学 多焦点聚焦透镜大功率无气爆水导激光水光耦合对准切割头
CN113634930B (zh) * 2021-09-23 2023-01-31 山东理工大学 水导激光水光耦合变曲率聚焦光柱透镜
CN114670288B (zh) * 2022-03-08 2023-08-15 海目星激光科技集团股份有限公司 超声波裂片方法及裂片装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1946088A (en) * 1930-07-24 1934-02-06 Rca Corp Condensing lens system for motion picture projection
US3004470A (en) * 1956-07-28 1961-10-17 Zeiss Ikon A G Stuttgart Multiple focal length lens
FR1550406A (pt) * 1967-11-08 1968-12-20
DK168593B1 (da) * 1985-05-09 1994-05-02 Aga Ab Fremgangsmåde ved laserskæring af metalliske emner
IT1261304B (it) * 1993-06-21 1996-05-14 Lara Consultants Srl Processo di taglio mediante un fascio laser
US5521352A (en) * 1993-09-23 1996-05-28 Laser Machining, Inc. Laser cutting apparatus
JPH08108289A (ja) * 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd レーザ加工用光学装置
US5843626A (en) * 1995-04-19 1998-12-01 Pioneer Video Corporation Method for manufacturing a master disc for optical discs
US5715031A (en) * 1995-05-04 1998-02-03 Johnson & Johnson Vision Products, Inc. Concentric aspheric multifocal lens designs
GB9516099D0 (en) * 1995-08-05 1995-10-04 Boc Group Plc Laser cutting of materials
DK109197A (da) * 1996-09-30 1998-03-31 Force Instituttet Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle
US5995292A (en) * 1998-06-16 1999-11-30 Siros Technologies, Inc. Apparatus for adjustable spherical aberration correction
US6246524B1 (en) * 1998-07-13 2001-06-12 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
US6545807B2 (en) * 1999-12-28 2003-04-08 Pentax Corporation Refractive-diffractive hybrid lens
FR2803549B1 (fr) * 2000-01-10 2002-03-29 Air Liquide Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale
US6927922B2 (en) * 2001-12-18 2005-08-09 The University Of Rochester Imaging using a multifocal aspheric lens to obtain extended depth of field

Also Published As

Publication number Publication date
FR2855084A1 (fr) 2004-11-26
EP1479473B1 (fr) 2008-07-23
CN1573364A (zh) 2005-02-02
DE602004015192D1 (de) 2008-09-04
CA2469861A1 (fr) 2004-11-22
JP2004348137A (ja) 2004-12-09
US20050024743A1 (en) 2005-02-03
ATE401989T1 (de) 2008-08-15
EP1479473A1 (fr) 2004-11-24

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