DE60130171D1 - Kühlung für eine elektronische Anlage - Google Patents

Kühlung für eine elektronische Anlage

Info

Publication number
DE60130171D1
DE60130171D1 DE60130171T DE60130171T DE60130171D1 DE 60130171 D1 DE60130171 D1 DE 60130171D1 DE 60130171 T DE60130171 T DE 60130171T DE 60130171 T DE60130171 T DE 60130171T DE 60130171 D1 DE60130171 D1 DE 60130171D1
Authority
DE
Germany
Prior art keywords
cooling air
air
accumulation
housing
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130171T
Other languages
English (en)
Other versions
DE60130171T2 (de
Inventor
William David Jeakins
William Joseph Michael Moizer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Canada Inc
Original Assignee
Alcatel Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Canada Inc filed Critical Alcatel Canada Inc
Publication of DE60130171D1 publication Critical patent/DE60130171D1/de
Application granted granted Critical
Publication of DE60130171T2 publication Critical patent/DE60130171T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
DE60130171T 2000-06-12 2001-04-24 Kühlung für eine elektronische Anlage Expired - Lifetime DE60130171T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/591,487 US6538881B1 (en) 2000-06-12 2000-06-12 Cooling of electronic equipment
US591487 2009-11-20

Publications (2)

Publication Number Publication Date
DE60130171D1 true DE60130171D1 (de) 2007-10-11
DE60130171T2 DE60130171T2 (de) 2008-05-21

Family

ID=24366677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60130171T Expired - Lifetime DE60130171T2 (de) 2000-06-12 2001-04-24 Kühlung für eine elektronische Anlage

Country Status (4)

Country Link
US (1) US6538881B1 (de)
EP (1) EP1164825B1 (de)
AT (1) ATE372044T1 (de)
DE (1) DE60130171T2 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1267598B1 (de) * 2001-06-13 2008-02-06 Fujikura, Ltd. Einrichtung zur Kühlung einer elektronischen Anlage
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US6646867B1 (en) * 2002-05-07 2003-11-11 Hewlett-Packard Development Company, Lp. Apparatus for flame containment in electronic devices
US6768640B2 (en) * 2002-06-28 2004-07-27 Sun Microsystems, Inc. Computer system employing redundant cooling fans
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
KR100490158B1 (ko) * 2002-12-14 2005-05-16 엘지전자 주식회사 냉각 팬용 백 커버구조
US7016193B1 (en) * 2003-09-16 2006-03-21 Cisco Technology, Inc. High efficiency counter-flow shelf cooling system
US6896612B1 (en) * 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US20050276017A1 (en) * 2004-06-10 2005-12-15 Farid Aziz Common plenum and air intake airflow management for telecom equipment
DE102005009109A1 (de) * 2005-02-28 2006-09-14 Siemens Ag Belüftungsanordnung
DE102005009078A1 (de) * 2005-02-28 2006-09-07 Siemens Ag Baugruppenträgeranordnung
DE102005009074A1 (de) * 2005-02-28 2006-09-07 Siemens Ag Lüftersystem
DE102005009076B4 (de) * 2005-02-28 2008-04-03 Nokia Siemens Networks Gmbh & Co.Kg Kühlanordnung
US7762373B2 (en) * 2005-05-25 2010-07-27 Sony Corporation Fan noise control apparatus
US7573713B2 (en) * 2005-09-13 2009-08-11 Pacific Star Communications High velocity air cooling for electronic equipment
US7535861B2 (en) * 2005-10-07 2009-05-19 Pacific Star Communications Inc. Self-contained portable broadband communication system
US7817589B2 (en) * 2006-02-21 2010-10-19 Pacific Star Communications, Inc. Self-contained portable broadband communications system
US20080005380A1 (en) * 2006-02-21 2008-01-03 Pacific Star Communications, Inc. Integrated configuration and management of hardware devices
US7929300B1 (en) * 2006-03-17 2011-04-19 Flextronics Ap, Llc Filter retention in electronics chassis
US7319596B2 (en) * 2006-03-24 2008-01-15 Fujitsu Limited Electronic apparatus
EP1871155A1 (de) * 2006-06-21 2007-12-26 Alcatel Lucent Baugruppenträger für Leiterplatten mit Kühlungsvorrichtung
DE102006033867A1 (de) * 2006-07-21 2008-01-24 Nokia Siemens Networks Gmbh & Co.Kg Lüftereinschubeinheit mit Filtermatte
JP5003875B2 (ja) * 2007-03-01 2012-08-15 日本電気株式会社 冷却機構
US9058180B2 (en) * 2009-06-29 2015-06-16 Oracle America, Inc. Unified high-frequency out-of-order pick queue with support for triggering early issue of speculative instructions
WO2011016624A2 (ko) * 2009-08-03 2011-02-10 (주)브이엘시스템 집진기능을 가지는 팬 모듈과 이에 사용되는 집진장치
JP5597957B2 (ja) * 2009-09-04 2014-10-01 富士通株式会社 データセンター、冷却システムおよびｉｔ機器の冷却方法
US9286075B2 (en) * 2009-09-30 2016-03-15 Oracle America, Inc. Optimal deallocation of instructions from a unified pick queue
US20110317351A1 (en) * 2010-06-23 2011-12-29 International Business Machines Corporation Server drawer
US8416834B2 (en) 2010-06-23 2013-04-09 International Business Machines Corporation Spread spectrum wireless communication code for data center environments
US8645606B2 (en) 2010-06-23 2014-02-04 International Business Machines Corporation Upbound input/output expansion request and response processing in a PCIe architecture
US8417911B2 (en) 2010-06-23 2013-04-09 International Business Machines Corporation Associating input/output device requests with memory associated with a logical partition
US8918573B2 (en) 2010-06-23 2014-12-23 International Business Machines Corporation Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIe) environment
US8656228B2 (en) 2010-06-23 2014-02-18 International Business Machines Corporation Memory error isolation and recovery in a multiprocessor computer system
US8677180B2 (en) 2010-06-23 2014-03-18 International Business Machines Corporation Switch failover control in a multiprocessor computer system
US8645767B2 (en) 2010-06-23 2014-02-04 International Business Machines Corporation Scalable I/O adapter function level error detection, isolation, and reporting
US8615622B2 (en) 2010-06-23 2013-12-24 International Business Machines Corporation Non-standard I/O adapters in a standardized I/O architecture
US8615586B2 (en) 2010-06-23 2013-12-24 International Business Machines Corporation Discovery of logical images at storage area network endpoints
US8671287B2 (en) 2010-06-23 2014-03-11 International Business Machines Corporation Redundant power supply configuration for a data center
US8745292B2 (en) 2010-06-23 2014-06-03 International Business Machines Corporation System and method for routing I/O expansion requests and responses in a PCIE architecture
US9175874B1 (en) 2010-09-10 2015-11-03 Chien Luen Industries Co., Ltd., Inc. 70 CFM bath ventilation fans with flush mount lights and motor beneath blower wheel
US9022846B1 (en) 2010-09-10 2015-05-05 Chien Luen Industries Co., Ltd., Inc. 110 CFM bath fan with and without light
US9097265B1 (en) 2010-09-17 2015-08-04 Chien Luen Industries Co., Ltd., Inc. 50/60 CFM bath exhaust fans with flaps/ears that allow housings to be mounted to joists
US9416989B1 (en) 2010-09-17 2016-08-16 Chien Luen Industries Co., Ltd., Inc. 80/90 CFM bath fan with telescoping side extension brackets and side by side motor and blower wheel
US8961126B1 (en) 2010-09-21 2015-02-24 Chien Luen Industries Co., Ltd., Inc. 70 CFM bath fan with recessed can and telescoping side suspension brackets
US9103104B1 (en) 2010-10-08 2015-08-11 Chien Luen Industries Co., Ltd., Inc. Bath fan and heater with cover having adjustable luver or depressible fastener and depressible release
US8634193B2 (en) * 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
EP2685798B1 (de) * 2012-07-11 2019-02-13 ABB Schweiz AG E-Raum einer Industrieanlage wie einem Containerkran, E-Raum mit einer Kühlvorrichtung
DE112012006756T5 (de) * 2012-08-02 2015-08-27 Mitsubishi Electric Corporation Wärmedissipationsplatte
CN103079387A (zh) * 2012-12-31 2013-05-01 华数传媒网络有限公司 一种集成的机架冷却系统
US9414142B1 (en) 2013-09-06 2016-08-09 Chien Luen Industries Co., Ltd., Inc. Wireless bath fan speaker
US9480149B2 (en) 2013-12-10 2016-10-25 Brocade Communications Systems, Inc. Printed circuit board with fluid flow channels
CN103687449B (zh) * 2013-12-11 2017-12-29 华为技术有限公司 电子设备和数据中心
JP6382672B2 (ja) * 2014-10-02 2018-08-29 株式会社日立産機システム パッケージ型圧縮機
US9877414B2 (en) * 2014-10-15 2018-01-23 Infinera Corporation Configurable telecommunication equipment chassis
US9949407B1 (en) * 2015-05-29 2018-04-17 Amazon Technologies, Inc. Computer system with partial bypass cooling
US11681340B2 (en) * 2020-03-17 2023-06-20 Nvidia Corporation Blow-through axial fan for a graphics processing unit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3253646A (en) * 1964-04-08 1966-05-31 Udylite Corp Cooling system for power supply apparatus
US3364838A (en) * 1966-02-01 1968-01-23 Gen Electric Cabinet for mounting, enclosing and cooling electrical apparatus
US3749981A (en) * 1971-08-23 1973-07-31 Controlled Power Corp Modular power supply with indirect water cooling
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
GB2262190B (en) * 1991-12-04 1995-09-13 Malcoe Precision Fabrications Electrical apparatus enclosure
DE4309308C1 (de) * 1993-03-23 1994-04-14 Siemens Nixdorf Inf Syst Belüftungssystem für Schränke mit stark wärmeerzeugenden elektronischen Funktionseinheiten
US6000623A (en) * 1998-01-15 1999-12-14 International Business Machines Corporation System packaging for high performance computer applications
US6086476A (en) * 1998-07-31 2000-07-11 Compaq Computer Corporation Method and apparatus for cooling and acoustic noise reduction in a computer
US5949646A (en) * 1998-07-31 1999-09-07 Sun Microsystems, Inc. Compact computer having a redundant air moving system and method thereof
US6198628B1 (en) * 1998-11-24 2001-03-06 Unisys Corporation Parallel cooling of high power devices in a serially cooled evironment
US6341064B1 (en) * 2000-03-31 2002-01-22 Alcatel Usa Sourcing, L.P. Method and apparatus for thermal management in a telecommunications equipment cabinet

Also Published As

Publication number Publication date
US6538881B1 (en) 2003-03-25
EP1164825B1 (de) 2007-08-29
ATE372044T1 (de) 2007-09-15
DE60130171T2 (de) 2008-05-21
EP1164825A2 (de) 2001-12-19
EP1164825A3 (de) 2003-10-29

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Legal Events

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8364 No opposition during term of opposition