DE60131193D1 - Kopplungseinrichtung mit innenkondensatoren in einem mehrschichtsubstrat - Google Patents

Kopplungseinrichtung mit innenkondensatoren in einem mehrschichtsubstrat

Info

Publication number
DE60131193D1
DE60131193D1 DE60131193T DE60131193T DE60131193D1 DE 60131193 D1 DE60131193 D1 DE 60131193D1 DE 60131193 T DE60131193 T DE 60131193T DE 60131193 T DE60131193 T DE 60131193T DE 60131193 D1 DE60131193 D1 DE 60131193D1
Authority
DE
Germany
Prior art keywords
coupling device
capacitor
substrate
performance
multilayer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60131193T
Other languages
English (en)
Other versions
DE60131193T2 (de
Inventor
Sarmad Al-Taei
George Passiopoulos
Mahmoud Zadeh
Kevin Lamacraft
Phil Lane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj filed Critical Nokia Oyj
Publication of DE60131193D1 publication Critical patent/DE60131193D1/de
Application granted granted Critical
Publication of DE60131193T2 publication Critical patent/DE60131193T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187—Broadside coupled lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)
  • Waveguides (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE60131193T 2001-02-28 2001-02-28 Kopplungseinrichtung mit innenkondensatoren in einem mehrschichtsubstrat Expired - Lifetime DE60131193T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2001/002249 WO2002069440A1 (en) 2001-02-28 2001-02-28 Coupling device using buried capacitors in multilayered substrate

Publications (2)

Publication Number Publication Date
DE60131193D1 true DE60131193D1 (de) 2007-12-13
DE60131193T2 DE60131193T2 (de) 2008-08-07

Family

ID=8164316

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131193T Expired - Lifetime DE60131193T2 (de) 2001-02-28 2001-02-28 Kopplungseinrichtung mit innenkondensatoren in einem mehrschichtsubstrat

Country Status (6)

Country Link
US (1) US7034633B2 (de)
EP (1) EP1366539B1 (de)
CN (1) CN1257575C (de)
AT (1) ATE377261T1 (de)
DE (1) DE60131193T2 (de)
WO (1) WO2002069440A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1543580A1 (de) 2002-09-27 2005-06-22 Nokia Corporation Kopplungsvorrichtung
US6825738B2 (en) * 2002-12-18 2004-11-30 Analog Devices, Inc. Reduced size microwave directional coupler
US7026884B2 (en) 2002-12-27 2006-04-11 Nokia Corporation High frequency component
US7187062B2 (en) * 2004-04-14 2007-03-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Coupler detector
DE102005016054A1 (de) * 2005-04-07 2006-10-12 Kathrein-Werke Kg Hochfrequenzkoppler oder Leistungsteiler, insbesondere schmalbandiger und/oder 3dB-Koppler oder Leistungsteiler
US20070120620A1 (en) * 2005-05-16 2007-05-31 Anaren, Inc. Tunable surface mount ceramic coupler
US7428136B2 (en) * 2005-08-06 2008-09-23 Geomat Insights, Llc Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
US20070153490A1 (en) * 2005-12-30 2007-07-05 Benham John R Methods and apparatus for electromagnetically sampling signals using socket-package interface based interposer
US7570493B2 (en) * 2006-11-16 2009-08-04 Sony Ericsson Mobile Communications Printed circuit board with embedded circuit component
US7564325B2 (en) * 2007-02-15 2009-07-21 Fairchiled Semiconductor Corporation High directivity ultra-compact coupler
US8058946B2 (en) * 2008-05-29 2011-11-15 Raytheon Company Circuit module with non-contacting microwave interlayer interconnect
WO2010088373A2 (en) * 2009-01-29 2010-08-05 Emwavedev Inductive coupling in a transverse electromagnetic mode
US7961064B2 (en) * 2009-01-30 2011-06-14 Tdk Corporation Directional coupler including impedance matching and impedance transforming attenuator
JP5518210B2 (ja) 2009-12-15 2014-06-11 エプコス アクチエンゲゼルシャフト 結合器および増幅器機構
KR101119910B1 (ko) * 2010-05-03 2012-02-29 한국과학기술원 모바일 ｒｆｉｄ 리더 송수신 시스템
US9240623B2 (en) * 2011-04-11 2016-01-19 Lockheed Martin Corporation Wide-band microwave hybrid coupler with arbitrary phase shifts and power splits
US20130207741A1 (en) * 2012-02-13 2013-08-15 Qualcomm Incorporated Programmable directional coupler
US9270002B2 (en) * 2013-07-22 2016-02-23 Raytheon Company Differential-to-single-ended transmission line interface
JP6217544B2 (ja) * 2013-10-22 2017-10-25 株式会社村田製作所 方向性結合器
US20170179564A1 (en) * 2015-12-16 2017-06-22 Raytheon Company Electromagnetic directional coupler
US10084224B2 (en) * 2016-04-29 2018-09-25 Skyworks Solutions, Inc. Compensated electromagnetic coupler
WO2018212270A1 (ja) * 2017-05-19 2018-11-22 株式会社村田製作所 方向性結合器および高周波モジュール
CN107240754A (zh) * 2017-08-02 2017-10-10 河北省世纪吉星电子科技有限公司 90°带状线电桥和微波集成电路
FR3089341B1 (fr) * 2018-12-03 2022-04-22 Psa Automobiles Sa Dispositif de couplage à pièces assurant un couplage entre une liaison électrique et un élément conducteur
JP2022043432A (ja) * 2020-09-04 2022-03-16 株式会社村田製作所 方向性結合器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3593208A (en) * 1969-03-17 1971-07-13 Bell Telephone Labor Inc Microwave quadrature coupler having lumped-element capacitors
US5281929A (en) * 1992-03-05 1994-01-25 Itt Corporation Microstrip twisted broadside coupler apparatus
EP0585469B1 (de) * 1992-03-19 1998-11-04 TDK Corporation Hybrider koppler
US5745017A (en) * 1995-01-03 1998-04-28 Rf Prime Corporation Thick film construct for quadrature translation of RF signals
KR20000034924A (ko) * 1998-11-17 2000-06-26 제닌 엠. 데이비스 저온 동시소성 다층세라믹내 수동 전자소자들
US6819200B2 (en) * 2002-07-26 2004-11-16 Freescale Semiconductor, Inc. Broadband balun and impedance transformer for push-pull amplifiers

Also Published As

Publication number Publication date
ATE377261T1 (de) 2007-11-15
WO2002069440A1 (en) 2002-09-06
US7034633B2 (en) 2006-04-25
DE60131193T2 (de) 2008-08-07
CN1493093A (zh) 2004-04-28
US20040113717A1 (en) 2004-06-17
EP1366539A1 (de) 2003-12-03
CN1257575C (zh) 2006-05-24
EP1366539B1 (de) 2007-10-31

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