DE60133072D1 - Unterwasservorrichtung und Unterwasserverfahren zur Laserbehandlung - Google Patents

Unterwasservorrichtung und Unterwasserverfahren zur Laserbehandlung

Info

Publication number
DE60133072D1
DE60133072D1 DE60133072T DE60133072T DE60133072D1 DE 60133072 D1 DE60133072 D1 DE 60133072D1 DE 60133072 T DE60133072 T DE 60133072T DE 60133072 T DE60133072 T DE 60133072T DE 60133072 D1 DE60133072 D1 DE 60133072D1
Authority
DE
Germany
Prior art keywords
underwater
laser treatment
underwater device
laser
underwater method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60133072T
Other languages
English (en)
Other versions
DE60133072T2 (de
Inventor
Masataka Tamura
Seiichiro Kimura
Yuuichi Motora
Hidenori Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE60133072D1 publication Critical patent/DE60133072D1/de
Application granted granted Critical
Publication of DE60133072T2 publication Critical patent/DE60133072T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE60133072T 2000-09-28 2001-09-26 Unterwasservorrichtung und Unterwasserverfahren zur Laserbehandlung Expired - Lifetime DE60133072T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000295818 2000-09-28
JP2000295818A JP4155489B2 (ja) 2000-09-28 2000-09-28 水中レーザ補修溶接装置

Publications (2)

Publication Number Publication Date
DE60133072D1 true DE60133072D1 (de) 2008-04-17
DE60133072T2 DE60133072T2 (de) 2009-02-26

Family

ID=18778187

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60133072T Expired - Lifetime DE60133072T2 (de) 2000-09-28 2001-09-26 Unterwasservorrichtung und Unterwasserverfahren zur Laserbehandlung

Country Status (4)

Country Link
US (2) US6946618B2 (de)
EP (1) EP1199127B1 (de)
JP (1) JP4155489B2 (de)
DE (1) DE60133072T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826893B1 (fr) * 2001-07-05 2003-09-19 Snecma Moteurs Appareil de soudage par faisceau laser miniaturise
US7030337B2 (en) * 2003-12-19 2006-04-18 Honeywell International, Inc. Hand-held laser welding wand having removable filler media delivery extension tips
JP4383920B2 (ja) * 2004-02-16 2009-12-16 株式会社東芝 炉内保全・補修装置
FR2876933B1 (fr) * 2004-10-25 2008-05-09 Snecma Moteurs Sa Buse pour tete de percage ou d'usinage par faisceau laser
JP4585305B2 (ja) * 2004-12-24 2010-11-24 三菱重工業株式会社 欠損部の再生方法及び装置
JP4846392B2 (ja) * 2006-02-28 2011-12-28 株式会社東芝 水中補修溶接方法
US7835221B2 (en) 2006-07-06 2010-11-16 Westerngeco L.L.C. Optical methods and systems in marine seismic surveying
DE602006007580D1 (de) * 2006-08-07 2009-08-13 Lvd Co Anordnung und Verfahren zur On-Line-Überwachung des Laserprozesses eines Werkstückes unter Verwendung eines Wärmekameradetektors und eines Schiefspiegels
US7611421B2 (en) * 2007-02-08 2009-11-03 Samuel Brewer Golf club handgrip elevation apparatus
US7676327B2 (en) 2007-04-26 2010-03-09 Westerngeco L.L.C. Method for optimal wave field separation
KR101213613B1 (ko) 2008-04-14 2012-12-18 가부시끼가이샤 도시바 레이저 용접 장치 및 레이저 용접 방법
US9207347B2 (en) * 2008-07-05 2015-12-08 Westerngeco L.L.C. Determining the structure of a towed seismic spread element
JP5997965B2 (ja) * 2011-08-09 2016-09-28 株式会社アマダホールディングス レーザ加工ヘッド
JP5767900B2 (ja) * 2011-08-24 2015-08-26 株式会社東芝 水中溶接装置及び方法
US10307864B2 (en) * 2013-12-13 2019-06-04 Avonisys Ag Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing
US11344975B2 (en) 2015-04-09 2022-05-31 Siemens Energy, Inc. Optically conductive filler for laser processing
US10307803B2 (en) * 2016-07-20 2019-06-04 The United States Of America As Represented By Secretary Of The Navy Transmission window cleanliness for directed energy devices
KR102075731B1 (ko) * 2018-09-27 2020-02-10 한국기계연구원 레이저 제염 시스템

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632955A (en) * 1967-08-31 1972-01-04 Western Electric Co Simultaneous multiple lead bonding
US4151393A (en) * 1978-02-13 1979-04-24 The United States Of America As Represented By The Secretary Of The Navy Laser pile cutter
DE3855021T2 (de) * 1987-04-13 1996-07-18 Nec Corp Optisches Ausrichtungssystem
DE4402000C2 (de) * 1994-01-25 1996-04-11 Fraunhofer Ges Forschung Düsenanordnung für das Laserstrahlschneiden
DE4433675A1 (de) * 1994-09-21 1996-03-28 Fraunhofer Ges Forschung Kompakter Laserbearbeitungskopf zur Lasermaterialbearbeitung
JP3119090B2 (ja) * 1994-10-05 2000-12-18 株式会社日立製作所 水中レーザ加工装置及びその装置を用いた水中施工方法
US5790620A (en) * 1995-01-31 1998-08-04 Kabushiki Kaisha Toshiba Underwater laser processing method and apparatus
DE19519725C2 (de) * 1995-05-30 1997-07-03 Geesthacht Gkss Forschung Vorrichtung zum Schweißen und/oder Behandeln von Werkstücken mittels Laserlicht im Wasser
JP3621753B2 (ja) 1995-06-27 2005-02-16 石川島播磨重工業株式会社 水中レーザ溶接装置
JP3619286B2 (ja) * 1995-06-27 2005-02-09 石川島播磨重工業株式会社 水中レーザ溶接装置
TW320586B (de) * 1995-11-24 1997-11-21 Hitachi Ltd
US6060686A (en) * 1996-10-15 2000-05-09 General Electric Company Underwater laser welding nozzle
JPH10180478A (ja) 1996-12-25 1998-07-07 Miyota Co Ltd 溶接方法及び表面実装型部品
JPH10180476A (ja) 1996-12-26 1998-07-07 Ishikawajima Harima Heavy Ind Co Ltd 水中レーザトーチ
JP2000153382A (ja) * 1998-11-16 2000-06-06 Toshiba Corp レーザ加工装置
JP3385361B2 (ja) * 2000-05-09 2003-03-10 北海道大学長 レーザ溶接方法及びレーザ溶接装置

Also Published As

Publication number Publication date
US7759601B2 (en) 2010-07-20
US20040149707A1 (en) 2004-08-05
EP1199127B1 (de) 2008-03-05
US6946618B2 (en) 2005-09-20
US20020036190A1 (en) 2002-03-28
EP1199127A3 (de) 2003-10-29
JP4155489B2 (ja) 2008-09-24
EP1199127A2 (de) 2002-04-24
DE60133072T2 (de) 2009-02-26
JP2002103077A (ja) 2002-04-09

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