DE602004005862D1 - Verfahren zum trennen einer nützlichen schicht und durch das verfahren erhaltene komponente - Google Patents

Verfahren zum trennen einer nützlichen schicht und durch das verfahren erhaltene komponente

Info

Publication number
DE602004005862D1
DE602004005862D1 DE602004005862T DE602004005862T DE602004005862D1 DE 602004005862 D1 DE602004005862 D1 DE 602004005862D1 DE 602004005862 T DE602004005862 T DE 602004005862T DE 602004005862 T DE602004005862 T DE 602004005862T DE 602004005862 D1 DE602004005862 D1 DE 602004005862D1
Authority
DE
Germany
Prior art keywords
sacrificial layer
disconnecting
useful layer
component obtained
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004005862T
Other languages
English (en)
Other versions
DE602004005862T2 (de
Inventor
Hubert Grange
Bernard Diem
Bosson Yylvie Viollet
Michel Borel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602004005862D1 publication Critical patent/DE602004005862D1/de
Application granted granted Critical
Publication of DE602004005862T2 publication Critical patent/DE602004005862T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/115—Roughening a surface
DE602004005862T 2003-07-04 2004-07-01 Verfahren zum trennen einer nützlichen schicht und durch das verfahren erhaltene komponente Active DE602004005862T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0308157A FR2857002B1 (fr) 2003-07-04 2003-07-04 Procede de desolidarisation d'une couche utile et composant obtenu par ce procede
FR0308157 2003-07-04
PCT/FR2004/001699 WO2005012160A2 (fr) 2003-07-04 2004-07-01 Procede de desolidarisation d’une couche utile et composant obtenu par ce procede

Publications (2)

Publication Number Publication Date
DE602004005862D1 true DE602004005862D1 (de) 2007-05-24
DE602004005862T2 DE602004005862T2 (de) 2008-01-17

Family

ID=33522751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005862T Active DE602004005862T2 (de) 2003-07-04 2004-07-01 Verfahren zum trennen einer nützlichen schicht und durch das verfahren erhaltene komponente

Country Status (7)

Country Link
US (1) US7569152B2 (de)
EP (1) EP1641709B1 (de)
JP (1) JP2007525330A (de)
AT (1) ATE359230T1 (de)
DE (1) DE602004005862T2 (de)
FR (1) FR2857002B1 (de)
WO (1) WO2005012160A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4559273B2 (ja) * 2005-03-30 2010-10-06 シチズンファインテックミヨタ株式会社 アクチュエータの製造方法
JP5178026B2 (ja) * 2006-03-10 2013-04-10 株式会社半導体エネルギー研究所 微小構造体、半導体装置、及び微小構造体の作製方法
FR2925889B1 (fr) * 2007-12-27 2010-01-29 Commissariat Energie Atomique Procede de realisation d'un dispositif micromecanique et/ou nanomecanique a butees anti-collage

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783237A (en) * 1983-12-01 1988-11-08 Harry E. Aine Solid state transducer and method of making same
US4662746A (en) * 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
DE69105809T2 (de) * 1990-05-10 1995-05-11 Yokogawa Electric Corp Druckaufnehmer mit schwingendem Element.
FR2700065B1 (fr) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant.
FR2700003B1 (fr) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Procédé de fabrication d'un capteur de pression utilisant la technologie silicium sur isolant et capteur obtenu.
DE4331798B4 (de) * 1993-09-18 2004-08-26 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanischen Bauelementen
US5914507A (en) * 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
US5489556A (en) * 1994-06-29 1996-02-06 United Microelectronics Corp. Method for the fabrication of electrostatic microswitches
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
JP3489273B2 (ja) * 1995-06-27 2004-01-19 株式会社デンソー 半導体力学量センサの製造方法
FR2736934B1 (fr) * 1995-07-21 1997-08-22 Commissariat Energie Atomique Procede de fabrication d'une structure avec une couche utile maintenue a distance d'un substrat par des butees, et de desolidarisation d'une telle couche
US5771321A (en) * 1996-01-04 1998-06-23 Massachusetts Institute Of Technology Micromechanical optical switch and flat panel display
US5898515A (en) * 1996-11-21 1999-04-27 Eastman Kodak Company Light reflecting micromachined cantilever
US6181460B1 (en) * 1998-11-18 2001-01-30 Trw Inc. Electromagnetic force controlled micromirror array
WO2002012116A2 (en) * 2000-08-03 2002-02-14 Analog Devices, Inc. Bonded wafer optical mems process
US6774010B2 (en) * 2001-01-25 2004-08-10 International Business Machines Corporation Transferable device-containing layer for silicon-on-insulator applications
JP2002323513A (ja) * 2001-02-23 2002-11-08 Fuji Electric Co Ltd 半導体デバイスおよびその製造方法
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
AU2003206552A1 (en) * 2002-02-14 2003-09-04 Silex Microsystems Ab Deflectable microstructure and method of manufacturing the same through bonding of wafers
US7018877B1 (en) * 2004-09-28 2006-03-28 Palo Alto Research Center Selective delamination of thin-films by interface adhesion energy contrasts and thin film transistor devices formed thereby
US7410882B2 (en) * 2004-09-28 2008-08-12 Palo Alto Research Center Incorporated Method of manufacturing and structure of polycrystalline semiconductor thin-film heterostructures on dissimilar substrates
US7956428B2 (en) * 2005-08-16 2011-06-07 Robert Bosch Gmbh Microelectromechanical devices and fabrication methods
EP1760037A1 (de) * 2005-09-06 2007-03-07 Infineon Technologies SensoNor AS Verfahren zum Herstellen von mikromechanischen Strukturen

Also Published As

Publication number Publication date
WO2005012160A3 (fr) 2005-06-09
FR2857002B1 (fr) 2005-10-21
ATE359230T1 (de) 2007-05-15
FR2857002A1 (fr) 2005-01-07
EP1641709A2 (de) 2006-04-05
EP1641709B1 (de) 2007-04-11
WO2005012160A2 (fr) 2005-02-10
JP2007525330A (ja) 2007-09-06
US7569152B2 (en) 2009-08-04
DE602004005862T2 (de) 2008-01-17
US20060144816A1 (en) 2006-07-06

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